Abstract:
A method for cleaning semiconductor manufacturing equipment using a remote plasma in a PEOX process is provided to prevent particles from being generated on a wafer by cleaning a process chamber so that an N2 gas does not remain in the process chamber. After a PEOX(Plasma Enhanced Oxide) process is completed, a SiH4 outlet line is opened to supply an N2 gas, thereby purging a process chamber(10). A remote plasma generator(36) supplies an NF3 gas during a predetermined time to generate a plasma. The SiH4 supply line is opened, and the N2 gas is supplied to the process chamber. The remote plasma generator supplies an Ar gas to the process chamber to generate the plasma. After the NF3 gas is removed from the process chamber and the process chamber, a second air valve(24) and a third air valve(26) are alternatively opened/closed to supply the N2 gas, with a first air valve(18) being opened.
Abstract:
A shower head distance measuring jig and a shower head distance measuring method using the same are provided to reduce remarkably the maintenance time of equipment and to measure exactly the distance between a heating block and a shower head. A shower head distance measuring jig(130) is used for measuring the distance between a heating block(100) and a shower head(150) in a CVD apparatus. The shower head distance measuring jig is formed like a disc type structure. The shower head distance measuring jig is made of a metal or teflon.
Abstract:
Semiconductor device fabricating equipment is provided to easily assemble a spindle fork assembly by forming fixing bosses on an upper plate which fix spindle forks, without using spindle fork springs. A spindle fork assembly(200) is positioned in a process chamber, and rotates semiconductor substrates. The spindle fork assembly includes pairs of spindle forks(220) supporting semiconductor substrates, an upper plate(210) with plural fixing bosses(212) for fixing a pair of the spindle forks, and a lower plate(230) positioned under the spindle forks. The spindle fork assembly is mounted on a heater block to maintain the semiconductor substrates at constant temperature.