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公开(公告)号：KR101079892B1
公开(公告)日：2011-11-04
申请号：KR1020040042024
申请日：2004-06-09
Applicant: 스미토모덴키고교가부시키가이샤
CPC classification number: C25D3/66
Abstract: 브롬화리튬과브롬화세슘과알칼리금속의할로겐화물및/또는알칼리토류금속할로겐화물을함유한전기주조용용융염욕(9)이다. 더욱도전성기판(1) 위에레지스트패턴(2)을형성해서도전성기판(1)의일부를노출시키는공정과, 레지스트패턴(2)이형성된도전성기판(1)을, 석출시키는금속및/또는석출시키는금속의화합물이첨가되어있는전기주조용용융염욕(9)에침지시키는공정과, 도전성기판 (1)이노출하고있는부분에금속을석출시키는공정을함유한금속제품의제조방법이다. 또, 브롬화리튬과브롬화세슘과알칼리금속의할로겐화물및/또는알칼리토류금속의할로겐화물을혼합해서이루어지는전기주조용용융염욕(9)이다.
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公开(公告)号：KR1020050001320A
公开(公告)日：2005-01-06
申请号：KR1020040042024
申请日：2004-06-09
Applicant: 스미토모덴키고교가부시키가이샤
CPC classification number: C25D3/66
Abstract: PURPOSE: To provide a molten salt bath for electroforming, the molten salt bath enabling electroforming to be performed at a low temperature by mixing three or more halides, thereby lowering melting point of molten salts composing the molten salt bath, and a method for manufacturing metal products using the molten salt bath for electroforming. CONSTITUTION: The molten salt bath for electroforming(9) contains halides of lithium bromide, cesium bromide and alkali metals and/or halides of alkaline earth metals. The method for manufacturing metal products comprises a process of forming a resist pattern on a conductive substrate so that a part of the conductive substrate is exposed; a process of dipping the resist pattern formed conductive substrate into a molten salt bath for electroforming to which precipitation metals and/or precipitation metal compounds are added; and a process of precipitating the metals on an exposed portion of the conductive substrate.
Abstract translation: 目的：为了提供用于电铸的熔融盐浴，可以通过混合三种或更多种卤化物在低温下进行电铸，从而降低构成熔融盐浴的熔融盐的熔点，以及金属制造方法 使用熔融盐浴进行电铸的产品。 构成：用于电铸（9）的熔融盐浴包含溴化锂，溴化铯和碱金属和/或碱土金属卤化物的卤化物。 金属制品的制造方法包括在导电性基板上形成抗蚀剂图案，使导电性基板的一部分露出的工序。 将形成有导电性基板的抗蚀剂图案浸渍到添加沉淀金属和/或析出金属化合物的电铸熔融盐浴中的工序; 以及在导电基板的暴露部分上沉淀金属的过程。
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