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公开(公告)号：KR1020100117937A
公开(公告)日：2010-11-04
申请号：KR1020090036667
申请日：2009-04-27
Applicant: 삼성전자주식회사
IPC: G02F1/136
CPC classification number: C23C18/1608 , C23C18/31 , H01L21/0271 , H01L27/124 , H01L27/1288 , H01L29/41733 , H01L29/458 , Y10T156/10
Abstract: PURPOSE: A thin film transistor substrate and a manufacturing method thereof are provided to reduce a channel length of a semiconductor layer and remove a protrusion part of a semiconductor layer. CONSTITUTION: The first pattern layer is formed on a transparent insulating substrate(10). The second pattern layers are formed on both sides of the first pattern layer. A plating unit(360) is formed on at least one side of the second pattern. The first and second pattern layers are continuously formed on the transparent insulating substrate without interposition of another layer.
Abstract translation: 目的：提供一种薄膜晶体管基板及其制造方法，以减少半导体层的沟道长度并去除半导体层的突起部分。 构成：第一图案层形成在透明绝缘基板（10）上。 第二图案层形成在第一图案层的两侧。 电镀单元（360）形成在第二图案的至少一侧上。 第一图案层和第二图案层连续地形成在透明绝缘基板上，而不插入另一层。
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公开(公告)号：KR100841170B1
公开(公告)日：2008-06-24
申请号：KR1020070040887
申请日：2007-04-26
Applicant: 삼성전자주식회사
IPC: G02F1/136
CPC classification number: H05K3/048 , C23C18/1603 , C23C18/165 , C23C18/1651 , C23C18/1653 , C23C18/1696 , C23C18/1893 , C23C18/40 , C23C18/405 , H05K3/181 , H05K3/389 , Y10T428/12493
Abstract: A low resistance metal line forming method, a metal line structure and a display device using the same are provided to obtain a low resistance metal line efficiently within a short time by using a wet film forming process, thereby significantly reducing an amount invested in equipment and reducing manufacturing costs. On an upper part of a substrate(10), a latent mask pattern of a metal line is formed. On the upper part of the substrate where the latent pattern is formed, a self assembled monolayer(20) is applied. By activating the substrate coated with the self assembled monolayer, a seed layer(30) is formed on the surface. A sub metal film(40) is plated on an upper part of the seed layer. The latent mask pattern and its upper part are lifted off to be removed. After that, a metal layer(50) is plated on an upper part of the sub metal film where the pattern is formed.
Abstract translation: 提供了一种低电阻金属线形成方法，金属线结构和使用其的显示装置，以通过使用湿法成膜工艺在短时间内有效地获得低电阻金属线，从而显着减少了设备和 降低制造成本。 在基板（10）的上部形成金属线的潜像图案。 在形成潜像的衬底的上部，施加自组装单层（20）。 通过激活涂覆有自组装单层的基材，在表面上形成种子层（30）。 将亚金属膜（40）镀在种子层的上部。 潜膜图案及其上部被提起以被去除。 之后，在形成图案的副金属膜的上部上镀金属层（50）。
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公开(公告)号：KR100807948B1
公开(公告)日：2008-02-28
申请号：KR1020070020168
申请日：2007-02-28
Applicant: 삼성전자주식회사
IPC: H01L29/786 , H01L21/288
CPC classification number: H01B13/0026 , C23C18/1605 , C23C18/1692 , C23C18/1696 , C23C18/1889 , C23C18/30 , C23C18/31 , G02F2001/136295 , H01L27/124 , H01L27/1255 , H05K3/108 , H05K3/24 , H05K3/388 , H05K2203/0716 , H05K2203/072 , Y10T428/24917 , H01L27/1214 , H01L27/13
Abstract: A method for forming a low-resistance metal pattern, a metal pattern structure and a display device having the same are provided to effectively obtain the low-resistance metal pattern in a short time by using a wet puttering process, without performing a sputtering process. After a surface of a substrate with a pattern is activated to form plural metal nuclei, and a plating layer(50) is formed on the activated surface of the substrate to form a low-resistance metal pattern. Prior to activation of the substrate, a sensitization process is performed on the substrate using a copper compound. The sensitization process includes forming a lower conductive line on the substrate, performing the sensitization process on the lower conductive line, activating the substrate for form plural catalytic metal nuclei, and forming at least one plating layer on the catalytic layer.
Abstract translation: 提供了形成低电阻金属图案的方法，金属图案结构和具有该低电阻金属图形结构的显示装置，以便在不进行溅射处理的情况下通过使用湿式推杆法在短时间内有效地获得低电阻金属图案。 在具有图案的基板的表面被激活以形成多个金属核之后，并且在基板的活化表面上形成镀层（50）以形成低电阻金属图案。 在激活基板之前，使用铜化合物对基板进行敏化处理。 感光处理包括在基板上形成下导电线，对下导电线进行敏化处理，激活基板以形成多个催化金属核，并在催化层上形成至少一个镀层。
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公开(公告)号：KR1020080016025A
公开(公告)日：2008-02-21
申请号：KR1020060077561
申请日：2006-08-17
Applicant: 삼성전자주식회사
IPC: H01L21/027 , H01L29/786
CPC classification number: G03F7/0042 , G03F7/40 , G03F7/70 , H01L29/786
Abstract: A method for manufacturing a metal line and a flat display device using the same are provided to obtain high resolution metal line patterns by implementing a metal line having low contact resistance using coating, exposition, and plating. Liquids having photocatalyst compounds, metal catalytic compounds, and photo-sensitizers are coated on a substrate and a photo metal catalytic layer is formed. By selectively exposing the photo metal catalytic layer, a potential pattern for crystal growth nucleus is obtained. The plating on the potential pattern is executed using one or more metals and then a metal crystal is grown, thereby obtaining metal patterns with one or more layers.
Abstract translation: 提供一种金属线的制造方法和使用该金属线的平板显示装置，通过使用涂布，曝光和电镀实现具有低接触电阻的金属线来获得高分辨率金属线图案。 具有光催化剂化合物，金属催化剂和光敏剂的液体涂布在基材上，形成光催化剂层。 通过选择性地暴露光致金属催化层，获得晶体生长核的潜在图案。 使用一种或多种金属进行电位图案上的电镀，然后生长金属晶体，从而获得具有一层或多层的金属图案。
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公开(公告)号：KR1020070044981A
公开(公告)日：2007-05-02
申请号：KR1020050101357
申请日：2005-10-26
Applicant: 삼성전자주식회사
CPC classification number: H01G9/2009 , B82Y10/00 , B82Y20/00 , B82Y30/00 , H01G9/2031 , H01G9/2059 , H01L27/3227 , H01L27/3239 , H01L51/0035 , H01L51/0036 , H01L51/0086 , H01L51/502 , Y02E10/542 , Y02P70/521
Abstract: 본 발명은 기판 상에 형성된 투명전극과 상기 투명전극상에 광 반응성 염료가 흡착된 나노 결정으로 이루어진 반도체 전극으로 구성된 광흡수층, 정공수송층 및 대향전극을 포함하는 염료 감응형 태양 전지 및 양자점 발광층에 의한 표시 소자 기능이 복합화되어 형성된 것을 특징으로 하는 태양전지 구동형 표시소자 및 그의 제조방법에 관한 것이다. 본 발명에 의한 태양전지 구동형 표시소자는 별도의 전원공급장치 없이 태양광만으로도 표시소자 기능을 발휘하므로 고립 지역의 광고표시장치 또는 기타의 옥외광고용 표시장치로 응용될 수 있다.
태양전지, 표시소자, 염료감응형 태양전지, 양자점 발광층, 입도 조절-
Patent Agency Ranking
公开(公告)号：KR1020050061285A
公开(公告)日：2005-06-22
申请号：KR1020040088804
申请日：2004-11-03
Applicant: 삼성전자주식회사
IPC: G02F1/136
CPC classification number: H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/1651 , C23C18/1653 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/36 , C23C18/405 , H01L2924/0002 , H01L2924/00
Abstract: 본 발명은 저저항 금속패턴 형성 방법에 관한 것으로, 보다 상세하게(ⅰ) 광촉매 화합물을 기판에 코팅하여 광촉매 필름을 형성하는 단계; (ⅱ) 상기 광촉매 필름 상에 수용성 고분자 화합물을 코팅하여 수용성 고분자 층을 형성하는 단계; (ⅲ) 상기 광촉매 필름 및 수용성 고분자 층을 선택적으로 노광하여 결정성장용 핵의 잠재적 패턴을 수득하는 단계; 및 (ⅳ) 상기 결정성장용 핵의 잠재적 패턴을 도금처리하여 금속결정을 성장시켜 금속패턴을 수득하는 단계를 포함하는 금속패턴 형성방법에 관한 것이다. 본 발명에 따른 방법에 의할 경우, 저저항 금속을 포함한 다층 배선 패턴을 비교적 간단한 공정을 통해 형성할 수 있고, 각 층을 구성하는 금속도 필요에 따라 자유롭게 택할 수 있으며, 제조 단가도 저렴하여 LCD, PDP, EL과 같은 평판 표시 소자에 쉽게 적용할 수 있다.
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公开(公告)号：KR101109253B1
公开(公告)日：2012-01-30
申请号：KR1020050133664
申请日：2005-12-29
Applicant: 삼성전자주식회사
CPC classification number: G02F1/155 , G02F1/1533
Abstract: 본 발명은 플렉서블 전기변색 소자 및 그 제조방법에 관한 것으로, 더욱 상세하게는 감광성 절연막을 프린팅하여 절연층을 형성하고, 전기영동을 이용하여 소정의 패턴으로 정착된 반도체층을 가압하여 압축함으로써 표시소자의 콘트라스트 및 구동특성이 향상된 플렉서블 전기변색 소자 및 그 제조방법에 관한 것이다.
전기변색 소자, 감광성 절연막, 프린팅, 절연층, 전기영동, 가압, 반도체층-
公开(公告)号：KR1020080083790A
公开(公告)日：2008-09-19
申请号：KR1020070024433
申请日：2007-03-13
Applicant: 삼성전자주식회사
Abstract: An electroless copper plating solution is provided to form a copper plating film having excellent adhesive force and low electrical resistance, a method for preparing the electroless copper plating solution is provided, and an electroless copper plating method is provided to form an electroless copper plating film having stable and improved adhesive force and low electrical resistance by using the electroless copper plating solution. An electroless copper plating solution comprises a copper salt, a complex agent, a reducing agent, and a pH adjusting agent, wherein the plating solution comprises an acid solution of 2,2'-dipyridyl and has a pH range of 11.5 to 13.0. The electroless copper plating solution has mole ratios of the complex agent and the reducing agent to the copper salt of 1:3 and 1:4 respectively. The plating solution comprises 0.01 to 0.05 mole/L of a copper salt, 0.03 to 0.15 mole/L of a complex agent, 0.04 to 0.20 mole/L of a reducing agent, 0.1 to 0.2 mole/L of a pH adjusting agent, and 0.1 to 0.5 mmol/L of an acid solution of 2,2'-dipyridyl. A method for preparing an electroless copper plating solution comprises the steps of: sequentially dissolving a copper salt, a complex agent, and a reducing agent into water to prepare a plating solution; adjusting a pH(potential of hydrogen) of the plating solution to a range of 11.5 to 13.0 using a pH adjusting agent; dissolving 2,2'-dipyridyl into a mixed solution of water and an acid to prepare an acid solution of 2,2'-dipyridyl; and mixing the acid solution of 2,2'-dipyridyl with the pH-adjusted plating solution.
Abstract translation: 提供一种化学镀铜溶液以形成具有优异的粘合力和低电阻的铜电镀膜，提供了一种制备无电镀铜溶液的方法，并提供了化学镀铜方法以形成化学镀铜膜，其具有 通过使用无电解铜电镀液，稳定且改善的粘合力和低电阻。 无电镀铜溶液包括铜盐，络合剂，还原剂和pH调节剂，其中电镀溶液包含2,2'-联吡啶的酸溶液，pH范围为11.5至13.0。 化学镀铜溶液的复合剂和还原剂与铜盐的摩尔比分别为1:3和1:4。 电镀液含有0.01〜0.05摩尔/ L的铜盐，0.03〜0.15摩尔/升的络合剂，0.04〜0.20摩尔/升的还原剂，0.1〜0.2摩尔/升的pH调节剂，以及 0.1至0.5mmol / L的2,2'-联吡啶的酸溶液。 一种无电镀铜溶液的制备方法，包括以下步骤：将铜盐，络合剂和还原剂依次溶解在水中，制备电镀溶液; 使用pH调节剂将电镀液的pH（电位）调节至11.5〜13.0的范围; 将2,2'-联吡啶溶于水和酸的混合溶液中，制备2,2'-联吡啶的酸溶液; 并将2,2'-联吡啶的酸溶液与pH调节的电镀溶液混合。
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公开(公告)号：KR1020070080330A
公开(公告)日：2007-08-10
申请号：KR1020060011545
申请日：2006-02-07
Applicant: 삼성전자주식회사
CPC classification number: H01J29/02 , H01B1/127 , H01B1/128 , H01J9/02 , H01J11/10 , H01J11/22 , H01L31/022466 , H01L31/1884 , Y02E10/50
Abstract: A transparent electrode is provided to simply fabricate a transparent electrode with high penetration and low resistance by performing a plating process instead of a sputtering process necessitating expensive vacuum equipment. A grid electrode(20) is formed on a transparent substrate(10). A nano metal layer(30) is formed on the grid electrode. A conductive high polymer layer(40) is formed on the grid electrode and the nano metal layer. The substrate can be a transparent inorganic substrate like glass or quartz or a transparent plastic substrate selected from a group composed of PET(polyethylene terephthalate), PEN(polyethylene naphathalate), PES(polyethylene sulfone), polycarbonate, polystyrene, polyester, acrylic resin, olefin maleic copolymer and norbornene-based resin.
Abstract translation: 提供透明电极以通过执行电镀工艺而不是需要昂贵的真空设备的溅射工艺简单地制造具有高穿透性和低电阻的透明电极。 在透明基板（10）上形成栅电极（20）。 在栅电极上形成纳米金属层（30）。 在栅电极和纳米金属层上形成导电高分子层（40）。 基材可以是玻璃或石英的透明无机基材或选自PET（聚对苯二甲酸乙二醇酯），PEN（聚萘二甲酸乙二醇酯），PES（聚乙烯砜），聚碳酸酯，聚苯乙烯，聚酯，丙烯酸树脂， 烯烃马来酸共聚物和降冰片烯类树脂。
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公开(公告)号：KR1020070070792A
公开(公告)日：2007-07-04
申请号：KR1020050133664
申请日：2005-12-29
Applicant: 삼성전자주식회사
CPC classification number: G02F1/155 , G02F1/1533
Abstract: A flexible electrochromic device, and a method for manufacturing the same are provided to improve a driving characteristic of an electrochromic device by forming an insulating layer on a transparent electrode, and improve the characteristic of a display device by forming a pattern of high quality by electrophoretic deposition and a compression process. An insulating layer is formed on a flexible transparent electrode(10) except a predetermined pattern. A nanocrystalline semiconductor layer(30) is formed on the transparent electrode at the predetermined pattern by using electrophoretic deposition. An electrochromic monomolecular layer(40) is formed on the semiconductor layer. A flexible opposite electrode(50) is arranged to face the transparent electrode. An electrolyte(60) is formed in a space between the transparent electrode and the opposite electrode.
Abstract translation: 提供柔性电致变色器件及其制造方法，以通过在透明电极上形成绝缘层来改善电致变色器件的驱动特性，并通过电泳形成高品质图案来提高显示器件的特性 沉积和压缩过程。 在除了预定图案之外的柔性透明电极（10）上形成绝缘层。 通过使用电泳沉积，以预定图案在透明电极上形成纳米晶体半导体层（30）。 在半导体层上形成电致变色单分子层（40）。 柔性相对电极（50）布置成面对透明电极。 在透明电极和相对电极之间的空间中形成电解质（60）。
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