핸들러 원격 제어가 가능한 반도체 소자의 검사 시스템 및그 작동방법
    1.
    发明公开
    핸들러 원격 제어가 가능한 반도체 소자의 검사 시스템 및그 작동방법 有权
    用于处理器的半导体器件的测试系统远程控制和操作方法

    公开(公告)号:KR1020060035976A

    公开(公告)日:2006-04-27

    申请号:KR1020040084396

    申请日:2004-10-21

    CPC classification number: G01R31/31926 G01R31/31907

    Abstract: 핸들러(handler)에 대한 제반 설정 사항을 네트워킹을 통해 원격 제어하여 반도체 소자의 검사효율을 높일 수 있는 핸들러 원격 제어가 가능한 반도체 소자의 검사 시스템 및 그 작동방법에 관해 개시한다. 이를 위해 본 발명은 테스터와 핸들러를 연결하는 GPIB(General Purpose Instruction Bus) 통신케이블을 통해 반도체 소자의 전기적 검사를 위한 기본 통신 데이터와, 핸들러 원격제어를 위한 통신 데이터와, 핸들러 상태 점검을 위한 통신 데이터를 서로 송수신한다.
    전기적 검사, GPIB 통신 케이블, 핸들러 원격제어.

    반도체 테스트 설비의 데이터 처리 방법
    2.
    发明公开
    반도체 테스트 설비의 데이터 처리 방법 无效
    半导体测试设备的数据处理方法

    公开(公告)号:KR1020070012967A

    公开(公告)日:2007-01-30

    申请号:KR1020050067251

    申请日:2005-07-25

    CPC classification number: G01R31/2601 G06F11/263 H01L21/677

    Abstract: A data processing method of a semiconductor test facility is provided to preferentially process data of semiconductor elements, which are inspected in a specific station, when the specific station finishes a test process and then transmits a data processing signal. A data processing method of a semiconductor test facility for testing semiconductor elements in plural stations includes steps of: receiving a signal from the stations(S110); judging whether the signal is a test requiring signal or a data processing signal(S120); executing a test process if for the test requiring signal and stopping the test process of the other station if for the data processing signal(S130,S140,S170); processing and storing data of the semiconductor elements, which are completely inspected in the specific station(S150); executing the test process of the other station again(S160); and performing the test process of the specific station again.

    Abstract translation: 提供半导体测试设备的数据处理方法,用于当特定站完成测试处理并且然后发送数据处理信号时,优先处理在特定站点检查的半导体元件的数据。 用于测试多个站的半导体元件的半导体测试设备的数据处理方法包括以下步骤:从站接收信号(S110); 判断信号是测试要求信号还是数据处理信号(S120); 对于测试要求信号执行测试过程,如果对于数据处理信号(S130,S140,S170),则停止其他站的测试过程; 处理和存储在特定站中被完全检查的半导体元件的数据(S150); 再次执行其他站的测试过程(S160); 并再次执行特定站的测试过程。

    로트 및 트레이 확인을 통한 반도체 소자의 연속검사 방법
    4.
    发明授权
    로트 및 트레이 확인을 통한 반도체 소자의 연속검사 방법 有权
    在批次和测试托盘的识别中连续电气测试的方法

    公开(公告)号:KR100699866B1

    公开(公告)日:2007-03-28

    申请号:KR1020050092152

    申请日:2005-09-30

    CPC classification number: G01R31/2893

    Abstract: A method for continuous electrical testing throughout an identification of a lot and a test tray is provided to enhance the uptime of a tester and to reduce the number of testers. A plurality of lots are continuously loaded on a handler(H100). Semiconductor devices of the lots are transferred from a customer tray to a test tray by using a loader of the handler. The identification information on each semiconductor device of the test tray is stored in the handler and transmitted to a server connected with a tester(H110). An electrical test is started on the semiconductor device in the handler and tester by using the identification information(T110).

    Abstract translation: 提供了一种用于在批次和测试托盘的识别中的连续电气测试的方法,以增强测试仪的正常运行时间并减少测试仪的数量。 多个批次被连续地加载在处理器(H100)上。 批量的半导体装置通过使用处理器的装载器从客户托盘传送到测试托盘。 将测试托盘的每个半导体器件上的识别信息存储在处理器中并发送到与测试器连接的服务器(H110)。 通过使用识别信息(T110),在处理器和测试器中的半导体器件上开始电测试。

    자투리 반도체 소자의 검사 방법
    5.
    发明公开
    자투리 반도체 소자의 검사 방법 有权
    用于检查半导体器件的SCRAP以提高检查效率的方法

    公开(公告)号:KR1020040096070A

    公开(公告)日:2004-11-16

    申请号:KR1020030028875

    申请日:2003-05-07

    CPC classification number: G01R31/01

    Abstract: PURPOSE: A method for inspecting a scrap of a semiconductor device is provided to enhance the inspection efficiency by inspecting simultaneously 64 semiconductor devices or 128 semiconductor devices. CONSTITUTION: A customer tray including plural semiconductor devices is loaded(50). The semiconductor devices are loaded on a buffer tray of a loader part(52). The semiconductor devices are transferred to a test tray(54). The test tray including the semiconductor devices is transferred to a test site(56). The semiconductor devices are inspected(58). The semiconductor devices are transferred to a customer tray of an unloader part(60). A customer tray of the loader part is checked(62). The number of semiconductor devices loaded on the last buffer tray of the loader part is counted(64). The number of semiconductor devices are compared with a scrap reference value(66). The semiconductor devices are transferred to the test array if the number of semiconductor devices is larger than the scrap reference value(68). The semiconductor devices are inspected and classified(70). A retest mode is operated(72). A retest process is performed(74-78).

    Abstract translation: 目的:提供一种用于检查半导体器件的废料的方法,以通过同时检测64个半导体器件或128个半导体器件来提高检查效率。 构成:装载包括多个半导体器件的顾客托盘(50)。 半导体器件被装载在装载器部件(52)的缓冲托盘上。 半导体器件被传送到测试托盘(54)。 包括半导体器件的测试托盘被传送到测试部位(56)。 检查半导体器件(58)。 半导体器件被传送到卸载器部件(60)的顾客托盘。 检查装载部件的顾客托盘(62)。 计数加载器部件的最后一个缓冲托盘上的半导体器件的数量(64)。 将半导体器件的数量与废料参考值(66)进行比较。 如果半导体器件的数量大于废料参考值(68),则半导体器件被传送到测试阵列。 对半导体器件进行检查和分类(70)。 操作重新测试模式(72)。 执行复验过程(74-78)。

    소켓 이상 유무를 실시간으로 판단하는 반도체 소자의전기적 검사방법
    6.
    发明公开
    소켓 이상 유무를 실시간으로 판단하는 반도체 소자의전기적 검사방법 有权
    用于执行异常状态的实时决策过程的半导体器件的电气测试方法,其中使用来自测试的DUT(测试装置)的分类信息

    公开(公告)号:KR1020040089897A

    公开(公告)日:2004-10-22

    申请号:KR1020030023735

    申请日:2003-04-15

    Abstract: PURPOSE: An electrical test method of a semiconductor device for performing a real-time decision process for an abnormal state of a socket is provided to mend or exchange efficiently the socket by checking correctly a state of the socket. CONSTITUTION: A tester and a handler load a DUT(Device Under Test) into a test site of the handler connected to a DUT board(S100). An electrical test for the DUT is performed by operating the tester(S110). The tester collects test results of each socket of the DUT board(S120). The test results of each socket of the DUT board are stored into a storage unit of the tester(S130). The test results of each socket are partially transmitted to the handler and the handler processes the DUT according to the received test results(S140). The test results are compared with the reference value(S150). Each state of the sockets of the DUT board is decided by the compared result(S160). The decided result is transmitted to the handler and the handler interrupts operations of bad sockets(S170).

    Abstract translation: 目的:提供一种用于对插座的异常状态执行实时决策处理的半导体装置的电气测试方法,用于通过正确地检查插座的状态来有效地修复插座。 规定:测试人员和处理器将被测设备(被测设备)加载到连接到DUT板的处理器的测试位置(S100)。 通过操作测试仪进行DUT的电气测试(S110)。 测试仪收集DUT板每个插座的测试结果(S120)。 DUT板的每个插座的测试结果都存储在测试仪的存储单元中(S130)。 每个套接字的测试结果部分传送到处理程序,处理程序根据接收到的测试结果处理DUT(S140)。 将测试结果与参考值进行比较(S150)。 DUT板的插座的每个状态由比较结果决定(S160)。 决定的结果被发送到处理程序,处理程序中断坏插槽的操作(S170)。

    자투리 반도체 소자의 검사 방법
    7.
    发明授权
    자투리 반도체 소자의 검사 방법 有权
    剩余半导体器件的测试方法

    公开(公告)号:KR100498496B1

    公开(公告)日:2005-07-01

    申请号:KR1020030028875

    申请日:2003-05-07

    CPC classification number: G01R31/01

    Abstract: 본 발명은 반도체 소자의 검사 방법을 제공한다. 본 발명은 로더부의 커스터머 트레이가 비어 있지 않으면 상기 피검사 반도체 소자의 검사 과정을 진행하고, 비어 있으면 로더측 버퍼부의 버퍼 트레이에 탑재된 피검사 반도체 소자의 수를 카운트한다. 상기 로더측 버퍼부의 버퍼 트레이에 탑재된 피검사 반도체 소자의 수와 테스터부에 미리 입력된 자투리 기준값과 비교판단한다. 상기 피검사 반도체 소자의 수가 자투리 기준값보다 크면 상기 버퍼 트레이에 탑재된 피검사 반도체 소자의 검사를 진행하고 그렇지 않으면 중지한다. 상기 검사가 중지된 상기 테스터는 재검사 모드를 시작한다. 상기 불량으로 판정된 반도체 소자를 자투리 피검사 반도체 소자가 남아있는 버퍼 트레이에 탑재하여 재검사한다.

    반도체 IC 소자의 검사 공정 손실 요인 자동 분석 및관리 시스템과 그 방법
    8.
    发明授权
    반도체 IC 소자의 검사 공정 손실 요인 자동 분석 및관리 시스템과 그 방법 有权
    반도체IC소자의검사공정손실요인자동분석관리시스템과그방반

    公开(公告)号:KR100429116B1

    公开(公告)日:2004-04-28

    申请号:KR1020010026070

    申请日:2001-05-14

    CPC classification number: G01R31/2834 G11C2029/5606

    Abstract: A system and method automatically analyzes and manages loss factor data of test processes in which a great number of IC devices are tested as a lot with a number of testers. The lot contains a predetermined number of identical IC devices, and the lot test process is performed sequentially according to a predetermined number of test cycles. The system include a means for verifying test results for each of the test cycles and for determining whether or not a re-test is to be performed and an IC device loading/unloading means for loading IC devices to be tested and contained in the lot to a test head and for unloading the tested IC devices from the test head by sorting the tested IC devices according to the test results. The system also includes raw data generating means for generating raw data on the basis of time data occurring when the test process is performed; data calculating means for calculating testing time data, index time data based on the raw data, and loss time data; data storage means for storing the raw data and the calculated data; and data analyzing and outputting means for analyzing the raw data and the calculated data according to the lots, the plurality of testers and the IC device loading/unloading means and for outputting the analyzed output through an user interface. The test system includes testers, a server system and terminal computer, and the server system is provided with data storage means for integrally manipulating time data generated by the testers according to lots and test cycles and for storing manipulated time data.

    Abstract translation: 一种系统和方法自动地分析和管理测试过程的损耗因子数据,其中大量IC器件与许多测试器一起被大量测试。 批次包含预定数量的相同IC器件,批次测试过程按照预定数量的测试周期顺序执行。 该系统包括用于验证每个测试周期的测试结果并用于确定是否要执行重新测试的装置,以及用于将待测试并包含在该批次中的IC器件加载到该批次的IC器件加载/卸载装置 根据测试结果,通过对被测试的IC器件进行分类,从测试头卸下被测试的IC器件。 该系统还包括原始数据产生装置,用于基于当执行测试过程时出现的时间数据产生原始数据; 数据计算装置,用于计算测试时间数据,基于原始数据的索引时间数据和丢失时间数据; 数据存储装置,用于存储原始数据和计算的数据; 以及数据分析和输出装置,用于根据批次,多个测试器和IC装置加载/卸载装置分析原始数据和计算的数据,并通过用户界面输出分析的输出。 测试系统包括测试器,服务器系统和终端计算机,并且服务器系统设有数据存储装置,用于根据批次和测试周期整体地处理由测试器生成的时间数据,并且用于存储处理的时间数据。

    테스트 장비의 설비 가동율을 향상시킬 수 있는 테스트 방법
    9.
    发明公开
    테스트 장비의 설비 가동율을 향상시킬 수 있는 테스트 방법 无效
    用于提高测试设备操作比率的测试方法

    公开(公告)号:KR1020040032318A

    公开(公告)日:2004-04-17

    申请号:KR1020020061404

    申请日:2002-10-09

    Abstract: PURPOSE: A test method for improving an operation ratio of test equipment is provided to enhance the operation ratio of the test equipment by reducing a test idling period of time including a retest time, a loading time, and an unloading time. CONSTITUTION: The first lot is loaded by using a test handler(202). The first cycle test and the main item test are performed(204,206). In the main item test, two or more other lots are loaded. The other lots are merged with the first lot by inputting numbers and quantities of the other lots(208). The main item test for the first lot and the other lots is performed(210). A retest process for bad semiconductor devices is performed(212). The last cycle test is performed(214). The retest process is finished(216).

    Abstract translation: 目的:提供一种用于提高测试设备的操作比的测试方法,通过减少测试空闲时间(包括重新测试时间,加载时间和卸载时间)来提高测试设备的操作比。 构成:第一批通过使用测试处理程序(202)加载。 执行第一次循环测试和主项目测试(204,206)。 在主要项目测试中,加载了两个或多个其他批次。 其他批次与第一批合并,输入其他批次的数量和数量(208)。 执行第一批和其他批次的主要项目测试(210)。 执行坏半导体器件的重新测试过程(212)。 执行最后一个循环测试(214)。 复验过程完成(216)。

    하나의 핸들러에 2개 이상의 테스트 보드를 갖는 테스트장비 및 그 테스트 방법
    10.
    发明公开
    하나의 핸들러에 2개 이상의 테스트 보드를 갖는 테스트장비 및 그 테스트 방법 有权
    在一个手术器中提供至少两个测试板的测试装置及其测试方法

    公开(公告)号:KR1020040026784A

    公开(公告)日:2004-04-01

    申请号:KR1020020058349

    申请日:2002-09-26

    CPC classification number: G01R31/2893 G01R31/01 G01R31/2851

    Abstract: PURPOSE: A test apparatus provided with at least two set test boards in one handler and a method for testing the same are provided to reduce the size thereof since the semiconductor devices loaded on the test board are tested by providing with at least two test boards. CONSTITUTION: A test apparatus provided with at least two set test boards in one handler includes a handler(200) provided with a test head(210) and a head board. The test head(210) counts the test cycles supplied from the tester and divides the counted cycles into an odd number signal and an even number signal. The plurality of semiconductor devices is loaded on the first site(222) and the second site(224), separately. And, the head board is selectively tested in response to the odd number signal and the even number signal.

    Abstract translation: 目的:提供在一个处理器中设置有至少两个设置的测试板的测试装置和用于测试它的方法以减小其尺寸,因为通过提供至少两个测试板来测试加载在测试板上的半导体器件。 构成:在一个处理器中设置有至少两个设置的测试板的测试装置包括设置有测试头(210)和头板的处理器(200)。 测试头(210)对从测试仪提供的测试循环进行计数,并将计数的周期划分为奇数信号和偶数信号。 多个半导体器件分别装载在第一部位(222)和第二部位(224)上。 并且,根据奇数信号和偶数信号选择性地测试头板。

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