Abstract:
본 발명은, 불소계 폴리머를 함유하는 수지재료로 형성된 다공질 수지기재에, 두께방향으로 관통하는 적어도 1개의 천공(穿孔)을 형성하는 공정 1; 천공의 내부벽면에, 알칼리금속을 함유하는 에칭액을 접촉시켜서 에칭처리하는 공정 2; 에칭처리에 의해 생긴 변질화층에, 산화력을 가지는 화합물 또는 그 용액을 접촉시켜서, 상기 변질화층을 제거하는 공정 3을 포함한 천공된 다공질 수지기재의 제조방법이다. 상기 천공의 내부벽면을 도전화하는 다공질 수지기재의 제조방법을 특징으로 한 것이다.
Abstract:
PURPOSE: A connection structure of a print circuit board, a method for connecting the printed circuit board, and an adhesive with anisotropic conductivity are provided to improve the reliability of an electrical connection between a first electrode and a second electrode by forming a cavity between the first and second electrodes. CONSTITUTION: A plurality of first electrodes(12,13) are formed on a first substrate(11). A plurality of second electrodes(22,23) are formed on a second substrate(21). An adhesive layer(30a) is formed between the first and second substrates and is comprised of the adhesive including conductive particles. A cavity is formed between the first and second electrodes. The pitch of the first electrode and the pitch of the second electrode are 10 um to 300 um.
Abstract:
A processing method for forming a through-hole in a workpiece (1) by using a pulse laser beam. The method has a step of forming a detachable sacrificial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workpiece by a laser beam with the sacrificial layer (la) formed on the workpiece, and a step of removing the sacrificial layer (5) from the workpiece after the through-hole forming step.
Abstract:
An anisotropic conductive sheet which does not damage a wafer nor the electrode terminals of a conduction measuring instrument due to loading when the wafer is to be inspected, and ensures a good conductivity. The anisotropic conductive sheet (1) comprises porous resin layers formed by foaming and electron-beam- crosslinking fluororubber or tetrafluoroethylene-propylene copolymer rubber having an open cell structure and provided on the inner walls of a plurality of through holes (3) pierced in the thickness direction of an electrically-insulating porous sheet (2) made of foamed fluororubber or the like, characterized in that the skeleton surface of the porous resin is coated with metal. In addition, it is especially preferable for porous resin.
Abstract:
본 발명은, 다공질 수지기재의 다공질구조 내부에 액체 또는 용액을 함침시키는 공정 1; 함침시킨 액체 또는 용액으로부터 고형물을 형성하는 공정 2; 다공질구조 내부에 고형물을 가지는 다공질 수지기재의 제1 표면으로부터 제2 표면을 관통하는 복수의 천공을 형성하는 공정 3; 및 고형물을 융해 또는 용해시켜서, 다공질구조 내부로부터 제거하는 공정 4; 를 포함하는 천공된 다공질 수지기재의 제조방법, 및 상기 천공의 내부벽면에만 선택적으로 촉매를 부착시키고, 상기 내부벽면에 도전성 금속을 부착시키는 공정을 포함하는 천공 내부벽면을 도전화한 다공질 수지기재의 제조방법을 특징으로 한 것이다.
Abstract:
An anisotropic conductive sheet suitable for connecting insertion packaging pin electrodes comprises an electric insulating porous film (1) of synthetic resin exhibiting conductivity in the thickness direction and having a plurality of holes (3) formed in the thickness direction in order to insert pin electrodes (2) thereinto. This anisotropic conductive sheet is characterized in that a metal (4) is adhered to the inner wall of the hole (3) and electrical conduction is attained between the surface opposite to the surface for inserting the pin electrode (2) and the inserted pin electrode (2) through the metal (4). The porous film preferably has an electric insulating nonporous film of synthetic resin on the side for inserting the electrode and this nonporous film has a plurality of holes formed in the thickness direction in order to insert the pin electrodes thereinto.
Abstract:
A porous stretched polytetrafluoroethylene film which has a residual strain of 11.0% or lower as measured after a load necessary for pushing the front end of a rod into the porous film in the thickness direction at a strain rate of 100 %/min to a depth which is 20% of the film thickness is repeatedly imposed 20 times, the rod being a cylindrical rod which has an outer diameter of 2 mm or larger and at least 1.9 times the film thickness, has a smooth and flat front-end surface perpendicular to the axis, and has a modulus in tension of 1.0x104 kgf/mm2 or higher. Also provided is a process for producing the porous film, which includes the step of compressing a porous stretched polytetrafluoroethylene film having a high stretch ratio. ® KIPO & WIPO 2007
Abstract:
본 발명은, 합성수지로 형성된 전기절연성의 다공질막을 기막(基膜)으로 하고, 상기 기막의 복수개소에, 제 1의 표면으로부터 제 2의 표면으로 관통하는 상태에서 다공질구조의 수지부에 부착된 도전성 금속에 의해 형성되고, 막두께방향으로 도전성을 부여하는 것이 가능한 도통부가 각각 독립해서 형성되어 있는 이방성 도전막, 및 그 제조방법인 것을 특징으로 한 것이다.
Abstract:
In a composite porous resin base material (1), a porous resin film (2) is provided with a functional section (3) whereupon an electrode (4) and/or a circuit is formed. On the periphery surrounding the functional section (3), a step (5) having a height different from that of the functional section (3) is formed, and a frame plate (6) is arranged on a plane of the step (5). Provided is the composite porous resin base material which has a structure wherein the frame plate having rigidity is attached to the porous resin base material whereupon the electrode and/or a circuit is formed without deteriorating characteristics such as elasticity and conductivity of the porous resin base material.
Abstract:
Disclosed is a porous resin base composed of a porous resin film which is provided with at least one functional portion including either or both of an electrode and a circuit. The porous resin film is also provided with a step portion having a height different from that of the functional portion. Also disclosed is a method for manufacturing such a porous resin base. ® KIPO & WIPO 2008