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公开(公告)号：KR100085149B1
公开(公告)日：1995-05-23
申请号：KR1019910001104
申请日：1991-01-23
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L23/12
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公开(公告)号：KR1019960000696B1
公开(公告)日：1996-01-11
申请号：KR1019910020651
申请日：1991-11-20
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L21/60
CPC classification number: H01L24/81 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/16237 , H01L2224/73253 , H01L2224/8014 , H01L2224/81136 , H01L2224/8114 , H01L2224/81191 , H01L2224/81801 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , Y10T29/49146 , H01L2924/00
Abstract: 내용 없음.
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公开(公告)号：KR1019950002186B1
公开(公告)日：1995-03-14
申请号：KR1019910010166
申请日：1991-06-19
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L21/52
CPC classification number: H01L24/81 , H01L21/67144 , H01L21/681 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/75822 , H01L2224/81121 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01061 , H01L2924/01074 , H01L2924/12042 , Y10T29/49131 , Y10T29/53091 , Y10T29/53174 , Y10T29/53191 , H01L2924/00
Abstract: 내용 없음.
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公开(公告)号：KR100086007B1
公开(公告)日：1995-06-21
申请号：KR1019910010166
申请日：1991-06-19
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L21/52
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公开(公告)号：KR1019930008395B1
公开(公告)日：1993-08-31
申请号：KR1019910016243
申请日：1991-09-18
Applicant: 스미토모덴키고교가부시키가이샤
Abstract: 내용 없음.
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Patent Agency Ranking
公开(公告)号：KR1019920010761A
公开(公告)日：1992-06-27
申请号：KR1019910020651
申请日：1991-11-20
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L21/60
Abstract: 내용 없음
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公开(公告)号：KR100099901B1
公开(公告)日：1996-05-27
申请号：KR1019910020651
申请日：1991-11-20
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L21/60
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公开(公告)号：KR100085166B1
公开(公告)日：1995-05-24
申请号：KR1019910001105
申请日：1991-01-23
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L23/00
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公开(公告)号：KR1019950001365B1
公开(公告)日：1995-02-17
申请号：KR1019910001104
申请日：1991-01-23
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L23/12
CPC classification number: H01L23/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/1403 , H01L2224/16 , H01L2224/16237 , H01L2224/8014 , H01L2224/81136 , H01L2224/8114 , H01L2224/81191 , H01L2224/81385 , H01L2224/81801 , H01L2924/01005 , H01L2924/01033 , H01L2924/01061 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15173 , H05K1/0284 , H05K3/3436 , H05K3/4007 , Y10T29/49139 , Y10T29/53178
Abstract: A substrate (3) for packaging a semiconductor device having a bump (2) thereon according to the present invention is characterized in that the substrate (3) has an electrode terminal (5) to which the bump (2) is to be connected and a recess (4) for receiving at least a top of the bump (2) is formed in the electrode terminal (5).
Abstract translation: 根据本发明的用于封装具有凸块（2）的半导体器件的衬底（3）的特征在于，衬底（3）具有凸点（2）要连接的电极端子（5）和 在电极端子（5）中形成用于接收凸块（2）的至少顶部的凹部（4）。 ＆lt;图像＆GT;
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公开(公告)号：KR100068170B1
公开(公告)日：1993-12-01
申请号：KR1019910016243
申请日：1991-09-18
Applicant: 스미토모덴키고교가부시키가이샤
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