公开(公告)号：KR101410358B1

公开(公告)日：2014-06-20

申请号：KR1020130019804

申请日：2013-02-25

Applicant: 삼성전자주식회사

Inventor： 우창규 ,  신성호 ,  남주엽 ,  조기홍

IPC: H01L21/304 ,  B24B37/04

CPC classification number: B24B41/047 ,  B24B37/32

Abstract: Disclosed are a membrane of a chemical mechanical polishing apparatus and a polishing head of the chemical mechanical polishing apparatus. A polishing head of a chemical mechanical polishing apparatus according to an embodiment of the present invention comprises a housing which moves up and down; a base assembly which is connected to the lower part of the housing and supports the housing; a membrane which is prepared on the lower part of the base assembly, and absorbs and pressurizes the substrate; and a retainer ring which is connected to the lower part of the base assembly and surrounds the membrane. The membrane comprises a pressurizing part which absorbs and pressurizes the substrate; a first partition wall which is extended from the edge part of the pressuring part in a height direction; a first horizontal extension part which is extended from the upper part of the first partition wall to the center direction of the pressurizing part; and a second horizontal extension part which is extended from the upper part of the first partition part to the center direction of the pressurizing part, is arranged on the upper part of the first horizontal extension part, and has a curved part which is expanded by air pressure.

Abstract translation: 公开了化学机械抛光装置的膜和化学机械抛光装置的抛光头。 根据本发明实施例的化学机械抛光装置的抛光头包括上下移动的壳体; 基座组件，其连接到壳体的下部并支撑壳体; 制备在基座组件的下部上并吸收并加压基板的膜; 以及保持环，其连接到基座组件的下部并且围绕膜。 膜包括吸收和加压基底的加压部分; 第一分隔壁，其从加压部的边缘部向高度方向延伸; 第一水平延伸部，从第一分隔壁的上部延伸到加压部的中心方向; 并且在第一水平延伸部的上部设置有从第一分隔部的上部向加压部的中心方向延伸的第二水平延伸部，并且具有由空气膨胀的弯曲部 压力。

公开(公告)号：KR1020130090209A

公开(公告)日：2013-08-13

申请号：KR1020120011354

申请日：2012-02-03

Applicant: 삼성전자주식회사

Inventor： 김홍진 ,  김경섭 ,  신성호 ,  이근택 ,  조기홍

IPC: H01L21/304

CPC classification number: H01L21/30625 ,  B24C1/08 ,  H01L21/02021 ,  H01L21/02057 ,  H01L21/465 ,  H01L21/67219

Abstract: PURPOSE: An apparatus and method for processing a substrate are provided to easily remove foreign materials by spraying fluid on the substrate to perform a jet-polishing process. CONSTITUTION: A substrate is supported (S1210). Fluid is sprayed on the substrate (S1230). The fluid includes an abrasive. The substrate is jet-polished by the fluid (S1240). The fluid is sprayed on the non-pattern surface of the substrate. [Reference numerals] (AA) Start; (BB) Finish; (S1210) Support a substrate; (S1220) Supply fluid; (S1230) Jet-spray fluid; (S1240) Jet-spray a substrate

Abstract translation: 目的：提供一种用于处理基板的装置和方法，用于通过在基板上喷涂流体来简单地去除外来物质，进行喷射抛光处理。 构成：支撑基板（S1210）。 将流体喷涂在基板上（S1230）。 流体包括磨料。 基板被流体喷射抛光（S1240）。 将流体喷涂在基材的非图案表面上。 （附图标记）（AA）开始; （BB）完成; （S1210）支撑基板; （S1220）供液; （S1230）喷射流体; （S1240）喷射基板