公开(公告)号：KR1020070114372A

公开(公告)日：2007-12-03

申请号：KR1020077022151

申请日：2006-02-23

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 미시마히데히코 ,  마스다야스히토 ,  오쿠다야스히로 ,  와타타니켄이치 ,  사카베슈지 ,  하시다마사키 ,  시미즈세이지

IPC: B23K26/0622 ,  B23K26/40

CPC classification number: B23K26/0624 ,  B23K2203/42 ,  B23K2203/50

Abstract: There is provided a material treatment method using laser ablation capable of easily controlling the laser pulse width and effectively performing treatment with a high accuracy. When a two-logarithm graph is expressed by a horizontal axis indicating the laser pulse width in pico seconds and a vertical axis indicating the ablation threshold value in J/cm^2, a material having a region where the two-logarithm graph has a rectilinear shape with gradient of 0.5 or below is subjected to treatment by a pulse laser beam having a laser pulse width within the region.

Abstract translation: 提供了一种使用激光烧蚀的材料处理方法，其能够容易地控制激光脉冲宽度并且以高精度有效地进行处理。 当以对数曲线表示以水平轴表示激光脉冲宽度（以微微秒为单位）和垂直轴表示消融阈值（J / cm ^ 2）时，具有两个对数图线具有直线的区域的材料 通过具有该区域内的激光脉冲宽度的脉冲激光束对具有0.5或更小的梯度的形状进行处理。

公开(公告)号：KR1020090015948A

公开(公告)日：2009-02-12

申请号：KR1020087029380

申请日：2007-05-17

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 미시마히데히코 ,  오쿠다야스히로 ,  사카베슈지 ,  하시다마사키 ,  시미즈세이지

IPC: B23K26/38 ,  B23K101/42 ,  B23K26/18 ,  H05K3/00

CPC classification number: H05K3/0032 ,  B23K26/009 ,  B23K26/18 ,  B23K26/382 ,  B23K26/40 ,  B23K2203/14 ,  B23K2203/42 ,  B23K2203/50 ,  H05K2203/1383 ,  Y10T428/24273

Abstract: A processing method for forming a through-hole in a workpiece (1) by using a pulse laser beam. The method has a step of forming a detachable sacrificial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workpiece by a laser beam with the sacrificial layer (la) formed on the workpiece, and a step of removing the sacrificial layer (5) from the workpiece after the through-hole forming step.

Abstract translation: 一种用于通过使用脉冲激光束在工件（1）上形成通孔的处理方法。 该方法具有在工件（1）上形成可拆卸的牺牲层（1a）的步骤，通过激光束在工件上形成通孔（5）的步骤，其中牺牲层（1a）形成在工件 以及在通孔形成步骤之后从工件去除牺牲层（5）的步骤。