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公开(公告)号：KR101717351B1
公开(公告)日：2017-03-16
申请号：KR1020150094891
申请日：2015-07-02
Applicant: 암페놀센싱코리아 유한회사
Abstract: 본발명은차량에어컨이나냉장고등의냉매압력을측정하는압력센서에관한것으로서, 좀더상세하게는압력센서의냉매유입구에냉매파이프를조립연결하되, 상기압력센서몸체부(10)의냉매유입구(11)에형성된체결공(12)에냉매파이프(20)의단부에형성된체결부(22)를나사결합한후, 상기몸체부(10)의냉매유입구(11)와냉매파이프(20)의결합틈새부위를따라에폭시수지를주사하여록킹, 실링기능을갖는기밀부(30)를형성하는방식으로조립연결하므로종래브레이징용접방식에비해제조공정이간단하고공정다변화가가능하여제조비절감은물론고압에서신뢰성이개선되어품질을우수하게제공하는데그 특징이있다.
Abstract translation: 本发明涉及一种压力传感器，用于测量制冷剂压力，例如车辆用空调或冰箱，并且更具体地涉及一种冷却剂入口（11，但制冷剂配管连接到压力传感器的制冷剂入口的组件，所述压力传感器主体（10） ）输入到在制冷剂管20的孔12，然后旋入形成uidan单元上部分22的紧固，制冷剂入口11和所述主体部分的在形成10的制冷剂配管20的分辨率和间隙部 通过根据锁定的环氧树脂的注射，以这样的方式组装，以形成气密部30与传统的铜焊焊接简单相比具有密封能力的连接，并且在制造过程中，步骤的多样化成为可能，降低生产成本，以及在高压的可靠性 质量得到提高。
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公开(公告)号：KR101866647B1
公开(公告)日：2018-06-11
申请号：KR1020160088523
申请日：2016-07-13
Applicant: 암페놀센싱코리아 유한회사
IPC: A61B5/20
Abstract: 본발명은배뇨근압측정장치에관한것으로서, 좀더상세하게는몸체전방의니들부와후방의센싱부로구분형성하여전방의니들부를복부에삽입하되, 상기니들부는방광, 복근, 피부의위치로압력유입공을각각형성하여후방의센싱부에서방광, 복근, 피부의압력을동시에측정하도록하므로최소한의기구물을복부에삽입하면서방광, 복근, 피부의압력을동시에측정하기때문에환자의고통을줄여줄뿐만아니라사용이안전하고내구성및 효율성을우수하게제공하는데그 특징이있다.
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公开(公告)号：KR1020130108701A
公开(公告)日：2013-10-07
申请号：KR1020120030327
申请日：2012-03-26
Applicant: 암페놀센싱코리아 유한회사
CPC classification number: B29C45/14655 , B29L2031/34 , H01L23/293 , H01L23/49541
Abstract: PURPOSE: A method for manufacturing a contactless device is provided to mount a control element via a penetration unit, to charge epoxy, and to bond wires, thereby reducing failure by preventing damage to a mounting element and the wires. CONSTITUTION: A method for manufacturing a contactless device includes the following steps of: press-processing a lead frame in which lead and an element mounting surface are formed at a predetermine form (S10); forming a lower element mold with a penetration unit on which the control element can be mounted (S20); mounting the formed lower element mold on the underside of the lead frame and mounting an upper element mold on the top surface of the lead frame (S30); mounting the control element via the penetration unit of the lower element mold and wire-bonding a gap between the control element and the lead (S40); charging epoxy for element protection inside the penetration unit of the lower element mold (S50); wire-bonding and joining a cover after charging epoxy inside the opening unit (S60); removing a lead supporting unit of the lead frame (S70); and completing the manufacture of the contactless device by bending the lead. [Reference numerals] (S10) Processing a lead frame; (S20) Forming a lower element mold; (S30) Mounting the formed lower element mold; (S40) Mounting the control element and wire-bonding; (S50) Charging epoxy; (S51) Mounting a lower cover; (S60) Mounting a detecting element; (S70) Removing a lead supporting unit; (S80) Bending a lead
Abstract translation: 目的：提供一种用于制造非接触式装置的方法，以通过穿透单元安装控制元件，对环氧树脂进行充电和接合线，从而通过防止对安装元件和电线的损坏来减少故障。 构成：制造非接触式装置的方法包括以下步骤：以预定形式对形成有引线和元件安装表面的引线框进行加压处理（S10）; 形成具有可安装控制元件的穿透单元的下元件模具（S20）; 将形成的下部元件模具安装在引线框架的下侧，并将上部元件模具安装在引线框架的顶部表面上（S30）; 通过下元件模具的穿透单元安装控制元件并将控制元件和引线之间的间隙引线接合（S40）; 在下元件模具的穿透单元内填充用于元件保护的环氧树脂（S50）; 在打开单元中充电环氧树脂之后引线接合和接合盖（S60）; 去除引线框架的引线支撑单元（S70）; 并通过弯曲导线完成非接触式装置的制造。 （附图标记）（S10）处理引线框架; （S20）形成下元件模具; （S30）安装形成的下元件模具; （S40）安装控制元件并进行引线键合; （S50）充电环氧树脂; （S51）安装下盖; （S60）安装检测元件; （S70）拆卸引线支撑单元; （S80）弯腰
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公开(公告)号：KR101202381B1
公开(公告)日：2012-11-16
申请号：KR1020110025768
申请日：2011-03-23
Applicant: 암페놀센싱코리아 유한회사
IPC: G01N21/61 , G01N21/3504
Abstract: 본 발명은 비분산 적외선 가스 분석 장치의 광검출기를 이루는 밴드패스필터의 위치 및 써모파일의 구조를 개선하여 보다 높은 감도를 가지며, 동시에 보다 정확하고 섬세한 감지 능력을 발휘할 수 있도록 한 써모파일을 이용한 비분산 적외선 가스 분석 장치에 관한 것으로, 상기 광검출기는, 하부실리콘기판과, 상기 하부실리콘기판의 상부에 형성되는 다이아프레임막과, 상기 다이아프레임막의 상부에 형성되는 제1열전물질과 제2열전물질로 이루어진 열전쌍과, 상기 열전쌍 상부에 형성되는 절연막과, 상기 절연막 및 다이아프레임막에 형성된 에치홀을 통해 상기 하부실리콘기판을 식각시켜 형성한 에어갭을 포함하여 된 써모파일과; 상부실리콘기판과, 상기 상부실리콘기판의 하부에 적외선투과창을 구분지어 주고 상기 하부실리콘기판과의 열적 고립을 위하여 식각 형성된 에어갭으로 이루어진 밴드패스필터를 형성하고; 상기 써모파일과 밴드패스필터를 웨이퍼 본딩 하여 구성된 것을 특징으로 한다.
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公开(公告)号：KR1020120108169A
公开(公告)日：2012-10-05
申请号：KR1020110025768
申请日：2011-03-23
Applicant: 암페놀센싱코리아 유한회사
IPC: G01N21/61 , G01N21/3504
Abstract: PURPOSE: A non-dispersive infrared ray gas analyzing device using thermopile is provided to enable to obtain much higher sensitivity when wafer packaging in a vacuum condition. CONSTITUTION: A non-dispersive infrared ray gas analyzing device using thermopile comprises an upper case(20), a lower case, a photo detector(50), and an infrared ray source. A membrane is mounted on the top of the upper case. The lower case is joined to the lower case. A light source insertion hole where an infrared light source is inserted is formed in one side of the lower case. An optical detector insertion hole where an optical detector is inserted is formed in the other side of the lower case. The optical detector and infrared light source are fixed and installed on the PCB(Printed Circuit Board) at a constant interval. Lights projected from the infrared light source are received by the optical detector through a light cavity where the upper and lower cases form. [Reference numerals] (AA) Infrared ray light source
Abstract translation: 目的：提供使用热电堆的非分散红外线气体分析装置，以便在真空条件下进行晶片封装时能够获得更高的灵敏度。 构成：使用热电堆的非分散红外线分析装置包括上壳体（20），下壳体，光电检测器（50）和红外线源。 膜安装在上壳体的顶部。 下壳体连接到下壳体。 在下壳体的一侧形成插入有红外光源的光源插入孔。 在下壳体的另一侧形成有光检测器插入的光检测器插入孔。 光学检测器和红外光源固定并以一定的间隔安装在PCB（印刷电路板）上。 由红外光源投影的光由光学检测器通过上下壳体形成的光腔接收。 （附图标记）（AA）红外线光源
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Patent Agency Ranking
公开(公告)号：KR1020170028101A
公开(公告)日：2017-03-13
申请号：KR1020150124960
申请日：2015-09-03
Applicant: 암페놀센싱코리아 유한회사
Abstract: 본발명은차량에어컨이나냉장고등의냉매압력을측정하는압력센서에관한것으로서, 좀더상세하게는냉매파이프가결합되는센서바디(3) 선단에결합되고내부에케이블(6)이연결되는센서패키지(5)를내장하는 PCB 서포터(10)의센서패키지(5)와케이블(6) 연결부위를에폭시주입방식과고정커버에의한고정방식에의해커버하여보강함은물론진동의직접전달이나외부환경(저온및 고온, 습도)의직접노출에의한손상을방지하여내구성을향상시키고, 또한저온환경의진동에의해케이블과에폭시실링의접촉부위에마찰이발생하여케이블이단선되는종래문제점을해결하므로압력센서의내구성과함께신뢰성을향상시키도록하는데그 특징이있다.
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公开(公告)号：KR1020170004488A
公开(公告)日：2017-01-11
申请号：KR1020150094891
申请日：2015-07-02
Applicant: 암페놀센싱코리아 유한회사
Abstract: 본발명은차량에어컨이나냉장고등의냉매압력을측정하는압력센서에관한것으로서, 좀더상세하게는압력센서의냉매유입구에냉매파이프를조립연결하되, 상기압력센서몸체부(10)의냉매유입구(11)에형성된체결공(12)에냉매파이프(20)의단부에형성된체결부(22)를나사결합한후, 상기몸체부(10)의냉매유입구(11)와냉매파이프(20)의결합틈새부위를따라에폭시수지를주사하여록킹, 실링기능을갖는기밀부(30)를형성하는방식으로조립연결하므로종래브레이징용접방식에비해제조공정이간단하고공정다변화가가능하여제조비절감은물론고압에서신뢰성이개선되어품질을우수하게제공하는데그 특징이있다.
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公开(公告)号：KR1020130108702A
公开(公告)日：2013-10-07
申请号：KR1020120030328
申请日：2012-03-26
Applicant: 암페놀센싱코리아 유한회사
CPC classification number: H01L2924/181 , H01L2924/00012
Abstract: PURPOSE: A non-contact element is provided to reduce production costs by using cheap epoxy which protects an element and is filled in a lower element mold. CONSTITUTION: A lower cover for covering an element mold is mounted (S51). A sensing element is mounted through the opening part of an upper element mold. A wire bonding process is performed. A cover is bonded to the sensing element by filling the opening with epoxy (S60). The lead support is removed from the lead frame (S70). A lead is bent (S80). [Reference numerals] (S10) Lead frame processing step; (S20) Lower device molding step; (S30) Device mold equipping step; (S40) Device mounting and wire bonding step; (S50) Epoxy filling step; (S51) Lower cover mounting step; (S60) Sensing device mounting step; (S70) Lead support removal step; (S80) Lead bending step
Abstract translation: 目的：提供非接触元件，通过使用廉价的环氧树脂来降低生产成本，保护元件并填充在下元件模具中。 构成：安装用于覆盖元件模具的下盖（S51）。 感测元件通过上部元件模具的开口部分安装。 进行引线键合处理。 通过用环氧树脂填充开口将盖粘合到感测元件（S60）。 从引线框移除引线支架（S70）。 引线弯曲（S80）。 （附图标记）（S10）引线框处理工序; （S20）下部装置成型工序; （S30）装置模具装备步骤; （S40）装置安装和引线接合步骤; （S50）环氧填充步骤; （S51）下盖安装步骤; （S60）感测装置安装步骤; （S70）引线支撑去除步骤; （S80）引线弯曲步骤
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公开(公告)号：KR1020120107658A
公开(公告)日：2012-10-04
申请号：KR1020110025297
申请日：2011-03-22
Applicant: 암페놀센싱코리아 유한회사
CPC classification number: G01L9/06 , G01L7/082 , G01L9/0042 , H01L29/84
Abstract: PURPOSE: A micro-type pressure sensor and a method for manufacturing the same are provided to reduce a size of an element if the element of the same size has higher sensitivity or the same sensitivity, thereby miniaturizing and reducing costs. CONSTITUTION: A micro-type pressure sensor comprises a silicon substrate(10), an oxide layer, a nitride layer, a piezo resistor(16), an electrode(18), and a membrane(20). A single crystal silicon layer is formed in the upper part of the silicon substrate. The oxide and nitride layers are successively evaporated in the upper and lower parts of the silicon substrate. The piezo resistor is formed at a predetermined position of the upper part of the silicon substrate through implantation. The electrode is connected and formed in between a pad of the upper part of the silicon substrate and the piezo resistor. The membrane is exposed by etching the lower part of the silicon substrate, thereby being formed. A concavo-convex part(30) is formed in the upper or lower part of the membrane.
Abstract translation: 目的：提供微型压力传感器及其制造方法，以便如果相同尺寸的元件具有更高的灵敏度或相同的灵敏度，从而小型化和降低成本，则可减小元件的尺寸。 构成：微型压力传感器包括硅衬底（10），氧化物层，氮化物层，压电电阻器（16），电极（18）和膜（20）。 在硅衬底的上部形成单晶硅层。 氧化物和氮化物层在硅衬底的上部和下部依次蒸发。 压电电阻器通过注入形成在硅衬底的上部的预定位置处。 电极连接并形成在硅衬底的上部的焊盘和压电电阻器之间。 通过蚀刻硅衬底的下部来暴露膜，由此形成。 在膜的上部或下部形成有凹凸部（30）。
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10.发明公开허메틱 실 검사부가 형성된 웨이퍼 레벨 패키지 소자 및 이의 제조방법 有权WAFER LEVEL PACKAGED DEVICE FORMED HERMETIC SEAL INSPECTION PART AND MANUFACTURING METHOD THEREFOR
公开(公告)号：KR1020120107657A
公开(公告)日：2012-10-04
申请号：KR1020110025296
申请日：2011-03-22
Applicant: 암페놀센싱코리아 유한회사
IPC: H01L21/66
Abstract: PURPOSE: A wafer level packaged device with a hermetic seal inspection part and a manufacturing method thereof are provided to improve device reliability and performance by revising device characteristics according to changes in the degree of a vacuum while monitoring a sealing state inside a package in real time. CONSTITUTION: A main apparatus part(20) is formed on a silicon substrate(10). A hermetic seal inspection part(30) is formed at a predetermined portion on the silicon substrate. The hermetic seal inspection part performs a hermetic seal test. The hermetic seal inspection part forms a sensing film by arranging a heater electrode(14) on an upper portion of a sensing electrode(16). The hermetic seal inspection part monitors the degree of a vacuum in a package device in real time.
Abstract translation: 目的：提供具有气密密封检查部件的晶片级封装装置及其制造方法，以通过根据真空度的变化修改器件特性，同时实时监测封装内的密封状态来提高器件的可靠性和性能 。 构成：在硅衬底（10）上形成主要器件部分（20）。 在硅衬底上的预定部分处形成气密密封检查部件（30）。 气密密封检查部进行气密密封试验。 密封检查部分通过在感测电极（16）的上部布置加热电极（14）形成感测膜。 密封检查部分实时监测包装装置中的真空度。
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