公开(公告)号：KR1020080014363A

公开(公告)日：2008-02-14

申请号：KR1020060075959

申请日：2006-08-11

Applicant: 삼성전자주식회사

Inventor： 이성호 ,  김기정 ,  김영남 ,  김현준 ,  전태승 ,  박종제 ,  함성욱

IPC: H01L21/304

Abstract: A chuck cleaning apparatus of semiconductor device manufacturing equipment and a chuck cleaning method using the same are provided to remove a particle from the chuck by spraying nitrogen gas to a lower portion and a side portion of the chuck to load a wafer. A chuck cleaning apparatus of semiconductor device manufacturing equipment comprises a gas jet orifice(108), a particle absorber(112), and an exhaust pipe(114). The gas jet orifice is formed under a chuck(104) which a wafer(106) is loaded on, and jets gas with predetermined pressure for separating a particle attached under the chuck from the chuck. The particle absorber absorbs the particle separated from the chuck by the gas. The exhaust pipe exhausts the absorbed particle to the outside of a process chamber(100).

Abstract translation: 提供半导体器件制造设备的卡盘清洁装置和使用其的卡盘清洁方法，以通过将氮气喷射到卡盘的下部和侧部来装载晶片来从卡盘中去除颗粒。 半导体器件制造设备的卡盘清洁装置包括气体喷射孔（108），粒子吸收器（112）和排气管（114）。 气体喷射孔形成在装载有晶片（106）的卡盘（104）的下面，并且以预定压力喷射气体，以将附着在卡盘下方的颗粒与卡盘分离。 颗粒吸收剂通过气体吸收从卡盘分离的颗粒。 排气管将吸收的颗粒排出到处理室（100）的外部。