公开(公告)号：KR1020120045880A

公开(公告)日：2012-05-09

申请号：KR1020100107739

申请日：2010-11-01

Applicant: 삼성전자주식회사

Inventor： 윤상복 ,  엄해용 ,  권충환

IPC: G01M11/02 ,  G01J1/02 ,  G01N21/88

CPC classification number: G01J3/505 ,  G01J3/0267 ,  G01J3/06 ,  G01J3/506 ,  G01R31/2635

Abstract: PURPOSE: A device for measuring optical properties of a LED(Light Emitting Diode) package is provided to enhance the efficiency of measuring optical properties of a LED package by measuring the optical properties of each LED packages inside a LED package array before a singularization process dividing the LED package into items. CONSTITUTION: A device for measuring optical properties of a LED package comprises an light detection unit(10), a seating unit(30), and a voltage applying unit(20). The light detecting unit detects output lights of the LED package so that optical properties with respect to each LED package inside a LED package array where a plurality of the LED packages is arranged. The seating unit fixes the LED package array when measuring the optical properties. The voltage applying unit applies driving voltage to the each LED package when measuring the optical properties.

Abstract translation: 目的：提供一种用于测量LED（发光二极管）封装的光学特性的器件，用于通过测量LED封装阵列内每个LED封装阵列的光学特性，在单一化过程分割之前，提高LED封装的光学性能测量的效率 将LED封装成物品。 构成：用于测量LED封装的光学特性的装置包括光检测单元（10），就座单元（30）和电压施加单元（20）。 光检测单元检测LED封装的输出光，使得相对于布置有多个LED封装的LED封装阵列内的每个LED封装的光学特性。 测量光学特性时，座椅单元可固定LED封装阵列。 电压施加单元在测量光学特性时向每个LED封装施加驱动电压。

公开(公告)号：KR1020110074098A

公开(公告)日：2011-06-30

申请号：KR1020090130966

申请日：2009-12-24

Applicant: 삼성전자주식회사

Inventor： 윤상복 ,  유미화 ,  엄해용

IPC: H01L33/52 ,  H01L23/28

CPC classification number: H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: PURPOSE: An apparatus for applying a resin to an LED package, and a manufacturing method of the led package using the apparatus are provided to easily implement a desired color coordinate by coating a transparent resin including a photo conversion material on the LED chip. CONSTITUTION: In an apparatus for applying a resin to an led package, and a manufacturing method of the LED package using the apparatus, an optical property measurement unit(110) measures the optical property of an LED chip(13) mounted in a package substrate(11). A resin coating unit(150) spreads a transparent resin(50) in the LED chip. The optical property data of the LED chip which is obtained by the optical property measurement unit is transferred to the resin coating unit. A measurement unit(151) calculates suitable coating according to transferred optical property. A dispenser unit(153) dots the transparent resin including photo conversion material on the LED chip.

Abstract translation: 目的：提供一种将树脂施加到LED封装的装置以及使用该装置的LED封装的制造方法，通过在LED芯片上涂布包含光转换材料的透明树脂来容易地实现所需的色坐标。 构成：在用于向LED封装施加树脂的装置以及使用该装置的LED封装的制造方法中，光学特性测量单元（110）测量安装在封装衬底中的LED芯片（13）的光学特性 （11）。 树脂涂布单元（150）将透明树脂（50）铺展在LED芯片中。 通过光学特性测量单元获得的LED芯片的光学特性数据被传送到树脂涂覆单元。 测量单元（151）根据转移的光学性质计算合适的涂层。 分配器单元（153）将包括光转换材料的透明树脂点在LED芯片上。

公开(公告)号：KR1020120050283A

公开(公告)日：2012-05-18

申请号：KR1020100111707

申请日：2010-11-10

Applicant: 삼성전자주식회사

Inventor： 엄해용

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/20 ,  H01L33/52

Abstract: PURPOSE: An LED package is provided to improve durability by supplementing a gap between a package body and a lead frame. CONSTITUTION: A package body(15) includes a concave portion(17). The package body is formed to support a first lead frame(12) and a second lead frame(14). An LED chip(13) is arranged in the concave portion. The LED chip is electrically connected to the first lead frame and the second lead frame. A transparent resin packaging portion(16) is formed in the concave portion in order to protect the LED chip.

Abstract translation: 目的：提供LED封装以通过补充封装体和引线框之间的间隙来提高耐久性。 构成：包装体（15）包括凹部（17）。 封装体形成为支撑第一引线框架（12）和第二引线框架（14）。 LED芯片（13）布置在凹部中。 LED芯片电连接到第一引线框架和第二引线框架。 为了保护LED芯片，在凹部中形成透明树脂封装部（16）。

公开(公告)号：KR101510151B1

公开(公告)日：2015-04-10

申请号：KR1020090127374

申请日：2009-12-18

Applicant: 삼성전자주식회사

Inventor： 윤상복 ,  엄해용

IPC: H01L33/48 ,  G01J3/52

CPC classification number: H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: 본발명은발광소자의광특성보정장치및 그방법에관한것으로서, 디스펜싱공정에광특성보정공정을추가함으로써, 목표색좌표를정확하게재현할수 있으며, 색좌표의산포특성을개선할수 있다.

公开(公告)号：KR1020130029605A

公开(公告)日：2013-03-25

申请号：KR1020110092963

申请日：2011-09-15

Applicant: 삼성전자주식회사

Inventor： 김태준 ,  윤상복 ,  엄해용

IPC: H01L33/48 ,  H01L33/50

CPC classification number: H01L2224/48091 ,  H01L33/502 ,  H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to secure uniformly color dispersion by using a wavelength conversion portion. CONSTITUTION: A package body(110) includes a groove portion. A light emitting device(120) is mounted on the groove portion. An upper cover is arranged in the upper surface of the groove portion in order to cover the groove portion. A lower cover has an internal space. A wavelength conversion portion(130) includes a wavelength conversion material filled in the internal space.

Abstract translation: 目的：提供一种发光二极管封装及其制造方法，以通过使用波长转换部来均匀地色散。 构成：包装体（110）包括槽部。 发光装置（120）安装在凹槽部分上。 为了覆盖槽部，在槽部的上表面配置有上盖。 下盖有一个内部空间。 波长转换部分（130）包括填充在内部空间中的波长转换材料。

公开(公告)号：KR1020110070517A

公开(公告)日：2011-06-24

申请号：KR1020090127374

申请日：2009-12-18

Applicant: 삼성전자주식회사

Inventor： 윤상복 ,  엄해용

IPC: H01L33/48 ,  G01J3/52

CPC classification number: H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: PURPOSE: An apparatus and method for correcting an optic property of a light emitting device are provided to implement a target color coordinate by adding an optic property correcting process to a dispensing process. CONSTITUTION: A first dispensing unit(410) injects fluorescent substance lead-in resin into a light emitting device package. An optic property measuring unit(420) measures a color coordinate of light emitted from a light emitting device package. A control unit(430) calculates an additional injection amount by comparing a preset target color coordinate with the measured color coordinate. A corrector(440) injects the fluorescent substance lead-in resin to the light emitting device package. A power supply unit(450) applies an electric signal to the light emitting device package.

Abstract translation: 目的：提供一种用于校正发光器件的光学特性的装置和方法，以通过向分配过程添加光学特性校正处理来实现目标色坐标。 构成：第一分配单元（410）将荧光物质引入树脂注入到发光器件封装中。 光学性质测量单元（420）测量从发光器件封装发射的光的颜色坐标。 控制单元（430）通过将预设目标色坐标与测量的颜色坐标进行比较来计算附加喷射量。 校正器（440）将荧光物质引入树脂注入到发光器件封装中。 电源单元（450）将电信号施加到发光器件封装。