냉장고
    2.
    发明授权

    公开(公告)号:KR102222572B1

    公开(公告)日:2021-03-05

    申请号:KR1020140139425

    申请日:2014-10-16

    Abstract: 단열효과가향상되도록개선된구조를가지는냉장고를개시한다. 냉장고는내상및 외상을구비하는본체, 상기내상의내부에형성되는저장실, 상기저장실을단열하도록상기내상및 상기외상사이에마련되는단열재및 상기본체의강성확보가가능하도록인접한상기단열재의사이에배치되고, 상기내상및 상기외상중 적어도하나에결합되는적어도하나의결합면을가지는프레임유닛을포함할수 있다.

    냉장고
    3.
    发明公开
    냉장고 审中-实审
    冰箱

    公开(公告)号:KR1020160044723A

    公开(公告)日:2016-04-26

    申请号:KR1020140139425

    申请日:2014-10-16

    CPC classification number: F25D23/065 F25D23/063 F25D25/00 F25D2201/14

    Abstract: 단열효과가향상되도록개선된구조를가지는냉장고를개시한다. 냉장고는내상및 외상을구비하는본체, 상기내상의내부에형성되는저장실, 상기저장실을단열하도록상기내상및 상기외상사이에마련되는단열재및 상기본체의강성확보가가능하도록인접한상기단열재의사이에배치되고, 상기내상및 상기외상중 적어도하나에결합되는적어도하나의결합면을가지는프레임유닛을포함할수 있다.

    Abstract translation: 本文公开了一种具有改进的结构以提高绝缘性能的冰箱。 冰箱可以包括:主体,包括内壳和外壳; 形成在内壳中的储藏室; 绝缘体,设置在所述内壳体和所述外壳体之间以使所述储藏室绝缘; 以及框架单元,其设置在所述相邻的绝缘体之间,以确保所述主体的刚度,并且包括与所述内壳体和所述外壳体中的至少一个联接的至少一个联接表面。

    반도체 메모리 장치용 결함 셀 검출 방법 및 회로
    4.
    发明公开
    반도체 메모리 장치용 결함 셀 검출 방법 및 회로 无效
    用于半导体存储器件的有缺陷的电池检测方法和电路

    公开(公告)号:KR1020100102958A

    公开(公告)日:2010-09-27

    申请号:KR1020090021294

    申请日:2009-03-12

    CPC classification number: G11C29/04 G01R31/318563 G11C2207/105

    Abstract: PURPOSE: A defective cell detection method and a defective cell detection circuit for a semiconductor memory device are detect the location of defective cells by selecting each bit from read test data from a memory core and outputting the selected bit to an output pad. CONSTITUTION: A memory core(12) is connected with a sense amplifying circuit(13). The sense amplifying circuit is connected with a single bit data outputting unit(14) through a first switching unit(S1). The single bit data outputting unit is connected with an output pad(15) through a switching unit(S2). An internal circuit controller(11) transmits a control signal to an internal configuration circuit and controls the internal configuration circuit.

    Abstract translation: 目的:用于半导体存储器件的缺陷单元检测方法和缺陷单元检测电路通过从存储器核心的读取测试数据中选择每一位来检测缺陷单元的位置,并将所选位输出到输出板。 构成:存储器芯(12)与感测放大电路(13)连接。 感测放大电路通过第一切换单元(S1)与单位数据输出单元(14)连接。 单位数据输出单元通过切换单元(S2)与输出焊盘(15)连接。 内部电路控制器(11)将控制信号发送到内部配置电路并控制内部配置电路。

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