Abstract:
본 발명은 탄소 나노 튜브를 이용한 반도체 소자 및 그 제조방법에 관한 것으로, 기판과, 게이트 전극과, 게이트 절연층과, 소오스 및 드레인 전극과, 상기 소오스 및 드레인 전극과 접속하여 형성된 활성층을 포함하되, 상기 활성층은 수산화이온 함유 물질에 의해 표면 처리된 탄소 나노 튜브로 이루어지도록 함으로서, 탄소 나노 튜브에 대한 반도체 성질을 증가시킬 수 있는 효과가 있다. 탄소나노튜브, 수산화나트륨, 표면처리
Abstract:
본 발명은 상부 비정질 실리콘층을 포함하는 반도체 구조물이 구비된 기판을 준비하는 단계와 상기 비정질 실리콘층의 상층으로부터 적어도 일부층에 다공성 구조를 형성하는 단계와 상기 다공성 구조와 접촉하도록 반응 액체를 도포하는 단계와 상기 다공성 구조와 상기 반응액체의 반응에 의해 열이 발생하고 그 열에 의해 상기 비정질 실리콘층의 특성이 변화하는 비정질 실리콘층의 결정화 방법을 제공한다. 비정질 실리콘, 화학 반응, 절연막, 박막 트랜지스터, 다공성 구조, 결정화
Abstract:
PURPOSE: A method for manufacturing a flash memory device of a 3d laminated cell structure is provided to form a channel area using a liquid oxide semiconductor material, thereby easily manufacturing a flash memory cell at a low temperature. CONSTITUTION: A semiconductor substrate(301) comprises source-drain regions(310,320). The first floating gate layer(307) and the first control gate layer(303) are formed on the semiconductor substrate. An upper channel layer(368) is formed on the first control gate layer. The second floating gate layer(365) is formed on the upper channel layer. The second control gate layer(363) is formed on the second floating gate layer.
Abstract:
PURPOSE: A crystallization apparatus, a manufacturing method thereof, and the method for crystallization using the same are provided to crystallize amorphous silicon by locally supplying heat to the amorphous silicon on a soft substrate. CONSTITUTION: A crystallization apparatus comprises a heater(20), a supporting part(30), and a roller(40). The heater receives a heat generating source from the outside of the crystallization apparatus. The supporting part supports the heater. The supporting part offers the heat generating source to the heater. The heater is included inside the heater. Multiple opening portions(45) is included in the roller. The roller offers the heat to a target object.
Abstract:
PURPOSE: A method for manufacturing a semiconductor thin film is provided to reduce a process cost and time by forming a semiconductor thin film on a substrate without a vacuum deposition device of high cost through a solution process. CONSTITUTION: A liquid state semiconductor layer(120) is formed on a top part of a substrate(110). A heat is selectively applied to a fixed region of a top part of the liquid state semiconductor layer. A semiconductor thin film(140) is formed by drying the liquid state semiconductor layer about a region in which a heat is applied. The liquid state semiconductor layer remaining to a different region except for the region in which the semiconductor thin film is formed is removed by organic solvent. The liquid state semiconductor layer is formed through a spin coating after photo-polymerizing a solution precursor on a top part of the substrate.
Abstract:
A method of fabricating an amorphous silicon thin film is provided to reduce the number of a poly silicon polymerization processes by using a Wurtz-type reductive coupling. A silicon monomer is mixed in the organic solvent and a dissipative system is formed. A metallic catalyst is dispersed in the dissipative system and the polysilanes polymer is formed. The polysilanes polymer is filtered, and a poly silicon is separated. The poly silicon is dissolved in the organic solvent and the polysilanes liquid is formed. The polysilanes liquid is deposited on the substrate, and the deposited polysilanes liquid is irradiated with UV rays and an amorphous silicon thin film is formed.
Abstract:
PURPOSE: A method for crystallizing an amorphous silicon layer and a method for forming a porous silicon structure are provided to crystallize the amorphous silicon layer for a short time by changing a property of the amorphous silicon layer by using the reactive heat from a chemical reaction. CONSTITUTION: A semiconductor structure including an amorphous silicon layer(12) is formed on the upper side of a substrate. A porous structure(12a) is formed on part of the upper layer of the amorphous silicon layer. Reactive liquid(20) is applied to the porous structure. Heat is generated by the reaction of the porous structure and the reactive liquid and the property of the amorphous silicon layer is changed by the heat. The porous structure is formed on part of the amorphous silicon layer.
Abstract:
PURPOSE: A method of fabricating a flash memory device using a low temperature process is provided to implement a 3D lamination structure easily by forming a channel region with a liquid-based oxide semiconductor material. CONSTITUTION: A control gate(103) is arranged on a substrate. A floating gate(107) is arranged on a control gate. The floating gate is formed by coating carbon nanotube material. A channel layer(108) is arranged on the floating gate. The channel layer is formed by coating liquid-based oxide semiconductor material.
Abstract:
본 발명은 반도체 박막의 제조방법에 관한 것으로, 기판 상부에 액상 반도체층을 형성하는 단계와, 상기 액상 반도체층 상부의 일정 영역에 선택적으로 열을 인가하여 상기 열이 인가된 영역에 대한 상기 액상 반도체층을 건조시켜 반도체 박막을 형성하는 단계와, 상기 반도체 박막이 형성된 영역 이외의 다른 영역에 잔류한 액상 반도체층을 유기용매를 이용하여 제거하는 단계를 포함함으로써, 별도의 마스크를 사용하지 않고도 기판 상에 반도체 박막을 증착할 수 있어 공정시 소요되는 비용 및 시간을 절감할 수 있는 효과가 있다. 액상 반도체, 박막 형성 공정, 선택적 열인가, 유기용매, 디스플레이