公开(公告)号：KR1020040093799A

公开(公告)日：2004-11-09

申请号：KR1020030027628

申请日：2003-04-30

Applicant: 전자부품연구원

Inventor： 서용곤 ,  윤형도 ,  임영민 ,  김제민 ,  김용탁

IPC: G02B6/40

Abstract: PURPOSE: A method for fabricating an optical array device is provided, in which an etching process and a lithography process are removed and an optical array device is manufactured without an endface process. CONSTITUTION: In the device, an optical fiber(120) having an uncovered coating layer is arrayed on a substrate(100) which is an inverted L shape. A coreless optical fiber(140) is inserted to control an interval between the optical fibers. A predetermined cover(110) is formed thereon. The optical fiber, the substrate, and the cover are adhered closely to each other by pressing and sliding the cover. And, then the optical fiber, the substrate, and the cover are adhered each other by using an adhesive(130).

Abstract translation: 目的：提供一种制造光学阵列器件的方法，其中去除蚀刻工艺和光刻工艺，并且在没有端面工艺的情况下制造光学阵列器件。 构成：在该装置中，将具有未覆盖的涂层的光纤（120）排列在倒L形的基板（100）上。 插入无芯光纤（140）以控制光纤之间的间隔。 在其上形成预定的盖（110）。 通过按压和滑动盖子，光纤，基板和盖子彼此紧密地彼此粘合。 然后，使用粘合剂（130）将光纤，基板和盖子彼此粘合。

公开(公告)号：KR100395302B1

公开(公告)日：2003-08-21

申请号：KR1020010055293

申请日：2001-09-08

Applicant: 전자부품연구원

Inventor： 서용곤 ,  임영민 ,  김제민 ,  김용탁 ,  홍종균

IPC: G02B6/26

Abstract: PURPOSE: An optical fiber fabrication using an asymmetric refractive index of a multi-mode coupler is provided to have more simple using asymmetric refractive index at a multi-mode interference coupler. CONSTITUTION: An input waveguide(11) is connected to the first side of a multi-mode interference coupler(10). An output waveguide(12) is connected to the second side opposite to the first side of the multi-mode interference coupler. A thin film heater(20,21,22) heats a predetermined portion of the multi-mode interference coupler. An optical path is changed as an index of refraction of the coupler becomes asymmetric when the predetermined portion of the multi-mode interference coupler is heated. The thin film heater is overlapped with the predetermined portion of the third side of the coupler, which is one of two corners of the third side which is not adjacent to the first and second sides.

Abstract translation: 目的：提供一种使用多模耦合器的非对称折射率的光纤制造，以在多模干涉耦合器处使用非对称折射率更简单。 构成：输入波导（11）连接到多模干涉耦合器（10）的第一侧。 输出波导（12）连接到与多模干涉耦合器的第一侧相对的第二侧。 薄膜加热器（20,21,22）加热多模干涉耦合器的预定部分。 当多模干涉耦合器的预定部分被加热时，随着耦合器的折射率变得不对称，光路改变。 薄膜加热器与耦合器的第三侧的预定部分重叠，该预定部分是不与第一和第二侧相邻的第三侧的两个角中的一个。

公开(公告)号：KR100459770B1

公开(公告)日：2004-12-04

申请号：KR1020020005174

申请日：2002-01-29

Applicant: 전자부품연구원

Inventor： 서용곤 ,  임영민 ,  김용탁

IPC: H01L31/18

CPC classification number: Y02P70/521

Abstract: PURPOSE: A method for consolidating silica fine particles deposited on a wafer is provided to prevent the contamination due to particles caused by performing a consolidation process after inserting a wafer into a tray. CONSTITUTION: A plurality of wafers(40) including silica fine particles(41) are inserted into a tray. The tray is inserted into an electric furnace(20). A moisture removal process is performed under the temperature of the electric furnace of 700 to 900 degrees centigrade. A snap temperature rise process and a snap temperature fall process are performed. A consolidation process is performed under the temperature of the electric furnace of 1100 to 1350 degrees centigrade. A thermal process is performed under the temperature of the electric furnace of 1000 to 1100 degrees centigrade. The temperature of the electric furnace falls to a predetermined value.

Abstract translation: 目的：提供一种用于固结沉积在晶片上的二氧化硅细颗粒的方法，以防止在将晶片插入托盘中之后通过执行固结过程而引起由于颗粒引起的污染。 构成：将包含二氧化硅细颗粒（41）的多个晶片（40）插入托盘中。 托盘插入电炉（20）。 在700〜900℃的电炉温度下进行水分去除处理。 执行快速升温过程和快速降温过程。 固结过程在1100至1350摄氏度的电炉温度下进行。 在1000〜1100℃的电炉温度下进行热处理。 电炉的温度下降到预定值。

公开(公告)号：KR1020020089871A

公开(公告)日：2002-11-30

申请号：KR1020010028835

申请日：2001-05-25

Applicant: 전자부품연구원

Inventor： 서용곤 ,  임영민 ,  김제민 ,  김용탁

IPC: G02B6/13

Abstract: PURPOSE: An optical waveguide element and a method for fabricating the same are provided to prevent depression and deformation of cores by removing bubbles from a gap between the cores. CONSTITUTION: A lower clad layer is formed on an upper portion of a silicon substrate(20). A lower clad layer(21') as a transparent silica layer is formed by heating a silica layer of the lower clad layer in an electric furnace. A groove is formed by etching the lower clad layer(21'). A core layer is deposited on an upper portion of the lower clad layer(21'). A core(24) is formed by performing an etch process or a polishing process. A silica layer is deposited thereon. An upper clad layer(30') is formed by heating the silica layer. An optical waveguide element can be fabricated by forming a plurality of cores(24,25,26,27,28) between the lower clad layer(21') and the upper clad layer(30').

Abstract translation: 目的：提供一种光波导元件及其制造方法，以通过从芯之间的间隙去除气泡来防止芯的凹陷和变形。 构成：在硅衬底（20）的上部形成下覆盖层。 通过在电炉中加热下包层的二氧化硅层，形成作为透明二氧化硅层的下包层（21'）。 通过蚀刻下包层（21'）形成凹槽。 芯层沉积在下包层（21'）的上部。 通过执行蚀刻工艺或抛光工艺形成芯（24）。 在其上沉积二氧化硅层。 通过加热二氧化硅层形成上包层（30'）。 可以通过在下包层（21'）和上覆层（30'）之间形成多个芯（24,25,26,27,28）来制造光波导元件。

公开(公告)号：KR1020030065031A

公开(公告)日：2003-08-06

申请号：KR1020020005174

申请日：2002-01-29

Applicant: 전자부품연구원

Inventor： 서용곤 ,  임영민 ,  김용탁

IPC: H01L31/18

CPC classification number: Y02P70/521

Abstract: PURPOSE: A method for consolidating silica fine particles deposited on a wafer is provided to prevent the contamination due to particles caused by performing a consolidation process after inserting a wafer into a tray. CONSTITUTION: A plurality of wafers(40) including silica fine particles(41) are inserted into a tray. The tray is inserted into an electric furnace(20). A moisture removal process is performed under the temperature of the electric furnace of 700 to 900 degrees centigrade. A snap temperature rise process and a snap temperature fall process are performed. A consolidation process is performed under the temperature of the electric furnace of 1100 to 1350 degrees centigrade. A thermal process is performed under the temperature of the electric furnace of 1000 to 1100 degrees centigrade. The temperature of the electric furnace falls to a predetermined value.

Abstract translation: 目的：提供一种用于固结沉积在晶片上的二氧化硅细颗粒的方法，以防止在将晶片插入托盘之后由执行固结过程引起的颗粒污染。 构成：将包括二氧化硅细颗粒（41）的多个晶片（40）插入托盘中。 托盘插入电炉（20）中。 在700至900摄氏度的电炉的温度下进行除湿过程。 执行快速升温过程和快速温度下降过程。 在1100〜1350℃的电炉的温度下进行固结处理。 在1000〜1100℃的电炉的温度下进行热处理。 电炉的温度下降到预定值。

公开(公告)号：KR1020030021844A

公开(公告)日：2003-03-15

申请号：KR1020010055293

申请日：2001-09-08

Applicant: 전자부품연구원

Inventor： 서용곤 ,  임영민 ,  김제민 ,  김용탁 ,  홍종균

IPC: G02B6/26

Abstract: PURPOSE: An optical fiber fabrication using an asymmetric refractive index of a multi-mode coupler is provided to have more simple using asymmetric refractive index at a multi-mode interference coupler. CONSTITUTION: An input waveguide(11) is connected to the first side of a multi-mode interference coupler(10). An output waveguide(12) is connected to the second side opposite to the first side of the multi-mode interference coupler. A thin film heater(20,21,22) heats a predetermined portion of the multi-mode interference coupler. An optical path is changed as an index of refraction of the coupler becomes asymmetric when the predetermined portion of the multi-mode interference coupler is heated. The thin film heater is overlapped with the predetermined portion of the third side of the coupler, which is one of two corners of the third side which is not adjacent to the first and second sides.

Abstract translation: 目的：提供使用多模耦合器的不对称折射率的光纤制造，以便在多模干涉耦合器处使用不对称折射率更简单。 构成：输入波导（11）连接到多模干涉耦合器（10）的第一侧。 输出波导（12）连接到与多模干涉耦合器的第一侧相对的第二侧。 薄膜加热器（20,21,22）加热多模干涉耦合器的预定部分。 当多模干涉耦合器的预定部分被加热时，光路改变为耦合器的折射率变得不对称。 薄膜加热器与耦合器的第三侧的预定部分重叠，耦合器是与第一和第二侧不相邻的第三侧的两个角之一。