Abstract:
본원은, 플렉서블 비휘발성 메모리 소자용 강유전체 캐패시터, 트랜지스터형 플렉서블 비휘발성 강유전체 메모리 소자, 1T-1R(1Transistor-1Resistor) 플렉서블 강유전체 메모리 소자 및 이들의 제조 방법에 관한 것으로서, 강유전체층과 반도체층 사이의 계면에 고분자 접착층을 형성함으로써 계면에서의 전기적 특성 및 물리화학적 특성을 향상시킬 수 있다.
Abstract:
본원은, 플렉서블 비휘발성 메모리 소자용 강유전체 캐패시터, 트랜지스터형 플렉서블 비휘발성 강유전체 메모리 소자, 1T-1R(1Transistor-1Resistor) 플렉서블 강유전체 메모리 소자 및 이들의 제조 방법에 관한 것으로서, 강유전체층과 반도체층 사이의 계면에 고분자 접착층을 형성함으로써 계면에서의 전기적 특성 및 물리화학적 특성을 향상시킬 수 있다.
Abstract:
PURPOSE: A ferroelectric capacitor for a flexible nonvolatile memory device, a flexible nonvolatile ferroelectric memory device, and a manufacturing method thereof are provided to improve electric, physical, and chemical properties in an interface between a ferroelectric layer and a semiconductor layer. CONSTITUTION: A contact layer(110) is formed on a flexible substrate(100). A first electrode(120) is formed on the contact layer. A ferroelectric layer(130) is formed on the first electrode. A second electrode(140) is formed on the ferroelectric layer. An insulation layer(150) is formed on the second electrode layer. A polymer protection layer(160) is formed on the second electrode.
Abstract:
PURPOSE: A ferroelectric capacitor for a flexible nonvolatile memory device, a flexible nonvolatile ferroelectric memory device, and a method for manufacturing the same are provided to improve the performance of a flexible memory by using a ferroelectric layer. CONSTITUTION: A semiconducting channel layer(510) is formed on a flexible substrate. A source and a drain region(520,530) are formed at both sides of the semiconductor channel layer. A barrier layer(540) is formed on the semiconductor channel layer. A ferroelectric layer(550) is formed on the barrier layer. A source and a drain electrode(570,580) are formed on the source and the drain region.
Abstract:
본원은, 플렉서블 비휘발성 메모리 소자용 강유전체 캐패시터, 트랜지스터형 플렉서블 비휘발성 강유전체 메모리 소자, 1T-1R(1Transistor-1Resistor) 플렉서블 강유전체 메모리 소자 및 이들의 제조 방법에 관한 것으로서, 강유전체층과 반도체층 사이의 계면에 고분자 접착층을 형성함으로써 계면에서의 전기적 특성 및 물리화학적 특성을 향상시킬 수 있다.
Abstract:
PURPOSE: A ferroelectric capacitor for a flexible nonvolatile memory device, a flexible nonvolatile ferroelectric memory device, and a method for manufacturing the same are provided to improve an electrical property by using a polymer bonding layer. CONSTITUTION: A source and a drain region(520,530) are formed at both sides of a semiconducting channel layer(510). A barrier layer(540) is formed on the drain region. A ferroelectric layer(550) is formed on the barrier layer. A source electrode(570) is formed on the source region. A drain electrode(580) is formed on the ferroelectric layer and a gate dielectric layer.
Abstract:
PURPOSE: A ferroelectric capacitor for a flexible nonvolatile memory device, a flexible nonvolatile ferroelectric memory device, and a method for manufacturing the same are provided to easily process a device. CONSTITUTION: A semiconducting channel layer(510) is formed on a flexible substrate(500). A source and a drain region(520,530) are formed at both sides of the semiconductor channel layer. A polymer bonding layer is formed on the semiconductor channel layer. A gate electrode(590) is formed on a ferroelectric layer(550). The source and the drain electrode(570,580) are formed on the source and the drain region.