公开(公告)号：KR1020090054597A

公开(公告)日：2009-06-01

申请号：KR1020070121343

申请日：2007-11-27

Applicant: 삼성전자주식회사

Inventor： 이영우 ,  유수건 ,  박영태 ,  조영미 ,  류지헌 ,  나영필 ,  김한복 ,  임무성

IPC: H01L21/02 ,  H01L23/34 ,  H01L23/36

Abstract: A chiller apparatus for semiconductor process equipment is provided to increase a temperature of a brine by applying a plurality of hot gas bypass regulators without applying a heat for the brine. A brine path(290) circulates semiconductor process equipment(200), a brine inlet(210), the brine path of an evaporator, a brine pump(220), and a brine outlet. A coolant path(190) circulates a compressor(100), an electronic expansion valve(120), the brine path of the evaporator, a coolant path of the evaporator. A plurality of hot gas bypass regulators(140,150) are connected to the compressor in the front and the input terminal of the evaporator in the rear and are operated by the pressure difference between the front and the rear to supply the hot gas coolant from the compressor to the evaporator. The plurality of hot gas bypass regulators are connected in parallel and have a temperature range for different use.

Abstract translation: 提供了一种用于半导体工艺设备的冷却器装置，通过施加多个热气旁路调节器而不对卤水施加热量来增加盐水的温度。 盐水路径（290）循环半导体工艺设备（200），盐水入口（210），蒸发器的盐水路径，盐水泵（220）和盐水出口。 冷却剂路径（190）使压缩机（100），电子膨胀阀（120），蒸发器的盐水路径，蒸发器的冷却剂路径循环。 多个热气旁路调节器（140,150）连接到后部的蒸发器的前部和输入端子中的压缩机，并且由前后的压力差操作，以从压缩机供给热气体冷却剂 到蒸发器。 多个热气旁路调节器并联连接，具有不同用途的温度范围。