광파이버용 모재의 제조방법
    2.
    发明授权
    광파이버용 모재의 제조방법 失效
    光纤预制件的制备方法

    公开(公告)号:KR1019890003705B1

    公开(公告)日:1989-09-30

    申请号:KR1019850004762

    申请日:1985-07-03

    Abstract: A glass preform for optical fibers is produced using two burners, one for forming the preform core, producing a stream of glass raw material consisting of SiCl4 and the other for forming the preform cladding and producing a stream of second raw material consisting of a cpd. or cpds. from the gp. SiHCl3, SiH2Cl2, SiH3C1 and SiH4. The glass raw material is hydrolysed by the flame to synthesise fine glass particles, which are deposited on to a starting member having a longitudinal axis. The shoot preform so produced is then heated and sintered to obtain a transparent glass preform. Shoot particles are deposited and grown in a direction parallel to the axis of the starting member.

    Abstract translation: 使用两个燃烧器制造用于光纤的玻璃预制件,一个用于形成预制棒芯,产生由SiCl 4组成的玻璃原料流,另一个用于形成预制件包层并产生由cpd组成的第二原料流。 或cpds。 从gp。 SiHCl 3,SiH 2 Cl 2,SiH 3 Cl和SiH 4。 玻璃原料被火焰水解,合成细微的玻璃颗粒,其沉积在具有纵向轴线的起始构件上。 然后将如此制备的枝条预制件加热并烧结以获得透明玻璃预制件。 拍摄颗粒在平行于起始构件的轴线的方向上沉积并生长。

    광파이버용 모재의 제조방법
    4.
    发明授权
    광파이버용 모재의 제조방법 失效
    制备光纤预制件的方法

    公开(公告)号:KR1019900002263B1

    公开(公告)日:1990-04-07

    申请号:KR1019860002464

    申请日:1986-04-01

    CPC classification number: C03B37/01211 Y02P40/57 Y10S65/16 Y10S65/90

    Abstract: A optical-fiber preform is produced by the stages of: inserting a quartz glass rod (3) as core in a tube (2) as cladding material, injecting via an inlet line (5) a gaseous mixt. of Si halide, F- contg. cpd. and O2 gas (where Si:F ratio is more than 1/300 and less than 1/5), heating the composite to 1000-1600 deg.C with rotating, replacing the atmos. with a gaseous mixt. of halogen-contg. cpd. and O2, reheating and fusing the core and cladding together at not less than 1900 deg.C.

    Abstract translation: 通过以下步骤制造光纤预制棒:将石英玻璃棒(3)作为芯体插入管(2)作为包覆材料,经由入口管线(5)注入气态混合物。 的卤化硅,F- CPD。 和O2气体(Si:F比大于1/300且小于1/5),旋转时将复合体加热至1000-1600℃,取代大气压。 与气体混合。 的卤素 CPD。 和O2,不低于1900摄氏度,将芯体和包层再熔合并熔合在一起。

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