公开(公告)号：KR1020090127147A

公开(公告)日：2009-12-09

申请号：KR1020097020341

申请日：2007-12-21

Applicant: 소니 주식회사

Inventor： 후꾸다도시오 ,  노모또아끼히로

IPC: H01L21/288 ,  H01L21/3205 ,  H01L21/336 ,  H01L21/786

CPC classification number: H05K3/046 ,  H01L29/41733 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/0545 ,  H01L51/102 ,  H05K3/207 ,  H05K2203/0108 ,  H05K2203/0528 ,  H05K2203/0783 ,  H05K2203/1105

Abstract: A patterning method comprising a first step for forming a conductive film (D) by coating a first plate (10) with a liquid composition and for heating the first plate (10); a second step for forming a conductive pattern (D') on the first plate (10) by pressing a second plate (20) having an irregular pattern shape on the surface against the surface of the first plate (10) whereupon the conductive film (D) is formed and by transferring the unnecessary pattern of the conductive film (D) to the top surface of the protrusions (20a) of the second plate (20) to remove the unnecessary pattern; and a third step for transferring the conductive pattern (D') to the surface of a substrate (30) whereupon the pattern is to be transferred, by pressing the surface of the first plate (10), on which the conductive pattern (D') is formed, against the surface of the substrate (30). The liquid composition contains a solvent exhibiting vapor pressure of 133 Pa or below at the surface temperature of the heated first plate (10). A method for fabricating an electronic element is also provided. A minute and precise pattern is stably formed with good reproducibility by stabilizing the state of the liquid composition coating.

Abstract translation: 一种图案化方法，包括通过用液体组合物涂覆第一板（10）并加热第一板（10）形成导电膜（D）的第一步骤; 第二步骤，通过在第一板（10）的表面上压制具有不规则图案形状的第二板（20），在第一板（10）上形成导电图案（D'），由此导电膜 D）形成，并且通过将导电膜（D）的不必要图案转印到第二板（20）的突起（20a）的顶表面以去除不需要的图案; 以及第三步骤，通过按压第一板（10）的表面将导电图案（D'）转印到基板（30）的表面上，从而传输图案，其中导电图案（D'） ）形成在衬底（30）的表面上。 液体组合物含有在加热的第一板（10）的表面温度下表现出133Pa以下的蒸气压的溶剂。 还提供了一种用于制造电子元件的方法。 通过稳定液体组合物涂层的状态，以良好的再现性稳定地形成微小和精确的图案。

公开(公告)号：KR1020110036672A

公开(公告)日：2011-04-08

申请号：KR1020100092877

申请日：2010-09-24

Applicant: 소니 주식회사

Inventor： 노모또아끼히로 ,  오노히데끼

IPC: H01L51/40 ,  H01L21/027 ,  H01L29/786

CPC classification number: H01L51/0015 ,  H01L51/0011 ,  H01L51/0545 ,  H01L51/0558 ,  H01L21/0274 ,  G03F7/2041 ,  G03F7/2043 ,  G03F7/70341 ,  H01L29/786 ,  H01L29/78606

Abstract: PURPOSE: A semiconductor device manufacturing method is provided to pattern an organic semiconductor layer while keeping the condition of a surface and the uniformity of a film, thereby separating elements while guaranteeing a sufficient feature. CONSTITUTION: An organic semiconductor layer(9) is formed on a substrate(1). A protection pattern(11) is formed on the organic semiconductor layer. The organic semiconductor layer is dissolved in an organic solvent or sublimated using the protection pattern as a mask so that the organic semiconductor layer is patterned. The protection pattern is formed by a printing method.

Abstract translation: 目的：提供半导体器件制造方法以在保持表面状态和膜的均匀性的同时对有机半导体层进行图案化，从而分离元件，同时保证足够的特征。 构成：在基板（1）上形成有机半导体层（9）。 在有机半导体层上形成保护图案（11）。 将有机半导体层溶解在有机溶剂中或使用保护图案作为掩模进行升华，以使有机半导体层被图案化。 保护图案通过印刷方法形成。

公开(公告)号：KR1020110013250A

公开(公告)日：2011-02-09

申请号：KR1020100070822

申请日：2010-07-22

Applicant: 소니 주식회사

Inventor： 노모또아끼히로

IPC: H05K3/40 ,  H01L51/05 ,  H01L21/336

CPC classification number: H05K1/16 ,  H05K3/1275 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/10174 ,  H05K2203/1476

Abstract: PURPOSE: A method for manufacturing a circuit board and the circuit board are provided to prevent the deterioration of a connection material pattern by forming the connection material pattern after an upper wiring pattern is formed. CONSTITUTION: A lower wiring pattern(3) is formed on a substrate(1). An insulation layer(5) is formed on the substrate to cover the lower wiring pattern. An opening unit is formed on the insulation layer to expose the lower wiring pattern. The upper wiring pattern(7) is formed on the insulation layer. A connection material pattern(9) is formed on the sidewall of the opening unit of the insulation layer to connect the upper and lower wiring patterns. The connection material pattern is made of organic semiconductor materials.

Abstract translation: 目的：提供一种制造电路板和电路板的方法，用于通过在形成上部布线图案之后形成连接材料图案来防止连接材料图案的劣化。 构成：在基板（1）上形成较低的布线图案（3）。 在基板上形成绝缘层（5）以覆盖下布线图案。 在绝缘层上形成开口单元以露出下布线图案。 上部布线图案（7）形成在绝缘层上。 连接材料图案（9）形成在绝缘层的开口单元的侧壁上，以连接上下布线图案。 连接材料图案由有机半导体材料制成。

公开(公告)号：KR1020100014666A

公开(公告)日：2010-02-10

申请号：KR1020097020336

申请日：2008-01-10

Applicant: 소니 주식회사

Inventor： 후꾸다도시오 ,  노모또아끼히로

IPC: H01L21/027 ,  H01L21/28

CPC classification number: H05K3/207 ,  H01L51/0022 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/102 ,  H05K3/046 ,  H05K2203/0108

Abstract: A method for forming a minute and precise pattern stably and a method for fabricating an electronic element. The patterning method comprises a step for forming a conductive film (D) by coating a first plate (10) with a liquid constituent; a second step for forming a conductive pattern (D') on the first plate (10) by pressing a second plate (20) against the surface of the first plate (10) whereupon the conductive film (D) is formed, and by transferring the unnecessary pattern of the conductive film (D) to the top surface of the protrusions (20a) of the second plate (20) to remove the unnecessary pattern; and a step for transferring the conductive pattern (D') by pressing the surface of the first plate (10), on which the conductive pattern (D') is formed, against the surface of a substrate whereupon the pattern is to be transferred.The composition of the liquid constituent or the surface material of the first plate (10) or the second plate (20) is set to satisfy a relation of γ>α>=β, assuming the surface tension on the surface of the first plate (10) to be coated with the liquid constituent is α, the dynamic surface tension of the liquid constituent at the time of 100 msec by greatest bubble pressure method is β, and the surface tension on the top surface of the protrusions (20a) in the second plate (20) is γ. A method for fabricating an electronic element is also provided.

Abstract translation: 一种稳定地形成微细精密图案的方法及其制造方法。 图案化方法包括通过用液体成分涂覆第一板（10）形成导电膜（D）的步骤; 第二步骤，通过将第二板（20）压靠在第一板（10）的表面上形成导电膜（D）并通过转印（D）形成第一板（10）上的导电图案（D'） 将所述导电膜（D）的不需要的图形提供到所述第二板（20）的所述突起（20a）的顶表面以去除所述不需要的图案; 以及通过将形成有导电图案（D'）的第一板（10）的表面压靠在要传输图案的基板的表面上来转印导电图案（D'）的步骤。 假设第一板（10）或第二板（20）的表面的表面张力（第一板（10））或第二板（20）的表面材料的组成或者表面材料的组成满足γ>α> =β的关系 10）涂布液体成分为α时，通过最大气泡压力法在100毫秒时液体成分的动态表面张力为β，并且在上述突起（20a）的上表面上的表面张力为 第二板（20）为γ。 还提供了一种用于制造电子元件的方法。