公开(公告)号：KR1020070089927A

公开(公告)日：2007-09-04

申请号：KR1020077012361

申请日：2005-10-19

Applicant: 아토테크더치랜드게엠베하

Inventor： 피엘,메르텐 ,  스탬프,루츠 ,  모페르트,크리스티앙

IPC: C23C18/22 ,  H05K3/00 ,  H05K3/38

CPC classification number: C23C18/22 ,  C23C18/405 ,  H05K1/0269 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/0796 ,  H05K2203/163

Abstract: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.

Abstract translation: 本发明涉及通过光泽测量来控制绝缘衬底的蚀刻工艺。 通过这种方法，可以实现表面粗糙度，这导致在随后的金属化步骤中沉积的金属层的良好粘附。 该方法特别适用于生产印刷电路板。

公开(公告)号：KR101211116B1

公开(公告)日：2012-12-11

申请号：KR1020077012361

申请日：2005-10-19

Applicant: 아토테크더치랜드게엠베하

Inventor： 피엘,메르텐 ,  스탬프,루츠 ,  모페르트,크리스티앙

IPC: C23C18/22 ,  H05K3/00 ,  H05K3/38

CPC classification number: C23C18/22 ,  C23C18/405 ,  H05K1/0269 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/0796 ,  H05K2203/163

Abstract: 본발명은기판표면의러프닝(roughening) 및/또는디스미어(desmear)를달성하기위하여충분한시간동안충분한농도및 온도에서, 절연기판을에칭액으로에칭하고, 이어서금속화하여, 절연기판을금속화하는방법에관한것이다.