公开(公告)号：KR1019930001907B1

公开(公告)日：1993-03-19

申请号：KR1019840003306

申请日：1984-06-13

Applicant: 쓰리엠 컴퍼니

Inventor： 로머트스티븐레이레크 ,  케니스차알스톰프슨

IPC: H01L35/00 ,  H01L23/48

CPC classification number: H05K3/323 ,  H01L21/302 ,  H01L23/3737 ,  H01L23/4828 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/27003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0218 ,  H05K2201/09945 ,  H05K2203/0156 ,  H05K2203/0425 ,  H05K2203/0435 ,  H05K2203/066 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/00014

Abstract: The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.

公开(公告)号：KR100064348B1

公开(公告)日：1993-08-12

申请号：KR1019840003306

申请日：1984-06-13

Applicant: 쓰리엠 컴퍼니

Inventor： 로머트스티븐레이레크 ,  케니스차알스톰프슨

IPC: H01L35/00 ,  H01L23/48