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    테스트 소자를 사용하여 반도체 패키지의 에폭시 성형화합물 및 폴리이미드막 사이의 접착력을 간접적으로테스트하는 방법
    3.
    发明公开
    테스트 소자를 사용하여 반도체 패키지의 에폭시 성형화합물 및 폴리이미드막 사이의 접착력을 간접적으로테스트하는 방법 无效
    使用测试装置在半导体封装中间接测试环氧模塑化合物与聚酰亚胺层之间的粘合力的方法

    公开(公告)号：KR1020080015642A

    公开(公告)日：2008-02-20

    申请号：KR1020060077245

    申请日：2006-08-16

    Applicant: 삼성전자주식회사

    Inventor： 윤성문 ,  김영호 ,  김재현 ,  박석봉

    IPC: H01L21/66 ,  H01L21/31

    Abstract: A method for indirectly testing adhesive force between an epoxy molding compound layer and a polyimide layer of a semiconductor package using a test device is provided to improve accuracy of an adhesive force measurement. A specific section having weak adhesive force between a main polyimide layer(14) and a main epoxy molding compound(17) in a semiconductor package(10) is detected. A test device having a dummy polymide layer and a dummy epoxy molding compound pattern contacting thereto is formed so as to have a structure identical to that of the specific section. Adhesive force between the dummy epoxy molding compound pattern and the dummy polyimide layer is measured. The dummy polyimide layer is formed on a test chip and then a test substrate is attached onto the dummy polyimide layer. The test substrate includes a window for exposing a certain region of the dummy polyimide layer. The dummy epoxy molding compound pattern covers the window.

    Abstract translation: 提供了使用测试装置间接测试环氧树脂模塑料层和半导体封装的聚酰亚胺层之间的粘合力的方法，以提高粘合力测量的精度。 检测在半导体封装（10）中的主聚酰亚胺层（14）和主环氧树脂模塑料（17）之间具有弱粘合力的特定部分。 具有虚拟聚合物层和与其接触的虚拟环氧模塑料图案的测试装置形成为具有与特定部分相同的结构。 测量虚拟环氧树脂模塑料图案和虚拟聚酰亚胺层之间的粘合力。 在测试芯片上形成虚拟聚酰亚胺层，然后将测试基板附着到虚拟聚酰亚胺层上。 测试基板包括用于暴露虚拟聚酰亚胺层的某一区域的窗口。 虚拟环氧树脂模塑复合图案覆盖窗户。

    감광성 폴리이미드막을 사용하여 반도체소자를 제조하는방법
    6.
    发明公开
    감광성 폴리이미드막을 사용하여 반도체소자를 제조하는방법 失效
    使用光敏聚酰亚胺制备半导体器件的方法，以防止由于光的异常辐照导致的光敏聚酰亚胺的暴露

    公开(公告)号：KR1020050015802A

    公开(公告)日：2005-02-21

    申请号：KR1020030054762

    申请日：2003-08-07

    Applicant: 삼성전자주식회사

    Inventor： 김재현 ,  신동원 ,  김부득 ,  이창호 ,  김원미 ,  박석봉

    IPC: H01L21/312

    CPC classification number: H01L23/3192 ,  H01L21/02118 ,  H01L21/0271 ,  H01L21/0274 ,  H01L21/312 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

    Abstract: PURPOSE: A method of fabricating a semiconductor device using a photo-sensitive polyimide layer is provided to prevent the exposure of the photo-sensitive polyimide layer due to abnormal irradiation of light by forming a photoresist layer on the photo-sensitive polyimide layer. CONSTITUTION: A photo-sensitive polyimide layer(59) is formed on an upper surface of a semiconductor substrate(51). A photoresist layer(61) is formed on an upper surface of the photo-sensitive polyimide layer. A thickness of the photoresist layer is 500 angstrom or less than 500 angstrom. An exposure process for the photoresist layer and the photo-sensitive polyimide layer is performed using a photo mask.

    Abstract translation: 目的：提供一种制造使用光敏聚酰亚胺层的半导体器件的方法，以通过在光敏聚酰亚胺层上形成光致抗蚀剂层来防止光异常照射光敏聚酰亚胺层的曝光。 构成：在半导体衬底（51）的上表面上形成光敏聚酰亚胺层（59）。 光致抗蚀剂层（61）形成在感光性聚酰亚胺层的上表面上。 光致抗蚀剂层的厚度为500埃或小于500埃。 使用光掩模进行光致抗蚀剂层和感光性聚酰亚胺层的曝光处理。

    유기 박막의 물성적 특성을 분석하기 위한 방법 및 장치
    7.
    发明公开
    유기 박막의 물성적 특성을 분석하기 위한 방법 및 장치 无效
    用于分析有机涂层物理性质的方法和装置

    公开(公告)号：KR1020040041311A

    公开(公告)日：2004-05-17

    申请号：KR1020020069516

    申请日：2002-11-11

    Applicant: 삼성전자주식회사

    Inventor： 김재현 ,  진왕철 ,  이창호 ,  박석봉 ,  김원미 ,  김영훈

    IPC: G01N21/71

    Abstract: PURPOSE: A method and an apparatus for analyzing physical properties of an organic coating layer are provided to use the organic coating layer having superior physical properties for fabricating a semiconductor device by analyzing the physical properties of the organic coating layer varying in real time according to a change of a temperature. CONSTITUTION: An apparatus for analyzing physical properties of an organic coating layer includes a substrate(101) having an organic coating layer. The organic coating layer is formed on the substrate by using a spin-coater(10). The spin-coater(10) includes a spin-chuck(103) and a nozzle(105). The spin-chuck(103) rotates the substrate(101), and the nozzle(105) sprays an organic matter towards the rotated substrate. The substrate(101) having the organic coating layer is not subject to a change of a temperature. The substrate(101) includes a photo resist film, an organic anti-reflective coating layer, and a polyimide layer.

    Abstract translation: 目的：提供一种用于分析有机涂层的物理性能的方法和装置，以通过分析实时变化的有机涂层的物理性质来使用具有优异物理性质的有机涂层来制造半导体器件， 温度变化 构成：用于分析有机涂层的物理性能的装置包括具有有机涂层的基底（101）。 通过使用旋涂机（10）在基板上形成有机被覆层。 旋涂机（10）包括旋转卡盘（103）和喷嘴（105）。 旋转卡盘（103）旋转基板（101），并且喷嘴（105）朝着旋转的基板喷射有机物质。 具有有机涂层的基板（101）不会发生温度变化。 基板（101）包括光致抗蚀剂膜，有机抗反射涂层和聚酰亚胺层。

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