公开(公告)号：KR101513494B1

公开(公告)日：2015-04-21

申请号：KR1020130149999

申请日：2013-12-04

Applicant: 엠케이전자 주식회사 ,  호서대학교 산학협력단 ,  한국과학기술원 ,  한국생산기술연구원 ,  전자부품연구원

Inventor： 홍성재 ,  김근수 ,  이창우 ,  방정환 ,  고용호 ,  이혁모 ,  장재원 ,  구자현 ,  문정탁 ,  이영우 ,  홍원식 ,  김휘중 ,  이재홍

IPC: B23K35/26 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/025 ,  B23K2201/40 ,  B23K2201/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00

Abstract: 본발명은무연솔더, 솔더페이스트및 반도체장치에관한것으로서, 구체적으로구리 (Cu) 약 0.1 중량% 내지약 0.8 중량%; 팔라듐 (Pd) 약 0.001 중량% 내지약 0.1 중량%; 알루미늄 (Al) 약 0.001 중량% 내지약 0.1 중량%; 및실리콘 (Si) 약 0.001 중량% 내지약 0.1 중량% 포함하고잔부가주석(Sn) 및불가피불순물인무연솔더, 이를포함하는솔더페이스트및 반도체장치에관한것이다. 본발명은친환경적이면서고온안정성이뛰어나고신뢰도가우수한무연솔더와솔더페이스트를제공하는효과가있다.

Abstract translation: 本发明涉及一种无铅焊料，焊膏和半导体器件。 更具体地，无铅焊料包括：约0.1-0.8重量％的CU; 约0.001-0.1重量％的Pd; 约0.001-0.1重量％的Al; 约0.001-0.1重量％的Si; 其余为Sn和不可避免的杂质。 本发明提供了具有优异的高温稳定性和优异的可靠性的无铅焊料和焊膏，具有环境可行性。

公开(公告)号：KR100765363B1

公开(公告)日：2007-10-09

申请号：KR1020050102912

申请日：2005-10-31

Applicant: 전자부품연구원

Inventor： 이미정 ,  홍성재 ,  김원근 ,  한정인

IPC: H01B1/22

CPC classification number: H01B1/22 ,  C23C18/1635 ,  C23C18/1641 ,  C23C18/206 ,  C23C18/285 ,  C23C18/30 ,  C23C18/31 ,  C23C18/42 ,  Y10T428/25

Abstract: A method for manufacturing conductive particles is provided to enhance process safety and lower a production cost by omitting a pre-treatment process for plating, reducing two plating processes into one plating process, and decreasing harmful materials generated from the conventional process. A method for manufacturing conductive particles includes the steps of: (S210) providing polymeric resin-based particles; (S220) forming a nanopowder layer on the surfaces of the polymer resin-based particles; and (S230) performing electroless plating on the formed nanopowder layer. In the step(S220) of forming a nanopowder layer on the surfaces of the polymeric resin-based particles, the nanopowder layer is formed by using a dry physical attachment method. The polymeric resin-based particles are a material selected from the group comprising acrylic, urethane-based, and ethylene-based resins.

Abstract translation: 提供导电粒子的制造方法，通过省略电镀用的预处理工序，将两个电镀工序减少为一个电镀工序，减少常规工序产生的有害物质，提高工艺安全性，降低生产成本。 制造导电颗粒的方法包括以下步骤：（S210）提供聚合树脂基颗粒; （S220），在聚合物树脂类粒子的表面形成纳米粉末层; 和（S230）在形成的纳米粉末层上进行无电镀。 在聚合物树脂基颗粒的表面上形成纳米粉末层的步骤（S220）中，通过使用干物理附着方法形成纳米粉末层。 聚合物树脂基颗粒是选自丙烯酸，氨基甲酸酯基和乙烯类树脂的材料。

公开(公告)号：KR1020140137514A

公开(公告)日：2014-12-03

申请号：KR1020130057958

申请日：2013-05-22

Applicant: 엠케이전자 주식회사 ,  한국과학기술원 ,  전자부품연구원 ,  한국생산기술연구원

Inventor： 홍성재 ,  김근수 ,  이창우 ,  방정환 ,  고용호 ,  이혁모 ,  장재원 ,  문정탁 ,  이영우 ,  홍원식 ,  구자현 ,  이재홍

IPC: B23K35/26 ,  H01L21/60

CPC classification number: H01L2224/10

Abstract: The present invention relates to a lead-free solder and semiconductor components comprising the same. More specifically, The lead-free solder contains 0.5-1.0 wt% of copper (Cu), 0.001-0.1 wt% of palladium (Pd), and the remnant which is composed of tin (Sn). The present invention is environmentally friendly and has excellent high-temperature safety and excellent wetting properties, thereby enabling to obtain usable lead-free solder for the car semiconductor.

Abstract translation: 本发明涉及一种无铅焊料和包含该无铅焊料的半导体元件。 更具体地，无铅焊料含有铜（Cu）0.5-1.0重量％，钯（Pd）0.001-0.1重量％和由锡（Sn）组成的残余物。 本发明是环保型的，具有优异的高温安全性和优异的润湿性，从而能够获得用于汽车半导体的可用的无铅焊料。

公开(公告)号：KR100666124B1

公开(公告)日：2007-01-09

申请号：KR1020050102913

申请日：2005-10-31

Applicant: 전자부품연구원

Inventor： 이미정 ,  홍성재 ,  김원근 ,  한정인

IPC: C09J9/02 ,  C09J7/02

CPC classification number: C09J7/00 ,  C09J9/02 ,  C09J2201/602 ,  C09J2205/10

Abstract: A method for manufacturing an anisotropic conductive adhesive film is provided to allow conductive particles to be dispersed via an electrostatic spinning process so that the particles are disposed in polymer fiber strands, and thus prevents a short caused by the conductive particles contacted with each other. The method for manufacturing an anisotropic conductive adhesive film comprises: a step(S210) of mixing a heat curable adhesive polymer solution with conductive particles; a step(S220) of performing electrostatic spinning of the heat curable adhesive polymer solution mixed with the conductive particles through a nozzle to which a predetermined voltage is applied to for polymer fibers; a step(S230) of forming the polymer fibers on a substrate in the shape of a sheet.

Abstract translation: 提供了制造各向异性导电粘合剂膜的方法，以通过静电纺丝工艺使导电颗粒分散，使得颗粒被布置在聚合物纤维束中，从而防止由导电颗粒彼此接触引起的短路。 各向异性导电粘合剂膜的制造方法包括：将热固性粘合性聚合物溶液与导电性粒子混合的工序（S210） 通过施加预定电压的喷嘴将聚合物纤维与导电性粒子混合的热固性粘合性聚合物溶液进行静电纺丝的工序（S220） 在片状的基板上形成聚合物纤维的工序（S230）。

公开(公告)号：KR101549810B1

公开(公告)日：2015-09-04

申请号：KR1020130057958

申请日：2013-05-22

Applicant: 엠케이전자 주식회사 ,  한국과학기술원 ,  전자부품연구원 ,  한국생산기술연구원

Inventor： 홍성재 ,  김근수 ,  이창우 ,  방정환 ,  고용호 ,  이혁모 ,  장재원 ,  문정탁 ,  이영우 ,  홍원식 ,  구자현 ,  이재홍

IPC: B23K35/26 ,  H01L21/60

CPC classification number: H01L2224/10

Abstract: 본발명은무연솔더및 그를포함하는반도체부품에관한것으로서, 더욱구체적으로는구리(Cu) 0.5 중량% 내지 1.0 중량% 및팔라듐(Pd) 0.001 중량% 내지 0.1 중량%를포함하고, 잔부가주석(Sn)인무연솔더및 그를포함하는반도체부품에관한것이다. 본발명은친환경적일뿐만아니라고온안정성이우수하고또한젖음성이우수하여자동차용반도체에유용하게사용가능한무연솔더를얻을수 있는효과가있다.