근적외선 광 검출기 및 이를 채용한 이미지 센서, 그 반도체 제조 방법
    2.
    发明公开
    근적외선 광 검출기 및 이를 채용한 이미지 센서, 그 반도체 제조 방법 有权
    近红外光电转换器及其使用的图像传感器及其制造方法

    公开(公告)号:KR1020110093535A

    公开(公告)日:2011-08-18

    申请号:KR1020100021832

    申请日:2010-03-11

    CPC classification number: H01L31/1804 H01L31/107 Y02E10/547 Y02P70/521

    Abstract: PURPOSE: A near infrared ray detector, an image sensor using the same, and a semiconductor manufacturing method thereof are provided to form a silicon film whose thickness is 70nm, thereby obtaining a very quickly response feature. CONSTITUTION: A semiconductor area is formed on a substrate. An antenna(28) includes first and second arms on the substrate. The antenna includes the semiconductor area between the arms. First and second electrodes(30) are separated on the substrate wherein the semiconductor area is placed between the first and second electrodes. An avalanche gain is generated in the semiconductor area by applying a bias voltage to the electrodes.

    Abstract translation: 目的:提供近红外线检测器,使用其的图像传感器及其半导体制造方法,以形成厚度为70nm的硅膜,从而获得非常快的响应特征。 构成:在基板上形成半导体区域。 天线(28)包括在基板上的第一和第二臂。 天线包括臂之间的半导体区域。 在衬底上分离第一和第二电极(30),其中半导体区域位于第一和第二电极之间。 通过向电极施加偏置电压,在半导体区域中产生雪崩增益。

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