公开(公告)号：KR1020000010141A

公开(公告)日：2000-02-15

申请号：KR1019980030897

申请日：1998-07-30

Applicant: 삼성전자주식회사

Inventor： 신동우 ,  한성찬 ,  이동춘 ,  박희종

IPC: H05K13/00

CPC classification number: H05K13/0015 ,  H05K13/0023 ,  H05K13/0061

Abstract: PURPOSE: Apparatus for aligning a printed circuit board(PCB) for a semiconductor module independently aligns each PCB accommodated in a jig in a module assembling apparatus. CONSTITUTION: Apparatus for aligning a printed circuit board includes at least two alignment pins(140) separated to be corresponded to each reference surface(124), a body(150) to which the alignment pins are connected toward the reference surface(124) with a predetermined flow feature, and a driver(158) for horizontally/vertically driving the body. If the body(150) is driven horizontally or vertically, the alignment pins align the PCB(110) to be proper to the reference surface, are connected therebetween through absorption part. Accordingly, the PCBs are independently operated.

Abstract translation: 目的：用于对准用于半导体模块的印刷电路板（PCB）的装置独立地对准容纳在模块组装装置中的夹具中的每个PCB。 构造：用于对准印刷电路板的装置包括至少两个分离成对应于每个参考表面（124）的对准销（140），对准销朝着参考表面（124）连接的主体（150），主体 预定的流动特征，以及用于水平/垂直驱动身体的驱动器（158）。 如果主体（150）被水平或垂直地驱动，则对准销将PCB（110）对准参考表面，通过吸收部分连接在它们之间。 因此，PCB是独立运行的。

公开(公告)号：KR1020010056238A

公开(公告)日：2001-07-04

申请号：KR1019990057623

申请日：1999-12-14

Applicant: 삼성전자주식회사

Inventor： 신동우 ,  한성찬 ,  이동춘 ,  박희종

IPC: B65G35/00

Abstract: PURPOSE: A package supplying machine to a mounter is provided to reduce time consumed to supplying package to a mounter and to realize improvement of productivity. CONSTITUTION: A conveyor unit(210) equips a conveyor instrument such as a conveyor belt(211) installed on a top plate(203). Packages(310) picked up by a pickup unit(245) are sequentially placed on the conveyor belt(211) that moves the packages(310) continuously by a conveyor rotating motor(213). An end of the conveyor belt is extended to a position where a mounter head picks up and around the end thereof, a position aligner(215) is arranged for alignment of the mounter head. The conveyor belt is connected to action speed of the pickup unit to sequentially move a position of the packages. When the pickup unit acts, one pitch is controlled to move. Package supply equipment is continuously moved. Therefore, though pickup speed of mounter increases, speed of conveyor belt is increased or a nozzle amount is increased for supplying the packages according to the pickup speed of the mounter head. Thereby, the waiting time of the mounter head is reduced.

Abstract translation: 目的：提供一种向贴片机提供包装的机器，以减少向贴片机提供包装所需的时间并实现生产率的提高。 构成：输送单元（210）装备有输送工具，例如安装在顶板（203）上的输送带（211）。 由拾取单元（245）拾起的包装件（310）依次放置在传送带（211）上，传送带（211）通过传送带旋转马达（213）连续移动包装（310）。 传送带的端部延伸到安装器头部拾取并在其端部周围的位置，布置了位置对准器（215），用于对准安装器头部。 传送带连接到拾取单元的动作速度以顺序地移动包装的位置。 当拾取单元动作时，控制一个音调移动。 包装供应设备不断移动。 因此，尽管安装器的拾取速度增加，但是根据安装器的拾取速度，输送带的速度增加或者为了供应包装而增加喷嘴量。 从而，减小了安装头的等待时间。

公开(公告)号：KR1020130114857A

公开(公告)日：2013-10-21

申请号：KR1020120037225

申请日：2012-04-10

Applicant: 삼성전자주식회사

Inventor： 박노정 ,  하인수 ,  염대웅 ,  박희종 ,  오찬섭 ,  장지용

IPC: B05C5/00 ,  B05C11/10 ,  H01L21/52

CPC classification number: B05C5/02 ,  B05C11/10 ,  H01L21/52

Abstract: PURPOSE: A bonding apparatus using a mono pump is provided to be able to precisely control the ejection of a bonding material, and to improve the user convenience. CONSTITUTION: A bonding apparatus comprises a discharge unit (200) ejecting a bonding material; a reservoir (400) storing the bonding material, and charging the bonding material to the discharge unit; and a control unit (300) controlling the ejection of the bonding material by the discharge unit. The discharge unit comprises a mono pump in which the bonding material is suctioned from the reservoir and ejected; and a motor producing a rotary force for the mono pump ejecting the bonding material.

Abstract translation: 目的：提供使用单泵的接合装置，以能够精确地控制接合材料的喷射，并且提高用户便利性。 构成：接合装置包括：排出接合材料的排出单元（200）; 存储所述接合材料的储存器（400），并且将所述接合材料充电到所述排出单元; 以及控制单元（300），其控制由所述排出单元喷射所述接合材料。 排出单元包括单泵，其中粘合材料从储存器抽吸并喷射; 以及产生单声道喷射接合材料的旋转力的电动机。