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公开(公告)号：KR102091938B1
公开(公告)日：2020-03-20
申请号：KR1020180116865
申请日：2018-10-01
Applicant: 전자부품연구원 , 한국생산기술연구원 , 서울과학기술대학교 산학협력단
IPC: H01L23/482 , H01L23/492 , H01L23/00
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Patent Agency Ranking
公开(公告)号：KR1020130055960A
公开(公告)日：2013-05-29
申请号：KR1020110121662
申请日：2011-11-21
Applicant: 전자부품연구원
IPC: H01L21/60
Abstract: PURPOSE: A semiconductor device including a conformal coating thin film and a manufacturing method thereof are provided to stably prevent a lead short between the semiconductor devices by forming a coating layer to cover the semiconductor device with a uniform thickness. CONSTITUTION: A semiconductor chip is mounted on a substrate with a plurality of conductive patterns(S210). The plurality of conductive patterns are bonded to a lead part of the semiconductor chip(S220). A solid conformal resin is located on the semiconductor chip(S230). The semiconductor chip is coated by depositing the solid conformal resin in a vacuum state(S240). [Reference numerals] (AA) Start; (BB) End; (S210) Mount a semiconductor chip on a substrate; (S220) Bond a conductive pattern formed on the substrate to a lead part of the semiconductor chip; (S230) Locate a solid conformal resin on the semiconductor chip; (S240) Coat the semiconductor chip and the lead part by depositing the solid conformal resin in a vacuum state
Abstract translation: 目的：提供包括保形涂层薄膜的半导体器件及其制造方法，通过形成覆盖半导体器件的均匀厚度的涂层来稳定地防止半导体器件之间的引线短路。 构成：半导体芯片安装在具有多个导电图案的基板上（S210）。 多个导电图案被结合到半导体芯片的引线部分（S220）。 固体保形树脂位于半导体芯片上（S230）。 通过在真空状态下沉积固体保形树脂来涂覆半导体芯片（S240）。 （附图标记）（AA）开始; （BB）结束; （S210）将半导体芯片安装在基板上; （S220）将形成在基板上的导电图案与半导体芯片的引线部分接合; （S230）在半导体芯片上找到固体保形树脂; （S240）通过在真空状态下沉积固态保形树脂来覆盖半导体芯片和引线部分
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公开(公告)号：KR1020170077543A
公开(公告)日：2017-07-06
申请号：KR1020150187507
申请日：2015-12-28
Applicant: 전자부품연구원
IPC: H01L25/16 , H01L25/10 , H01L25/065 , H01L23/13 , H01L29/861
Abstract: 보다소형화되어최적의집적화가가능한소형전력모듈및 그의제조방법이제공된다. 본발명에따른소형전력모듈은, 제1하부회로배선층, 제1절연층및 제1상부회로배선층을포함하는제1기판; 제1기판상에적어도하나의제1파워디바이스를포함하는제1파워디바이스층; 제1파워디바이스상의제2하부회로배선층, 제2절연층및 제2상부회로배선층을포함하는제2기판; 및제2기판상에적어도하나의제2파워디바이스를포함하는제2파워디바이스층;을포함한다.
Abstract translation: 提供了一种紧凑型功率模块及其制造方法，其可以更小型化并且优化用于集成。 根据本发明的小功率模块包括：第一基板，包括第一下电路布线层，第一绝缘层和第一上电路布线层; 第一功率器件层，其包括在第一衬底上的至少一个第一功率器件; 第二基板，包括在所述第一功率器件上的第二下电路布线层，第二绝缘层和第二上电路布线层; 并且第二功率器件层包括在第二衬底上的至少一个第二功率器件。
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公开(公告)号：KR1020170077541A
公开(公告)日：2017-07-06
申请号：KR1020150187504
申请日：2015-12-28
Applicant: 전자부품연구원
IPC: H01L23/40 , H01L23/14 , H01L23/495 , H01L23/367
Abstract: 방열특성이우수하여신뢰성이향상된전력모듈및 그의제조방법이제공된다. 본발명에따른전력모듈은, 전력모듈은, 하부전극층, 절연층및 상부전극층을포함하는절연기판; 및절연기판의상부에절연기판과소정간격이격되어실장되는전력반도체소자를포함하는전력반도체층;을포함한다.
Abstract translation: 提供了具有改进的散热特性和改进的可靠性的功率模块及其制造方法。 根据本发明的功率模块的特征在于，功率模块包括：包括下电极层，绝缘层和上电极层的绝缘基板; 以及功率半导体层，其包括功率半导体器件，所述功率半导体器件安装在绝缘基板上，离绝缘基板预定距离。
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公开(公告)号：KR101294281B1
公开(公告)日：2013-08-07
申请号：KR1020110121662
申请日：2011-11-21
Applicant: 전자부품연구원
IPC: H01L21/60
Abstract: 본 발명에서는 액상 컨포멀 코팅 수지를 이용하여 컨포멀 코팅 박막을 형성하는 것이 아니라 고상의 컨포멀 코팅 수지를 마련하고, 이를 진공 증착법을 이용해 반도체 소자 상에 컨포멀 코팅 박막을 형성한다. 따라서, 반도체 소자 상에 균일한 두께의 컨포멀 코팅 박막을 형성할 수 있게 되고, 반도체 소자 간 리드 단락을 안정적으로 방지할 수 있다.
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公开(公告)号：KR1020130055961A
公开(公告)日：2013-05-29
申请号：KR1020110121663
申请日：2011-11-21
Applicant: 전자부품연구원
IPC: H01L21/60
CPC classification number: H01L2224/11 , H01L2924/00012
Abstract: PURPOSE: A semiconductor device and a method for forming a solder ball bump for a semiconductor substrate are provided to stably mount a semiconductor chip with high performance on a substrate by accurately forming a solder bump in a fine pitch below 150 um. CONSTITUTION: Magnetic materials with first magnetism are coated on the surface of a solder ball(S310). Magnetic materials with second magnetism are coated on a conductive pad formed on the semiconductor substrate(S320). The first magnetism is opposite to the second magnetism. The solder ball coated with the magnetic materials with the first magnetism is transferred on the conductive pad coated with the magnetic materials with the second magnetism(S330). A solder bump is formed by heating the semiconductor substrate with the transferred solder ball over a solder ball melting point(S340). [Reference numerals] (AA) Start; (BB) End; (S310) Coat magnetic materials with first magnetism on the surface of a solder ball; (S320) Coat magnetic materials with second magnetism opposite magnetism of the first magnetism on a conductive pad formed on a semiconductor substrate; (S330) Transfer the solder ball coated with the magnetic materials with the first magnetism on the conductive pad coated with the magnetic materials with the second magnetism; (S340) Form a solder bump by heating the semiconductor substrate with the transferred solder ball over a solder ball melting point
Abstract translation: 目的：提供用于形成用于半导体衬底的焊球凸块的半导体器件和方法，以通过以小于150μm的精细间距精确地形成焊料凸块，将具有高性能的半导体芯片稳定地安装在衬底上。 构成：具有第一磁性的磁性材料涂覆在焊球的表面上（S310）。 具有第二磁性的磁性材料涂覆在形成在半导体衬底上的导电焊盘上（S320）。 第一磁性与第二磁性相反。 用第一磁性涂覆有磁性材料的焊球在具有第二磁性的磁性材料涂覆的导电焊盘上转移（S330）。 通过用焊球熔点加热转移的焊球，形成焊料凸块（S340）。 （附图标记）（AA）开始; （BB）结束; （S310）焊球表面具有第一磁性的磁性材料; （S320）在形成在半导体基板上的导电焊盘上涂敷具有与第一磁性磁性相反的第二磁性的磁性材料; （S330）将第一磁性涂覆有磁性材料的焊球用第二磁性的磁性材料涂覆在导电焊盘上; （S340）通过在焊球熔点上用转印的焊球加热半导体衬底来形成焊料凸点
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