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公开(公告)号：KR101145741B1
公开(公告)日：2012-05-16
申请号：KR1020100071811
申请日：2010-07-26
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a method for fabricating the same are provided to prevent an electrical short circuit which is generated from a metal pattern by coating the metal pattern of a probe unit with a protective layer comprised of an insulating material. CONSTITUTION: At least one metal pattern(120) is formed in one side of a substrate(110). A metal coating layer(130) is formed in the substrate so that the metal coating layer is connected to the metal pattern on the inner wall of a connecting through hole. A protective film(140) comprised of the insulating film is formed in the upper part of the metal pattern. A probe part(150) comprises a probe(151), a main body member(152), and an align part(153). A PCB(Printed Circuit Board) part(160) is attached to the upper side of the metal pattern.
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公开(公告)号：KR1020110135574A
公开(公告)日：2011-12-19
申请号：KR1020100055384
申请日：2010-06-11
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a manufacturing method thereof are provided to prevent signal loss due to the twisting phenomenon of a printed circuit board part by bonding the printed circuit board part on the upper side of a metal pattern which is formed on a insulating board. CONSTITUTION: A connection bump(112) is perpendicularly projected in one side of a first substrate. One or more metal patterns and a connection through hole which is contiguous to the metal pattern are formed in one side of a second substrate according to each metal pattern. The connection bump is inserted into one side of the connection through hole. A probe part(130) is inserted to the other side of the connection through hole and the first substrate and the probe part are welded in the second substrate. A PCB(Printed Circuit Board) part is attached to the metal pattern which is formed in the second substrate.
Abstract translation: 目的：提供探针单元及其制造方法，以通过将形成在绝缘板上的金属图案的上侧的印刷电路板部分接合来防止印刷电路板部分的扭曲现象引起的信号损失。 构成：连接凸块（112）垂直地投影在第一基板的一侧。 根据每种金属图案，在第二基板的一侧形成一个或多个金属图案和与金属图案相邻的连接通孔。 连接凸块插入连接通孔的一侧。 探针部分（130）被插入到连接通孔的另一侧，并且第一基底和探针部分被焊接在第二基底中。 PCB（印刷电路板）部分附接到形成在第二基板中的金属图案。
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公开(公告)号：KR101132574B1
公开(公告)日：2012-04-05
申请号：KR1020100068847
申请日：2010-07-16
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a manufacturing method thereof are provided to prevent misalignment due to a bonding process and an alignment process between metal patterns. CONSTITUTION: A metal pattern is formed on one side of a substrate(110) and is filled with metal paste. The metal pattern is connected to the substrate in a connection penetration unit. A protection film(140) is coated on the upper side of the metal pattern and is comprised of insulation materials. A PCB(160) is attached to the upper side of the metal pattern and is connected to a measurement instrument. A probe unit(150) is connected to the metal paste.
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公开(公告)号：KR101133092B1
公开(公告)日：2012-04-04
申请号：KR1020100074150
申请日：2010-07-30
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a method for fabricating the same are provided to reduce manufacturing costs by easily inserting a probing part to the connection through hole to be combined with a substrate. CONSTITUTION: A substrate(120) forms at least one metal pattern in top side, and it forms a connection through hole and exposes a part of a metal pattern to the outside through the bottom side. The substrate fills a metal connected to the metal pattern which is exposed to the connection through hole through a plating process. A protecting film(110) is formed on the top of the metal pattern. A Printed Circuit Board(140) is attached to the top side of the metal pattern. A probe part(130) is inserted into the connection through hole in which the metal is filled.
Abstract translation: 目的：提供一种探针单元及其制造方法，以通过将探测部分容易地插入到连接通孔中而与基板结合来降低制造成本。 组成：衬底（120）在顶侧形成至少一个金属图案，并且其形成连接通孔并且通过底侧将部分金属图案暴露到外部。 衬底通过电镀工艺填充连接到暴露于连接通孔的金属图案的金属。 保护膜（110）形成在金属图案的顶部上。 印刷电路板（140）连接到金属图案的顶侧。 探针部分（130）插入其中填充有金属的连接通孔中。
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Patent Agency Ranking
公开(公告)号：KR101127117B1
公开(公告)日：2012-03-22
申请号：KR1020100055384
申请日：2010-06-11
Applicant: 성균관대학교산학협력단
Abstract: 프로브 유닛 제조 방법은 (a) 제 1 기판의 일면에 연결 범프(bump)를 돌출 형성하는 단계, (b) 제 2 기판의 일면에 하나 이상의 금속 패턴 및 상기 금속 패턴과 인접하는 연결 관통구를 각 금속 패턴별로 형성하는 단계, (c) 연결 관통구의 일측에 연결 범프를 삽입하고, 연결 관통구의 타측에 탐침부를 삽입하여 제 1 기판 및 탐침부를 제 2 기판에 접합시키는 단계 및 (d) 제 2 기판에 형성된 금속 패턴에 PCB(Printed Circuit Board )부를 부착하는 단계를 포함한다.
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公开(公告)号：KR1020120012161A
公开(公告)日：2012-02-09
申请号：KR1020100074150
申请日：2010-07-30
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a method for fabricating the same are provided to reduce manufacturing costs by easily inserting a probing part to the connection through hole to be combined with a substrate. CONSTITUTION: A substrate(120) forms at least one metal pattern in top side, and it forms a connection through hole and exposes a part of a metal pattern to the outside through the bottom side. The substrate fills a metal connected to the metal pattern which is exposed to the connection through hole through a plating process. A protecting film(110) is formed on the top of the metal pattern. A Printed Circuit Board(140) is attached to the top side of the metal pattern. A probe part(130) is inserted into the connection through hole in which the metal is filled.
Abstract translation: 目的：提供探针单元及其制造方法，通过将探测部分容易地插入到与基底组合的连接通孔中来降低制造成本。 构成：衬底（120）在顶侧形成至少一个金属图案，并且其形成连接通孔，并且通过底侧将一部分金属图案暴露于外部。 基板填充连接到金属图案的金属，金属图案通过电镀工艺暴露于连接通孔。 在金属图案的顶部形成保护膜（110）。 印刷电路板（140）附接到金属图案的顶侧。 探针部分（130）插入到金属填充的连接通孔中。
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公开(公告)号：KR1020120010349A
公开(公告)日：2012-02-03
申请号：KR1020100071811
申请日：2010-07-26
Applicant: 성균관대학교산학협력단
CPC classification number: G01R1/06761 , G01R3/00
Abstract: PURPOSE: A probe unit and a method for fabricating the same are provided to prevent an electrical short circuit which is generated from a metal pattern by coating the metal pattern of a probe unit with a protective layer comprised of an insulating material. CONSTITUTION: At least one metal pattern(120) is formed in one side of a substrate(110). A metal coating layer(130) is formed in the substrate so that the metal coating layer is connected to the metal pattern on the inner wall of a connecting through hole. A protective film(140) comprised of the insulating film is formed in the upper part of the metal pattern. A probe part(150) comprises a probe(151), a main body member(152), and an align part(153). A PCB(Printed Circuit Board) part(160) is attached to the upper side of the metal pattern.
Abstract translation: 目的：提供探针单元及其制造方法，以通过用由绝缘材料构成的保护层涂覆探针单元的金属图案来防止由金属图案产生的电短路。 构成：在衬底（110）的一侧形成至少一个金属图案（120）。 在基板上形成金属被覆层（130），金属被覆层与连接孔的内壁上的金属图案连接。 在金属图案的上部形成由绝缘膜构成的保护膜（140）。 探针部分（150）包括探针（151），主体部件（152）和对准部分（153）。 PCB（印刷电路板）部分（160）附接到金属图案的上侧。
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公开(公告)号：KR1020120008158A
公开(公告)日：2012-01-30
申请号：KR1020100068847
申请日：2010-07-16
Applicant: 성균관대학교산학협력단
Abstract: PURPOSE: A probe unit and a manufacturing method thereof are provided to prevent misalignment due to a bonding process and an alignment process between metal patterns. CONSTITUTION: A metal pattern is formed on one side of a substrate(110) and is filled with metal paste. The metal pattern is connected to the substrate in a connection penetration unit. A protection film(140) is coated on the upper side of the metal pattern and is comprised of insulation materials. A PCB(160) is attached to the upper side of the metal pattern and is connected to a measurement instrument. A probe unit(150) is connected to the metal paste.
Abstract translation: 目的：提供探针单元及其制造方法，以防止金属图案之间的接合过程和对准过程引起的未对准。 构成：金属图案形成在基板（110）的一侧，并且填充有金属浆料。 金属图案在连接穿透单元中连接到基板。 保护膜（140）涂覆在金属图案的上侧，并由绝缘材料构成。 PCB（160）连接到金属图案的上侧并连接到测量仪器。 探针单元（150）连接到金属糊。
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公开(公告)号：KR101064296B1
公开(公告)日：2011-09-14
申请号：KR1020100074181
申请日：2010-07-30
Applicant: 성균관대학교산학협력단
Abstract: 프로브 유닛 제조 방법은 (a) 제 1 기판의 상부면에 하나 이상의 금속 패턴을 형성하는 단계, (b) 제 1 기판의 하부면을 통해 금속 패턴의 일부가 노출되도록, 각 금속 패턴별로 연결 관통구를 형성하고, 연결 관통구의 내부면에 금속 패턴과 접속하는 금속막을 형성하는 단계, (c) 제 1 기판의 상부면에 형성된 금속 패턴의 상부에 보호막을 형성하는 단계, (d) 제 2 기판에 연결 관통구에 삽입되어 금속막에 접속되는 탐침부를 형성하는 단계, (e) 탐침부를 연결 관통구에 삽입하여 제 2 기판을 제 1 기판에 접합시키는 단계, (f) 제 1 기판으로부터 연결 관통구에 삽입된 탐침부를 제외한 제 2 기판을 제거하는 단계 및 (g) 제 1 기판의 상부면에 형성된 금속 패턴의 상부에 PCB(Printed Circuit Board)부를 부착하는 단계를 포함한다.
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