公开(公告)号：KR1020060004981A

公开(公告)日：2006-01-16

申请号：KR1020057021326

申请日：2004-06-01

Applicant: 아토테크더치랜드게엠베하

Inventor： 오즈콕아키프 ,  로엘프스베른트오트마르 ,  이겔오스발트 ,  겐스헤르코 ,  마테자트카이-젠스

IPC: C25D21/18 ,  H05K3/42

CPC classification number: H05K3/423 ,  C25D21/18 ,  H05K2201/09563 ,  H05K2203/0796

Abstract: The invention provides a process for filling mu-blind vias in the manufacture of printed circuit boards, which process comprises the following steps: (i) providing a bath electrolyte for galvanic plating with metallic coatings comprising a copper metal salt and optionally organic additives, (ii) operating the bath with direct current density of 0.5 to 10 A/dm2, or current pulses at an effective current density of 0.5 to A/dm2, (iii) withdrawing part of the electrolyte from the galvanic bath, (iv) adding an oxidizing agent to the part of the electrolyte which has been withdrawn, (v) optionally irradiating the withdrawn electrolyte with UV light and (vi) recycling the withdrawn part to the galvanic bath and replacing the organic additives destroyed by the oxidation treatment.

Abstract translation: 本发明提供了一种用于在制造印刷电路板中填充多孔通孔的方法，该方法包括以下步骤：（i）提供用于电镀的浴电解液，其中金属涂层包括铜金属盐和任选的有机添加剂（ ii）以0.5至10A / dm 2的直流电流密度或电流脉冲以0.5至A / dm 2的有效电流密度操作浴，（iii）从电镀槽中取出部分电解质，（iv） （v）任选地用UV光照射所提取的电解质，和（vi）将取出的部分再循环到电镀浴中，并且替换由氧化处理破坏的有机添加剂。