전극 패턴 형성방법
    2.
    发明授权
    전극 패턴 형성방법 失效
    전극패턴형성방법

    公开(公告)号:KR100678860B1

    公开(公告)日:2007-02-05

    申请号:KR1020050107346

    申请日:2005-11-10

    Abstract: A method for forming an electrode pattern is provided to simplify a manufacturing process by removing applying, exposing, and developing processes of a photoresist in a lithography process. A method for manufacturing an electrode pattern includes the steps of: forming a seed layer on an upper face of a substrate(S100); attaching a pattern forming film on an upper face of the seed layer and exposing the seed layer by removing a portion of the pattern forming film with a cutting laser(S110,S120); forming a plating layer on the exposed seed layer(S130); and removing the pattern forming film and etching the seed layer by using the plating layer as an etching mask(S140,S150).

    Abstract translation: 提供一种用于形成电极图案的方法,以通过去除光刻工艺中的光致抗蚀剂的施加,曝光和显影工艺来简化制造工艺。 一种用于制造电极图案的方法包括以下步骤:在衬底的上表面上形成晶种层(S100); 在所述种子层的上表面上附着图案形成膜,并通过用切割激光去除所述图案形成膜的一部分来暴露所述种子层(S110,S120); 在暴露的种子层上形成镀层(S130); 并且通过使用镀层作为蚀刻掩模来去除图案形成膜并蚀刻晶种层(S140,S150)。

    기판의 절연층 형성 방법
    5.
    发明授权
    기판의 절연층 형성 방법 有权
    形成绝缘层的方法

    公开(公告)号:KR101332405B1

    公开(公告)日:2013-11-22

    申请号:KR1020120017051

    申请日:2012-02-20

    Abstract: 기판에 절연층을 형성하는 방법으로, 세라믹 분말을 이용하여 원료 분말을 생성하고, 원료 분말을 에어로졸 증착법을 이용하여 기판에 분사시켜서 세라믹 박막층을 형성한 다음 상기 세라믹 박막층이 형성된 기판 위에 세라믹 그린 시트를 부착시킨 후 소결하여 절연층을 형성한다.

    기판의 절연층 형성 방법
    6.
    发明公开
    기판의 절연층 형성 방법 有权
    形成绝缘层的方法

    公开(公告)号:KR1020130095535A

    公开(公告)日:2013-08-28

    申请号:KR1020120017051

    申请日:2012-02-20

    Abstract: PURPOSE: A method for forming an insulation layer of a substrate is provided to improve bonding property by using a process which is environment-friendly and simple. CONSTITUTION: Raw material powder is sprayed to a substrate. The spraying uses aerosol deposition method. A ceramic thin film layer (122) is formed by the spraying. A ceramic green sheet (124) is attached on the ceramic thin film layer. An insulation layer (120) is formed on the substrate by the attachment.

    Abstract translation: 目的:提供一种形成基板绝缘层的方法,通过使用环境友好且简单的工艺来改善粘合性能。 构成:将原料粉末喷涂到基材上。 喷雾使用气溶胶沉积法。 通过喷涂形成陶瓷薄膜层(122)。 陶瓷生片(124)附着在陶瓷薄膜层上。 通过附件在基板上形成绝缘层(120)。

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