公开(公告)号：KR1020020082786A

公开(公告)日：2002-10-31

申请号：KR1020020022371

申请日：2002-04-24

Applicant: 스미토모덴키고교가부시키가이샤

Inventor： 사까따나오끼 ,  마에무라고이찌로 ,  가와우찌히로시 ,  야시끼데쯔오 ,  다까하시도시야 ,  오하라도시아끼

IPC: H01L21/60

Abstract: PURPOSE: A bonding tool, a bonding stage, a head for bonding the tool and a stage part for the bonding stage are provided to be capable of replacing the head at the bonding tool and the bonding stage. CONSTITUTION: A boding tool or a bonding stage for mounting semiconductor is composed of a head part(1) and a shank part(14) or a pedestal part. The bonding tool is characterized in that the head(1) made of a rectangle or circular substrate part and a protrusion protruded from the substrate part are constructed from one material. At this time, the top of the protrusion is coated with vapor-phase synthetic diamond. The substrate part is mechanically fixed or fixed by the vacuum suction of a plurality of vacuum adsorption holes(6).

Abstract translation: 目的：提供接合工具，接合台，用于接合工具的头和用于接合台的台部，以便能够在接合工具和接合台处更换头部。 构成：用于安装半导体的焊接工具或接合台由头部（1）和柄部（14）或基座部构成。 接合工具的特征在于，由矩形或圆形基板部分制成的头部（1）和从基板部分突出的突起由一种材料构成。 此时，突起的顶部涂有气相合成金刚石。 基板部分通过多个真空吸附孔（6）的真空抽吸机械固定或固定。