中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.021 seconds)

    웨이퍼 세정장치
    1.
    发明公开
    웨이퍼 세정장치 无效
    洗衣机设备

    公开(公告)号：KR1020000066503A

    公开(公告)日：2000-11-15

    申请号：KR1019990013667

    申请日：1999-04-17

    Applicant: 삼성전자주식회사

    Inventor： 이강준

    IPC: H01L21/304

    Abstract: PURPOSE: A device for wafer washing is provided to control the amount of washer flow to minimize damage of wafer. CONSTITUTION: After finishing CMP(Chemical Mechanical Polishing) process, a wafer(1) is loaded on an input station(10). Slurry on the wafer(1) is detached by the high pressure of pure water and the wafer(1) is moved to a particle removing station(20) by a wafer transfer equipment(50). During the particle removing station(20), a brush(22) washes the wafer(1) using aqueous ammonia. The amount of aqueous ammonia is controlled exactly by a fixed quantity supplying pump(135b). An electrical flow meter(135a) measures the amount of aqueous ammonia and sends the information to a controller(500). If the amount is changed, the controller(500) gives an alarm and shows the state on a monitor unit(400). The washed wafer(1) is moved into a scratch clear unit(30). The scratch on the wafer is cleared by a brush(32) and HF acid. The HF acid is controlled correctly by a determined quantity supply pump(165b). The amount of HF acid is checked by the electrical measure meter(165a). The controller(500) receives the information of the amount of HF acid. The controller(500) sends an alarm signal and displays the state on the monitor unit(400) when amount of HF acid is changed. The wafer(1) is moved in a dry station(40). After dried pure water in the wafer(1) the wafer(1) is unloaded

    Abstract translation: 目的：提供一种用于晶片清洗的装置，以控制洗衣机流量，以尽量减少晶片损坏。 构成：在CMP（化学机械抛光）处理完成之后，将晶片（1）装入输入站（10）。 晶片（1）上的浆料通过纯水的高压分离，并且晶片（1）通过晶片转移设备（50）移动到颗粒去除站（20）。 在颗粒去除站（20）期间，刷（22）使用氨水洗涤晶片（1）。 氨水的量由固定量供给泵（135b）精确控制。 电流表（135a）测量氨水的量并将信息发送到控制器（500）。 如果量改变，则控制器（500）发出报警并显示监视器单元（400）上的状态。 将清洗的晶片（1）移动到刮擦清洁单元（30）中。 通过刷子（32）和HF酸清除晶片上的划痕。 HF酸由确定量的供给泵（165b）正确控制。 通过电子测量仪（165a）检查HF酸的量。 控制器（500）接收HF酸的量的信息。 当HF酸的量变化时，控制器（500）发送警报信号并在监视器单元（400）上显示该状态。 晶片（1）在干燥站（40）中移动。 在晶片（1）中干燥的纯水之后，晶片（1）被卸载

    반도체 ＣＭＰ설비의 웨이퍼 진공척
    3.
    发明公开
    반도체 ＣＭＰ설비의 웨이퍼 진공척 无效
    半导体CMP设备的真空真空泵

    公开(公告)号：KR1020030012611A

    公开(公告)日：2003-02-12

    申请号：KR1020010046731

    申请日：2001-08-02

    Applicant: 삼성전자주식회사

    Inventor： 이강준

    IPC: H01L21/302

    Abstract: PURPOSE: A wafer vacuum chuck of a semiconductor CMP(Chemical Mechanical Polishing) equipment is provided to prevent damage of a wafer in a wafer absorption process. CONSTITUTION: An arm(10a) is provided with at least one independent vacuum path(14a). A vacuum groove(12a) is formed on a desired portion of the top surface of the arm(10a) so that the groove(12a) is communicated with the vacuum path(14a) with a designated width and depth. At least one supporting protrude(16a) is formed on the bottom of the vacuum groove(12a) to be extended to the top surface of the arm(10a). A coating layer(18a) is deposited on the end portion of the arm(10a) including the supporting protrude(16a) such that the layer is in contact with the bottom surface of the wafer.

    Abstract translation: 目的：提供半导体CMP（化学机械抛光）设备的晶片真空卡盘，以防止晶片吸收过程中的晶片损坏。 构成：臂（10a）设置有至少一个独立的真空路径（14a）。 在臂（10a）的上表面的期望部分上形成真空槽（12a），使得凹槽（12a）以指定的宽度和深度与真空通道（14a）连通。 在真空槽（12a）的底部形成至少一个支撑突起（16a），以延伸到臂（10a）的顶表面。 在包括支撑突起（16a）的臂（10a）的端部上沉积涂层（18a），使得该层与晶片的底表面接触。

    웨이퍼 이송장치를 위한 진공 메커니즘
    5.
    发明公开
    웨이퍼 이송장치를 위한 진공 메커니즘 失效
    用于传送装置的真空机构

    公开(公告)号：KR1020010055438A

    公开(公告)日：2001-07-04

    申请号：KR1019990056647

    申请日：1999-12-10

    Applicant: 삼성전자주식회사

    Inventor： 이강준

    IPC: H01L21/68

    Abstract: PURPOSE: A vacuum mechanism for a wafer transfer apparatus is provided to prevent pollution of an ejector by foreign matter adhered to a wafer and flowing through a vacuum line when the wafer transfer apparatus holds the wafer by a vacuum force. CONSTITUTION: The vacuum mechanism includes a filtering assembly(120) formed on the vacuum line(112) between the wafer transfer apparatus(210) and the ejector(114) to filter the foreign matter flowing into the vacuum line(112) through the wafer transfer apparatus(210) and thereby to permit only a flowing of air. The filtering assembly(120) has a container(122) containing a deionized water(124), an intake(122a) and an outlet(122b) formed on the container(122) and connected to the vacuum line(112) toward the wafer transfer apparatus(210) and the ejector(114), a drain line(128) formed on the container(122) to discharge the deionized water(124) in the container(122), and a cut-off valve(128a) formed on the drain line(128) to stop a flowing backward of the deionized water(124). The filtering assembly(120) further has two blocking plates(126a,126b) formed in the container(122). The first blocking plate(126a) prevents the deionized water(124) from splashing up to the intake(122a), while the second blocking plate(126b) prevents the deionized water(124) from being sucked into the outlet(122b).

    Abstract translation: 目的：提供一种用于晶片传送装置的真空机构，用于当晶片传送装置通过真空力保持晶片时，防止由附着在晶片上的异物污染喷射器并流过真空管线。 构成：真空机构包括形成在晶片传送装置（210）和喷射器（114）之间的真空管线（112）上的过滤组件（120），以通过晶片过滤流入真空管线（112）的异物 传送装置（210），从而仅允许空气流动。 过滤组件（120）具有包含去离子水（124）的容器（122），形成在容器（122）上并与真空管线（112）朝向晶片连接的入口（122a）和出口（122b） 传送装置（210）和喷射器（114），形成在容器（122）上以排出容器（122）中的去离子水（124）的排出管线（128）和形成的截止阀（128a） 在排水管线（128）上以停止去离子水（124）的向后流动。 过滤组件（120）还具有形成在容器（122）中的两个阻挡板（126a，126b）。 第一阻挡板（126a）防止去离子水（124）飞溅到进气口（122a），而第二阻挡板（126b）防止去离子水（124）被吸入出口（122b）。

    웨이퍼 세정장치
    6.
    发明公开
    웨이퍼 세정장치 无效
    清洁半导体波形的装置

    公开(公告)号：KR1020070119823A

    公开(公告)日：2007-12-21

    申请号：KR1020060054234

    申请日：2006-06-16

    Applicant: 삼성전자주식회사

    Inventor： 이강준

    IPC: H01L21/304

    Abstract: A wafer cleaning apparatus is provided to transfer a wafer continuously by including a conveyor belt having an inner surface of a saw tooth shape gearing with a motor pulley or belt pulley of a toothed wheel shape. A plurality of brushes(250) polish front and back surfaces of a wafer(222), confronting each other. A plurality of toggle rollers(260) rotate the wafer, supporting the lateral surface of the wafer between the plurality of brushes. A plurality of brackets(252) are formed in a manner that the plurality of brushes are closely attached to or separated from the front and back surfaces of the wafer, supporting the plurality of brushes. An interval control part(254) controls an interval between the plurality of brackets. A sensor(270) measures an interval between the plurality of brackets and detects if the plurality of brushes are closely attached to the front and back surfaces of the wafer.

    Abstract translation: 提供晶片清洁装置，通过包括具有齿轮形状的内表面的传送带与齿轮形状的马达皮带轮或皮带轮一起连续地传送晶片。 多个刷子（250）抛光彼此相对的晶片（222）的前表面和后表面。 多个肘节滚轮（260）旋转晶片，在多个刷子之间支撑晶片的侧表面。 多个托架（252）形成为使得多个刷子紧密地附接到晶片的前后表面或与晶片的前表面和后表面分离，从而支撑多个刷子。 间隔控制部（254）控制多个支架之间的间隔。 传感器（270）测量多个托架之间的间隔，并且检测多个刷子是否紧密地附接到晶片的前表面和后表面。

    웨이퍼 이송장치를 위한 진공 메커니즘
    10.
    发明授权
    웨이퍼 이송장치를 위한 진공 메커니즘 失效
    一种用于转移装置的真空机构

    公开(公告)号：KR100583645B1

    公开(公告)日：2006-05-26

    申请号：KR1019990056647

    申请日：1999-12-10

    Applicant: 삼성전자주식회사

    Inventor： 이강준

    IPC: H01L21/68

    Abstract: 본 발명은 반도체 소자의 제조 공정중 웨이퍼 표면에 형성된 막질을 평탄화 시키기 위한 CMP설비에서 웨이퍼 이송장치를 위한 진공 메커니즘에 관한 것으로, 웨이퍼 이송장치를 위한 진공 메커니즘은 상기 웨이퍼 이송장치에 연결되는 진공 라인과, 진공 라인상에 설치되는 이젝터 및 이젝터와 웨이퍼 이송장치 사이의 진공 라인상에 설치되고, 웨이퍼 홀딩시 웨이퍼 이송장치를 통해 진공 라인으로 유입된 이물질을 걸러내기 위한 수단을 구비한다.

Patent Agency Ranking