Abstract:
PURPOSE: A test mode setting circuit is provided to extend the number of test mode cases by two times, and easily detect a defectiveness of a memory device. CONSTITUTION: A test mode setting circuit includes a row signal, a MODSET signal, many address signals, a switch control circuit(500), and a test mode output part(550). The row signal is generated in a system so as to detect a defectiveness of a memory device. An MODSET signal is enabled by a write signal, a column signal and the row signal in order to defect a defective memory device. Many address signals transmit information for selecting one of many test modes to the switch control circuit(500). The switch control circuit(500) generates a frame signal and inverse frame signal in response to one of many address signals and the row signal. The test mode output part(550) receives the MODSET signal, many address signals, the frame signal and the inverse frame signal of the switch control circuit(500), and outputs many test mode signals.
Abstract:
PURPOSE: A semiconductor memory device with a sense amp control circuit for detecting bit line failure and a control method therefor are provided to effectively detect a failure in a bit line bridge by differently setting sensing time at bit lines. CONSTITUTION: A RAS(row address strobe signal) delay(300) delays a row address strobe signal(/RAS) by a predetermined time and outputs a delayed RAS signal(D_RAS). A sense amp control signal generator(310) generates first and second sense amp control signals which are generated in response to the delayed RAS signal(D_RAS) and a predetermined test mode control signal and are enabled in same timing or different timings in accordance with the operational modes of the semiconductor memory device. First sense amps(320) sense and amplify the potential of (2N-1)th bit line pairs in response to the first sense amp control signal. Second sense amps(330) sense and amplify the potential of 2N-th bit line pairs in response to the second sense amp control signal.
Abstract:
PURPOSE: A pipeline of a semiconductor memory device outputting data bidirectionally is provided, which can judge whether a fail of output data is caused by the pipeline or the output data is originally defective when being input, when the output data is defective. CONSTITUTION: A semiconductor memory device(101) comprising a pipeline(111) comprises a memory bank(105), the first switching unit(121), the second switching unit(122), a data output circuit(131), and output buffer(141) and a pad(151). The first switching unit is connected to the first output terminal of the pipeline, and the second switching unit is connected to the second output terminal of the pipeline. Data stored in the memory bank during a read operation of the semiconductor memory device are transferred in parallel and stored in the pipeline. The data stored in the pipeline are transferred to the data output circuit serially through the first switching unit and the first output line(L1) by being synchronized to an output clock signal(OCLK) or are transferred to the second switching unit and the second output line(L2) by being synchronized to the output clock signal. The data transferred to the data output circuit are transferred to the output buffer, and the output buffer converts a voltage level of the data into a voltage level proper to an external system.
Abstract:
PURPOSE: A fixing device for a both-side processing wafer is provided to prevent damage of both sides of a wafer and vibration or bending of the wafer while easily turning over the wafer in the process of processing the both sides of the wafer. CONSTITUTION: A fixing device for a both-side processing wafer includes upper and lower guard rings(22,24) for grasping an edge part of a wafer(10) at upper and lower parts in a circumferential direction, either of the upper and lower guard rings being hinge-coupled rotatably for separating the wafer, fixing elements(42,44) for integrally fixing the upper and lower guard rings, rotation shafts(52,54) fixed for reversing the upper and lower guard rings while grasping the wafer by an outer surface of the fixing element, a fixing chuck(60) formed with an insertion groove(62) for inserting an end of the respective fixing elements, and conveying elements for fixing and conveying the wafer without damaging both sides of the wafer.
Abstract:
반도체 메모리장치의 내부 전원전압 발생기가 개시된다. 상기 내부 전원전압 발생기는, 전원전압으로 외부 전원전압이 사용되고 기준전압을 입력으로 하여 내부 전원전압을 발생하는 내부 전원전압 발생부와, 상기 내부 전원전압 발생부의 전원 공급능력을 가변하는 전원 제어부를 구비하는 것을 특징으로 한다. 따라서 상기 내부 전원전압 발생기는, 내부 전원전압 발생부의 전원 공급능력을 가변하는 전원 제어부를 구비함으로써, 전류소모가 크게 증가하지 않으면서 IVCC 딥을 방지할 수 있는 장점이 있다.
Abstract:
PURPOSE: A data input/output circuit of a high speed semiconductor memory device having an output pipeline structure for a burn-in test is provided, which can apply continuous burn-in stress by one column signal by connecting each output pipeline selectively during a burn-in test. CONSTITUTION: The first output pipeline(RP0) comprises the first latch part(LAT0) and transmission gates(TG30,TG30N), and the first latch part comprises eight latches(L0-L7). Also, the second output pipeline(RP1) comprises the second latch part(LAT1) and transmission gates(TG31,TG31N). A transmission gate(TG30) inputs a test mode signal(PCON) and an inverted test mode signal(/PCON) as a transmission control signal and is turned on during a test mode. That is, the transmission gate receives an output of a latch(L7) as an input and transfers inputted data to an input(IN1) of the second latch part in response to the test mode signal and the inverted test mode signal. A transmission gate(TG30N) is turned on when the test mode signal is not enabled and transfers the output of the latch(L7) of the first latch part to a DQ terminal.
Abstract:
PURPOSE: A semiconductor memory device having a delay locked loop is provided which is capable of testing the entire part of the semiconductor memory device even in a test mode using a low-frequency test equipment. CONSTITUTION: A semiconductor memory device using an inner clock synchronized with an external clock includes a delay locked loop(12) for generating the inner clock that is phase-synchronized with a reference clock, a frequency multiplier(14) for M-multiplying the frequency of the external clock to generate a multiplied clock, and a selector(16) for selecting one of the external clock and the multiplied clock in response to a predetermined control signal to provide the reference clock. The control signal that is a signal generated inside the semiconductor memory device is enabled when the semiconductor memory device is introduced into a low-speed mode. The low-speed ode corresponds to a burn-in test mode.
Abstract:
비트 라인 불량 검출을 위한 센스 앰프 제어 회로를 구비하는 반도체 메모리 장치 및 그의 제어 방법이 개시된다. 본 발명에 따른 반도체 메모리 장치는, 다수의 워드 라인들과, 다수의 비트 라인들에 연결된 메모리 셀들을 구비하는 반도체 메모리 장치에 있어서, 로우 어드레스 스트로브 신호 지연부, 센스 앰프 제어 신호 발생부, 다수의 제1센스 앰프들 및 다수의 제2센스 앰프들을 구비한다. 로우 어드레스 스트로브 신호 지연부는, 로우 어드레스 스트로브 신호를 소정 시간 지연시키고, 지연된 신호를 출력한다. 센스 앰프 제어 신호 발생부는, 지연된 로우 어드레스 스트로브 신호와 소정의 테스트 모드 제어 신호에 응답하여 생성되고, 반도체 메모리 장치의 동작 모드에 따라서 서로 같은 시점 또는 다른 시점에 인에이블되는 제1 및 제2센스 앰프 제어 신호를 생성한다. 제1센스 앰프들은 제1센스 앰프 제어 신호에 응답하여 비트 라인들 중 2N-1(여기에서, N은 1 이상의 자연수)번째 비트라인 쌍들의 전위를 감지 증폭한다. 제2센스 앰프들은 제2센스 앰프 제어 신호에 응답하여 비트 라인들 중 2N번째 비트 라인 쌍들의 전위를 감지 증폭한다. 본 발명에 따르면, 비트 라인과 인접한 비트 라인 간의 센싱 시점을 서로 다르게 함으로써, 비트 라인 브리지 불량을 보다 정확하게 검출할 수 있을 뿐만 아니라 불량 검출 확률을 높일 수 있다.
Abstract:
PURPOSE: A test data generation circuit and a method for generating test data for testing a semiconductor memory device are provided, which generates various test data formats, without increasing the number of data input/output pads used in a write operation of test data. CONSTITUTION: The test data generation circuit comprises a data input pipe line(200) and at least one data phase inverter parts(210,211). The data input pipe line includes the first and the second data input pad(DQA,DQB), a plurality of first latches(L0,L2,L4,L6) connected to the first data input pad and a plurality of the second latches(L1,L3,L5,L7) connected to the second data input pad. The data phase inverter parts are connected between the first data input pad and the plurality of the first latches or between the second data input pad and the plurality of the second latches, and invert a phase of write data inputted through the first or the second data input pad. Data bus lines(W ,W ,W ,W ) connected to the first data input pad are connected to the first latches of the data input pipe line, and data bus lines(W ,W ,W ,W ) connected to the second data input pad are connected to the second latches of the data input pipe line.
Abstract:
PURPOSE: An input receiver circuit is provided to enable a reference voltage to shift in an input margin improved direction based on a voltage level of input data. CONSTITUTION: An input receiver(200) comprises a voltage pull-up part(210) which increases a voltage level of a reference voltage(VREF) in response to a predetermined voltage level of input data(DIN). A differential amplifier(250) compares the input data with the reference voltage, and amplifies the voltage level of the input data according to a comparison result. The voltage pull-up part(210) includes a PMOS transistor(220) and a load(230).