Abstract:
A method of selectively etching semiconductor region, a separation method of a semiconductor layer and a separation method of a semiconductor device from a substrate are provided to easily separate the semiconductor structure and transfer to the other substrate by using the electrolytic etching manner. The first semiconductor layer(230) of the N-type GaN series, and the second semiconductor layer(240) of the other conductive type GaN series and a semiconductor element portion(300) are successively formed on the first substrate(210). The semiconductor element portion is adhered to the second substrate(500). The etching is performed by using the electrolyte including the oxalic acid. The etching rate of the first semiconductor layer is greater than the etching rate of the second semiconductor layer. The semiconductor layer is etched more quickly than the second semiconductor.
Abstract:
A nano structure is provided to embody a more beautiful color than ordinary pigments, and be surface-colored at low cost and in a simple manner. A method for manufacturing a nano structure for coloring the surface thereof includes the steps of: forming a first metal layer on the upper part of the surface; anodizing the metal layer to form a nano hole array structure(20) in which nano holes are formed in an array shape at regular intervals; forming a second metal layer(30) on the at least upper parts of the nano holes; and further forming a protective layer on the upper part on which the second metal layer is formed. The pitch(D) between nano holes is 20-500 nm.