公开(公告)号：KR1020020019382A

公开(公告)日：2002-03-12

申请号：KR1020010046121

申请日：2001-07-31

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 다또노부요시 ,  니시나신야

IPC: H01L23/50

CPC classification number: H01S5/02415 ,  H01L2924/0002 ,  H01S5/02216 ,  H01S5/02284 ,  H01L2924/00

Abstract: PURPOSE: To provide a production method for optical semiconductor module with which the thermal resistance of a soldering part between an electronic cooling element and an optical semiconductor device is reduced, and heat conduction is improved by preventing a low temperature solder provided on the top of the electronic cooling element from being oxidized when bonding the electronic cooling element on an optical semiconductor container. CONSTITUTION: When bonding an electronic cooling element 10 on a bottom plate 2 of the optical semiconductor container, the element is soldered in a hydrogen atmosphere. The electronic cooling element 10 is provided with a PbSn solder 14 on the surface of a ceramics substrate on the side to be bonded to the bottom plate 2, and a BiSn solder 13 of a lower melting point than that of the PbSn solder 14 is previously applied to the surface of the ceramics substrate on the opposite side to package the optical semiconductor device.

Abstract translation: 目的：提供一种光半导体模块的制造方法，其中电子冷却元件和光半导体器件之间的焊接部件的热阻降低，并且通过防止设置在电子冷却元件的顶部的低温焊料来提高热传导 电子冷却元件在将电子冷却元件接合在光学半导体容器上时被氧化。 构成：将电子冷却元件10接合在光学半导体容器的底板2上时，元件在氢气氛中焊接。 电子冷却元件10在陶瓷基板的与底板2接合的一侧的表面上设置有PbSn焊料14，并且预先具有比PbSn焊料14的熔点低的BiSn焊料13 施加到相对侧的陶瓷基板的表面以封装光学半导体器件。

公开(公告)号：KR100436876B1

公开(公告)日：2004-06-23

申请号：KR1020010046121

申请日：2001-07-31

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 다또노부요시 ,  니시나신야

IPC: H01L23/50

CPC classification number: H01S5/02415 ,  H01L2924/0002 ,  H01S5/02216 ,  H01S5/02284 ,  H01L2924/00

Abstract: A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere. The soldering in a hydrogen atmosphere prevents oxidation of a low temperature solder provided on the uppermost surfaces of the electronic cooling element and conduction of the heat at the soldered joint portion between the electronic cooling element and the optical semiconductor element is improved.

Abstract translation: 一种制造光学半导体模块的方法，包括将电子冷却元件连接到光学半导体封装的底板并将光学半导体元件安装在电子冷却元件上，其中电子冷却元件焊接到光学底座的底板 半导体封装在氢气氛中。 在氢气氛中进行焊接防止了设置在电子冷却元件的最上表面上的低温焊料的氧化，并且改善了电子冷却元件和光学半导体元件之间的焊接接合部处的热传导。 ＆lt;图像＆GT;

公开(公告)号：KR1020030004030A

公开(公告)日：2003-01-14

申请号：KR1020020035684

申请日：2002-06-25

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 타토노부요시 ,  니시코지 ,  니시나신야

IPC: H01L23/02

CPC classification number: H01L31/02002 ,  H01L23/10 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PURPOSE: To provide a hermetically sealed package of an optical semiconductor wherein heat generation of a metallized wiring layer installed at a ceramic terminal member is reduced, a larger current than that of the conventional packages is allowed to flow with reduced power consumption and output of the package is stabilized, and to provide an optical semiconductor module using the same. CONSTITUTION: The hermetically sealed package of the optical semiconductor is characterized by having a first electrode layer installed at the ceramic terminal member, a second electrode layer perpendicularly connected to the first electrode layer directed to the top of the first electrode layer, and one or more of layers of a third electrode layer perpendicularly connected to the second electrode layer.

Abstract translation: 目的：为了提供一种密封的光学半导体封装，其中安装在陶瓷端子部件上的金属化布线层的发热减少，比传统封装的电流更大，可以减少电力消耗和输出 封装稳定，并提供使用其的光学半导体模块。 构成：光学半导体的密封封装的特征在于具有安装在陶瓷端子部件上的第一电极层，垂直于第一电极层垂直连接到第一电极层顶部的第二电极层和一个或多个 的垂直于第二电极层的第三电极层的层。