Abstract:
아연과 셀레늄, 그리고 선택적으로 황 및/또는 텔루리움을 포함하는 제1 반도체 나노결정을 포함하는 코어와, 아연, 그리고 황 및 셀레늄 중 하나 이상을 포함하는 제2 반도체 나노결정을 포함하는 쉘을 포함하는 비카듐계 양자점으로서, 상기 양자점은 13 nm 이상의 평균 입자 직경을 가지고, 440 nm 내지 470 nm 범위에서 발광 피크 파장을 가지며, 발광 파장의 반치폭은 25 nm 미만인 양자점, 이 양자점의 제조 방법, 이 양자점을 포함하는 양자점-폴리머 복합체, 및 이 양자점을 포함하는 전자 소자에 관한 것이다.
Abstract:
카드뮴을 포함하지 않고, 청색광을 방출하도록 구성되며, 아연 칼코겐화물을 포함하는 제1 반도체 나노결정을 포함하는 코어 및 상기 코어 위에 배치되고 아연, 셀레늄, 및 황을 포함하는 반도체 나노결정 쉘을 가지고 X선 회절 스펙트럼에서 징크 블랜드 결정 구조의 피크 면적에 대한 결함 피크 면적의 비율이 0.8 미만인 양자점들 및 이를 포함하는 전계 발광 소자를 제공한다. 상기 양자점은, 고분해능 투과 전자 현미경 (HR-TEM) 이미지의 고속 푸리에 변환 (Fast Fourier Transform)에 의해 얻어지는 회절 패턴(digital diffraction pattern)이 징크 블랜드 구조의 (100) facet 을 포함할 수 있다.
Abstract:
PURPOSE: An adhesive film for forming a multi-layered pattern is provided to have excellent adhesion, pattern formation, and to able to be quickly cured at low temperature. CONSTITUTION: An adhesive film for forming a multi-layered pattern comprises: a photocurable part adhesive layer comprising a binder resin, a radically polymerizable acrylate based monomer, and a photoradical initiator; and a heatcurable adhesive layer comprising a binder resin, a radical polymerizable acrylate based monomer, and a thermally radical initiator. The adhesive film is a bilayer in which the heatcurable adhesive layer(120) and the photocurable adhesive layer(130) are laminated on a substrate film(110) in order. The photocurable adhesive layer is formed to side of exposed surface, and the heatcurable adhesive layer is formed to side of an object.
Abstract:
PURPOSE: A method for manufacturing a semiconductor package and a die for the semiconductor package are provided to maintain adhesive force between dies by laminating an adhesive film on a back side of a wafer after a rewiring process. CONSTITUTION: A wafer(100) in which a through electrode(110) is formed is prepared(S1-1). A bump is formed on the through electrode. A first photosensitivity adhesive film(210) is laminated on a front side of the wafer(S1-2). A negative pattern(210") corresponding to the through electrode is formed through UV light exposure and alkaline development(S1-3)(S1-4). A pattern corresponding to the through electrode is formed on a backside of a re-wired wafer with a photosensitive adhesive film.
Abstract:
PURPOSE: A photosensitive adhesive composition and an adhesive film for forming pattern are provided to have excellent pattern formability and adhesion, and to obtain enough crosslinked density after curing. CONSTITUTION: A photosensitive adhesive composition comprise an epoxy resin, an alkali-developable binder resin, a radically polymerizable (meth)acrylate-based monomer, a photopolymerizable initiator, and residual solvent. The epoxy resin is alkali-soluble epoxy resin. The alkali-soluble epoxy resin is a copolymer of one or more kinds selected from a group consisting of maleimide derivatives and maleic anhydride derivatives, and one or more kinds selected from a group consisting of (meth)acrylate based monomer with an epoxy group, a vinyl-based monomer, and a mixture thereof.
Abstract:
PURPOSE: An adhesive film composition for forming pattern is provided to have excellent adhesion, and pattern formation, and to be able to be quickly cured at low temperature. CONSTITUTION: An adhesive film composition for forming pattern comprises a binder resin, a radically polymerizable acrylate based monomer, a photoradical initiator, a heat radical initiator, and a residual solvent. The comprised amount of the pho radical initiator is 0.1-5 weight% based on solid phase of the adhesive film composition. The thermal polymerization initiating temperature of the thermal radical initiator is 80-150 °C. The weight average molecular weight of the radical polymerizable acrylate based monomer is 100-20000 g/mol.