公开(公告)号：KR1020160028571A

公开(公告)日：2016-03-14

申请号：KR1020140116978

申请日：2014-09-03

Applicant: 삼성전자주식회사

Inventor： 김영경 ,  임석호 ,  임지현

IPC: G02F1/13357 ,  G02F1/1335

CPC classification number: G02B6/0085 ,  G02B6/0053 ,  G02B6/0055 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/009 ,  G02B6/0091

Abstract: 본발명에따른광원모듈은, 회로부가배치된제1면, 및상기제1면의반대측에위치한제2면을가지는기판; 및상기기판의상기제1면에장착되며, 상기회로부와전기적으로연결되는복수의발광소자;를포함하고, 상기기판은상기제2면에홈부를구비하며, 상기홈부를따라절곡된구조를가지는것을특징으로한다.

Abstract translation: 根据本发明，提供一种能够通过稳定的安装结构提高散热效率和可靠性的光源模块，以及包括该光源模块的背光单元。 光源模块包括：具有设置有电路单元的第一表面的基板和位于第一表面的相对侧上的第二表面; 以及安装在基板的第一表面上并电连接到电路单元的多个发光元件。 基板在第二表面上具有凹槽部分，并且沿着凹槽部分弯曲。

公开(公告)号：KR1020150072028A

公开(公告)日：2015-06-29

申请号：KR1020130159255

申请日：2013-12-19

Applicant: 삼성전자주식회사

Inventor： 김영경 ,  권재욱 ,  임석호 ,  홍석찬

IPC: B32B15/04 ,  B32B15/20 ,  H05K1/03

CPC classification number: H05K1/05 ,  H01L25/0753 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/056 ,  H05K1/183 ,  H05K3/44 ,  H05K2201/10106 ,  H05K2203/049 ,  Y10T156/10 ,  Y10T428/24331 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: 본발명의일 실시형태에따른동박적층판은, 일면에적어도하나의리세스를구비하는금속베이스; 상기금속베이스의상기일면상에적층되며, 상기리세스를노출시키는제1 개구를구비하는절연층; 및상기절연층상에적층되며, 상기리세스와상기제1 개구를노출시키는제2 개구를구비하는동박을포함할수 있다.

Abstract translation: 根据本发明的实施例，覆铜层压板可以包括：一侧具有一个或多个凹部的金属基座; 绝缘层，其被放置在所述金属基底的所述一侧上并且具有露出所述凹部的第一开口; 以及铜箔，其被放置在绝缘层上并具有第二开口以露出凹部和第一开口。

公开(公告)号：KR1020100036892A

公开(公告)日：2010-04-08

申请号：KR1020080096310

申请日：2008-09-30

Applicant: 삼성전자주식회사

Inventor： 박명보 ,  김동주 ,  양성민 ,  임석호 ,  이현호 ,  안인걸

IPC: H01L33/54

Abstract: PURPOSE: A light emitting diode package is provided to improve a bonding intensity with a package main body by including a lead frame of which both ends are upwardly folded to a longitudinal direction of a horizontal unit. CONSTITUTION: The both ends of a first lead frame(21) are upwardly folded to the longitudinal direction of a first horizontal part(23) in order to form a first stepped part. A second lead frame(22) is spaced apart from the first lead frame. The both ends of a second lead frame are upwardly folded to the longitudinal direction of a second horizontal part(24) in order to form a second stepped part. A space part supports the first lead frame and the second lead frame. A light emitting device is exposed by opening the upper side of the space part.

Abstract translation: 目的：提供发光二极管封装，通过包括两端向上折叠到水平单元的纵向的引线框架来提高与封装主体的接合强度。 构成：第一引线框架（21）的两端向上折叠到第一水平部分（23）的纵向方向，以便形成第一台阶部分。 第二引线框架（22）与第一引线框架间隔开。 第二引线框架的两端向上折叠到第二水平部分（24）的纵向方向，以便形成第二阶梯部分。 空间部分支撑第一引线框架和第二引线框架。 通过打开空间部分的上侧来暴露发光器件。

公开(公告)号：KR102198695B1

公开(公告)日：2021-01-06

申请号：KR1020140116978

申请日：2014-09-03

Applicant: 삼성전자주식회사

Inventor： 김영경 ,  임석호 ,  임지현

IPC: G02F1/13357 ,  G02F1/1335

Abstract: 본발명에따른광원모듈은, 회로부가배치된제1면, 및상기제1면의반대측에위치한제2면을가지는기판; 및상기기판의상기제1면에장착되며, 상기회로부와전기적으로연결되는복수의발광소자;를포함하고, 상기기판은상기제2면에홈부를구비하며, 상기홈부를따라절곡된구조를가지는것을특징으로한다.

公开(公告)号：KR102116988B1

公开(公告)日：2020-06-01

申请号：KR1020160102444

申请日：2016-08-11

Applicant: 삼성전자주식회사

Inventor： 방재준 ,  김선 ,  신창호 ,  이동수 ,  임석호

IPC: F21V8/00 ,  G02F1/1335 ,  H01L33/56

公开(公告)号：KR3006855010000S

公开(公告)日：2013-03-19

申请号：KR3020120001402

申请日：2012-01-10

Applicant: 삼성전자주식회사

Designer： 김대섭 ,  임석호 ,  이원준 ,  한성연 ,  김종인

公开(公告)号：KR1020100066768A

公开(公告)日：2010-06-18

申请号：KR1020080125233

申请日：2008-12-10

Applicant: 삼성전자주식회사

Inventor： 이현호 ,  임석호 ,  박명보

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: PURPOSE: An LED package and an LED package device including the same are provided to reduce manufacturing costs by simplifying a circuit for driving the LED package. CONSTITUTION: A package main body(110) has a concave storage groove in the central area thereof. First and second electrode structures(113,114) are formed to be exposed on the bottom surface of the storage groove of the package main body. A first light emitting diode chip(117) is mounted on the bottom surface of the storage groove. The first light emitting diode chip provides light with a first peak wavelength in a specific color. A second light emitting diode chip(118) provides light with a second peak wavelength that is different from the first peak wavelength. A resin shield unit(121) buries the first and second light emitting diode chips.

Abstract translation: 目的：提供包括该LED封装和LED封装装置的LED封装装置，以简化用于驱动LED封装的电路来降低制造成本。 构成：包装主体（110）在其中心区域具有凹形的存储槽。 第一和第二电极结构（113,114）被形成为暴露在包装主体的存储槽的底表面上。 第一发光二极管芯片（117）安装在存储槽的底表面上。 第一发光二极管芯片提供具有特定颜色的第一峰值波长的光。 第二发光二极管芯片（118）提供具有不同于第一峰值波长的第二峰值波长的光。 树脂屏蔽单元（121）埋入第一和第二发光二极管芯片。

公开(公告)号：KR1020100050344A

公开(公告)日：2010-05-13

申请号：KR1020080109580

申请日：2008-11-05

Applicant: 삼성전자주식회사

Inventor： 이현호 ,  임석호 ,  양성민 ,  박명보 ,  송호영

IPC: H01L33/60

Abstract: PURPOSE: An LED package is provided to uniformly distribute the brightness on an LCD by controlling the angle of a reflective surface for reflecting the light emitted from an LED chip. CONSTITUTION: A body part(20) includes a cavity which is long formed on one side. A receiving surface(30) is formed on the lower side of the cavity. An LED chip(50) is mounted on the receiving surface and emits the light. The reflective surface is positioned on the sidewall of the cavity and reflects the light emitted from the LED chip to the front side of the body part. In the incline angle of the reflective surface with a vertical surface to the receiving surface, the difference between the maximum angle and the minimum angle is continuously changed within 20 to 70 degrees.

Abstract translation: 目的：提供LED封装，通过控制用于反射从LED芯片发出的光的反射表面的角度，将亮度均匀地分布在LCD上。 构成：主体部分（20）包括在一侧上长形成的空腔。 接收表面（30）形成在空腔的下侧。 LED芯片（50）安装在接收表面上并发光。 反射表面位于空腔的侧壁上，将从LED芯片发出的光反射到主体部分的前侧。 在具有与接收面的垂直面的反射面的倾斜角度中，最大角度与最小角度之间的差在20〜70度内连续变化。