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Patent Agency Ranking
公开(公告)号：KR1020170011869A
公开(公告)日：2017-02-02
申请号：KR1020150105289
申请日：2015-07-24
Applicant: 삼성전자주식회사
CPC classification number: F21V23/005 , G02F1/133603 , G02F2001/133607 , H01L33/58
Abstract: 본발명의기술적사상에의한발광다이오드모듈은, 기판상에배치되는발광칩; 및상기기판상에서상기발광칩을감싸도록배치되는광학렌즈;를포함하고, 상기광학렌즈는, 상기발광칩을수납하는홈(groove)을내부에가지고, 돔형상의상면을가지는몸체부와, 상기몸체부의하면으로부터돌출되는고리형상의지지부;를포함하고, 상기광학렌즈는상기발광칩의상면및 측벽을감싸는형상일수 있다.
Abstract translation: 提供了一种发光二极管（LED）模块。 LED模块包括：基板上的发光芯片; 以及配置为包围发光芯片的基板上的光学透镜，其中，所述光学透镜包括主体，所述主体包括在其中容纳所述发光芯片的凹槽，并且具有圆顶形的上表面和从下部突出的环形支撑部分 身体表面。
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公开(公告)号：KR1020170106587A
公开(公告)日：2017-09-21
申请号：KR1020160029636
申请日：2016-03-11
Applicant: 삼성전자주식회사
CPC classification number: G01B11/002 , G01J3/462 , G01J3/50 , G01J3/505 , G01N21/253 , G01N2021/9511 , H01L33/486 , H01L33/502 , H01L33/62 , H01L2933/0033 , H01L2933/0041
Abstract: 본발명의실시형태에따른검사장치는, 광변환물질을함유한투광성수지를포함하는발광소자패키지에특정색상의빛을조사하는조명부, 상기투광성수지상에서상기발광소자패키지의이미지를획득하는카메라부, 및상기카메라부가획득한이미지로부터상기발광소자패키지의색좌표를계산하여상기발광소자패키지의불량여부를판단하는제어부를포함한다.
Abstract translation: 本发明的一个实施例的检查装置包括：照相机单元，用于获得所述光在照明单元的发光装置的图像中，透明树脂，用于照射一个特定颜色的光的发光器件封装，其包括含有光转换材料的透光性树脂 以及控制单元，用于根据相机单元获取的图像计算发光装置包装的颜色坐标，以确定发光装置包装是否有缺陷。
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公开(公告)号：KR1020130040069A
公开(公告)日：2013-04-23
申请号：KR1020110104829
申请日：2011-10-13
Applicant: 삼성전자주식회사
CPC classification number: B23K26/40 , B23K26/0093 , B23K2201/36 , B23K2203/172 , B23K2203/52 , H01L33/0095 , H01L2224/48091 , H01L2924/12044 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A method for cutting a light emitting device package by adopting a ceramic substrate and a method for cutting an object of a multilayer structure are provided to improve productivity by cutting a different material layer with a laser cutting process after a material layer which is unsuitable for a laser cutting process is removed by a mechanical cutting device. CONSTITUTION: A plurality of light emitting device chips(20) are mounted on a surface of a ceramic substrate(10). A transmissive material layer(30) which covers the plurality of light emitting device chips is formed. The transmissive material layer between the plurality of light emitting device chips is removed along a preset cut line by a mechanical cutting method. The ceramic substrate is cut along the preset cut line by a laser cutting method and is separated into an individual light emitting device package. The laser cutting method is a full-cutting method to cut the ceramic substrate by irradiating high output laser beams to the ceramic substrate.
Abstract translation: 目的：提供一种通过采用陶瓷基板切割发光器件封装的方法和用于切割多层结构物体的方法，以通过在不合适的材料层之后用激光切割工艺切割不同的材料层来提高生产率 用于通过机械切割装置去除激光切割过程。 构成：在陶瓷基板（10）的表面上安装有多个发光元件芯片（20）。 形成覆盖多个发光元件芯片的透过材料层（30）。 通过机械切割方法沿预设的切割线去除多个发光器件芯片之间的透射材料层。 通过激光切割方法沿着预设的切割线切割陶瓷基板，并将其分离成单独的发光器件封装。 激光切割方法是通过向陶瓷基板照射高输出激光束来切割陶瓷基板的全切割方法。
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公开(公告)号：KR101887448B1
公开(公告)日：2018-08-13
申请号：KR1020110104829
申请日：2011-10-13
Applicant: 삼성전자주식회사
CPC classification number: B23K26/40 , B23K26/0093 , B23K2101/36 , B23K2103/172 , B23K2103/52 , H01L33/0095 , H01L2224/48091 , H01L2924/12044 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: 개시된발광소자패키지의절단방법은, 기계적절단방식에의하여절단예정선을따라복수의발광소자칩 사이의투광성물질층을제거하고, 그후에레이저절단방식에의하여절단예정선을따라세라믹기판을절단하여개별발광소자패키지로분리한다.
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公开(公告)号：KR1020170107112A
公开(公告)日：2017-09-25
申请号：KR1020160030152
申请日：2016-03-14
Applicant: 삼성전자주식회사
IPC: B05C5/02 , H01L33/52 , H01L33/00 , B05C17/005 , B05C17/01
CPC classification number: H01L33/56 , B05B1/34 , B05C11/10 , B05C17/01 , H01L21/67126 , H01L33/502 , H01L33/507 , H01L2933/0041 , H01L2933/005
Abstract: 본발명의일 실시형태에따른수지도포장치는, 형광체함유수지를토출하는토출노즐을갖는외부몸체; 및적어도하나이상의유로를가지며, 상기외부몸체내에장착되는내부몸체;를포함할수 있다. 상기내부몸체는상기외부몸체보다짧은길이를가지는것을특징으로한다.
Abstract translation: 根据本发明的实施例的图像引导包装包括：外部主体，具有用于喷射含磷光体树脂的喷射喷嘴; 并且内体具有至少一个流动路径并安装在外体中。 内体的长度比外体短。
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