公开(公告)号：KR1020030004030A

公开(公告)日：2003-01-14

申请号：KR1020020035684

申请日：2002-06-25

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 타토노부요시 ,  니시코지 ,  니시나신야

IPC: H01L23/02

CPC classification number: H01L31/02002 ,  H01L23/10 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PURPOSE: To provide a hermetically sealed package of an optical semiconductor wherein heat generation of a metallized wiring layer installed at a ceramic terminal member is reduced, a larger current than that of the conventional packages is allowed to flow with reduced power consumption and output of the package is stabilized, and to provide an optical semiconductor module using the same. CONSTITUTION: The hermetically sealed package of the optical semiconductor is characterized by having a first electrode layer installed at the ceramic terminal member, a second electrode layer perpendicularly connected to the first electrode layer directed to the top of the first electrode layer, and one or more of layers of a third electrode layer perpendicularly connected to the second electrode layer.

Abstract translation: 目的：为了提供一种密封的光学半导体封装，其中安装在陶瓷端子部件上的金属化布线层的发热减少，比传统封装的电流更大，可以减少电力消耗和输出 封装稳定，并提供使用其的光学半导体模块。 构成：光学半导体的密封封装的特征在于具有安装在陶瓷端子部件上的第一电极层，垂直于第一电极层垂直连接到第一电极层顶部的第二电极层和一个或多个 的垂直于第二电极层的第三电极层的层。