公开(公告)号：KR1020080019905A

公开(公告)日：2008-03-05

申请号：KR1020060082419

申请日：2006-08-29

Applicant: 재단법인서울대학교산학협력재단

Inventor： 김기범 ,  이태연 ,  이성호 ,  이민현

IPC: C23C14/38 ,  C23C14/34

Abstract: A thin film deposition method is provided to modify a thin film stably without deformation of the substrate even in the case where glass or a polymer material is used as a substrate, and a thin film deposition apparatus that can realize the thin film deposition method is provided. A thin film deposition method for depositing a thin film on a substrate comprises irradiating electrons onto the thin film deposited onto the substrate through an electron showering process while the thin film is deposited onto the substrate to modify the thin film. The electron showering process comprises sequentially irradiating electrons onto the substrate or the thin film deposited onto the substrate before and after the thin film is deposited onto the substrate. The electron showering process comprises varying intensity and distribution of the electrons irradiated. The electron showering process is conducted in an electron energy range of 0.1 eV to 100 keV.

Abstract translation: 提供了薄膜沉积方法，即使在使用玻璃或聚合物材料作为基板的情况下也能稳定地修饰薄膜而不会发生基板的变形，并且提供可实现薄膜沉积方法的薄膜沉积设备 。 用于在衬底上沉积薄膜的薄膜沉积方法包括通过电子喷镀工艺将电子照射到沉积在衬底上的薄膜上，同时将薄膜沉积到衬底上以改变薄膜。 电子淋洗过程包括在薄膜沉积到衬底上之前和之后，将电子依次照射到衬底上或沉积在衬底上的薄膜。 电子喷淋工艺包括照射的电子的强度和分布变化。 电子喷淋过程在0.1eV至100keV的电子能量范围内进行。