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公开(公告)号：KR1020110130442A
公开(公告)日：2011-12-05
申请号：KR1020117022178
申请日：2010-03-12
Applicant: 아토테크더치랜드게엠베하
Inventor： 체텔마이어엘리자베스
CPC classification number: C23C18/1841 , C23C18/1607 , C23C18/1608 , C23C18/1637 , H05K3/244 , H05K2203/0716 , H05K2203/072
Abstract: The present invention discloses a process for electroless plating of nickel onto copper features of a printed circuit board which suppresses extraneous nickel plating. The process comprises the steps i) activation of the copper features with palladium ions; ii) removal of excessive palladium ions or precipitates formed thereof with a pre-treatment composition comprising at least two different types of acids wherein one type is an organic amino carboxylic acid and iii) electroless plating of nickel.
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公开(公告)号：KR101630597B1
公开(公告)日：2016-06-14
申请号：KR1020167003442
申请日：2010-03-12
Applicant: 아토테크더치랜드게엠베하
Inventor： 체텔마이어엘리자베스
CPC classification number: C23C18/1841 , C23C18/1607 , C23C18/1608 , C23C18/1637 , H05K3/244 , H05K2203/0716 , H05K2203/072
Abstract: 본발명은불필요한니켈도금을억제하는인쇄회로보드의구리형상물상에서의무전해니켈도금방법을개시한다. 상기방법은하기단계를포함한다: i) 구리형상물을팔라듐이온으로활성화하는단계; ii) 과량의팔라듐이온또는이의형성되는침전물을둘 이상의상이한유형의산 (이때, 하나의유형은유기아미노카르복실산임) 을포함하는전처리조성물로제거하는단계; 및 iii) 무전해니켈도금단계.
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公开(公告)号：KR1020160023908A
公开(公告)日：2016-03-03
申请号：KR1020167003442
申请日：2010-03-12
Applicant: 아토테크더치랜드게엠베하
Inventor： 체텔마이어엘리자베스
CPC classification number: C23C18/1841 , C23C18/1607 , C23C18/1608 , C23C18/1637 , H05K3/244 , H05K2203/0716 , H05K2203/072
Abstract: 본발명은불필요한니켈도금을억제하는인쇄회로보드의구리형상물상에서의무전해니켈도금방법을개시한다. 상기방법은하기단계를포함한다: i) 구리형상물을팔라듐이온으로활성화하는단계; ii) 과량의팔라듐이온또는이의형성되는침전물을둘 이상의상이한유형의산 (이때, 하나의유형은유기아미노카르복실산임) 을포함하는전처리조성물로제거하는단계; 및 iii) 무전해니켈도금단계.
Abstract translation: 本发明公开了一种在抑制不必要的镀镍的印刷电路板的铜形状上电镀镍的方法。 该方法包括以下步骤：i）用钯离子激活铜特征; ii）用包含至少两种不同类型的酸的预处理组合物除去过量的钯离子或由其形成的沉淀物，其中一种类型是有机氨基羧酸; 和iii）无电镀镍步骤。
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