Abstract:
PURPOSE: A semiconductor device including a conformal coating thin film and a manufacturing method thereof are provided to stably prevent a lead short between the semiconductor devices by forming a coating layer to cover the semiconductor device with a uniform thickness. CONSTITUTION: A semiconductor chip is mounted on a substrate with a plurality of conductive patterns(S210). The plurality of conductive patterns are bonded to a lead part of the semiconductor chip(S220). A solid conformal resin is located on the semiconductor chip(S230). The semiconductor chip is coated by depositing the solid conformal resin in a vacuum state(S240). [Reference numerals] (AA) Start; (BB) End; (S210) Mount a semiconductor chip on a substrate; (S220) Bond a conductive pattern formed on the substrate to a lead part of the semiconductor chip; (S230) Locate a solid conformal resin on the semiconductor chip; (S240) Coat the semiconductor chip and the lead part by depositing the solid conformal resin in a vacuum state
Abstract:
경량화 태양전지 모듈이 개시된다. 본 발명의 일 실시예에 따른 경량화 태양전지 모듈은 태양전지판; 태양전지판 양면에 각각 부착되는 EVA 시트; 태양전지판의 전면 방향에 배치되는 것으로 EVA 시트에 부착되는 투명 기재; 태양전지판의 후면 방향에 배치되는 것으로 EVA 시트에 부착되는 백시트; 및 태양전지판, EVA 시트, 투명 기재 및 백시트의 결합 모듈을 내측에 수용하여 결합되는 모듈 프레임을 포함하고, 투명 기재는 투명 플라스틱 재료로 형성되고, 모듈 프레임은 합성 고분자 재료로 형성된다.
Abstract:
PURPOSE: A device and a method for measuring the splitting resistance of solar cell components are provided to quantitatively measure the splitting resistance of a back sheet or between various sheet layers of a solar cell panel without splitting some of the back sheets regardless of hardening the back sheet. CONSTITUTION: A device for measuring the splitting resistance of solar cell components includes a stud assembly (110), an operation unit, and a measuring unit. The stud assembly fixes a solar cell panel for measuring the splitting resistance between layers of the multi-layered solar cell panel. The operation unit moves the stud assembly in opposite directions. The measuring unit measures a change in the tensile strength of the stud assembly. The stud assembly includes a first stud (111) in which a first fixing groove (113a) is formed and a second stud (112) in which a second fixing groove (113b) is formed. A lower layer of the panel is received and fixed to the first fixing groove. An upper layer of the panel is received and fixed to the second fixing groove. The first and second studs vertically move in opposite directions.