公开(公告)号：KR100465531B1

公开(公告)日：2005-01-13

申请号：KR1020030028246

申请日：2003-05-02

Applicant: 전자부품연구원

Inventor： 박준식 ,  황완식 ,  박순섭 ,  조진우 ,  정석원 ,  이인규

IPC: B81C1/00

Abstract: PURPOSE: A micro mold for reproducing micro parts and a method for manufacturing the same are provided to achieve a mechanical characteristic superior to that of a Ni plating mold by performing Ni plating for a master mold and sequentially coating an Ni-W alloy on the Ni plating. CONSTITUTION: A method for manufacturing a micro mold includes a first process of forming an Ni master mold(200) by performing electroplating on developed and etched sections of a substrate, a second process of coating an Ni-W alloy(300a) on an upper surface of the Ni master mold(200), and a third process of removing a photoresist from the substrate. While performing the first process, current is applied through a direct current scheme, a pulse scheme, or a pulse-reverse scheme. The pulse-reverse scheme is carried out by using a plastic injection molding material.

Abstract translation: 目的：提供一种用于再现微小部件的微型模具及其制造方法，以通过对母模进行Ni电镀并在Ni上依次涂覆Ni-W合金来实现优于Ni电镀模具的机械特性 电镀。 用于制造微型模具的方法包括：通过在基板的显影区域和蚀刻区域上执行电镀来形成Ni主模具（200）的第一工艺，在基板的上表面上涂覆Ni-W合金（300a）的第二工艺 Ni主模具（200）的表面以及从衬底去除光刻胶的第三工艺。 在执行第一个过程时，通过直流方案，脉冲方案或脉冲反向方案施加电流。 脉冲反转方案通过使用塑料注射成型材料来执行。

公开(公告)号：KR1020040094460A

公开(公告)日：2004-11-10

申请号：KR1020030028246

申请日：2003-05-02

Applicant: 전자부품연구원

Inventor： 박준식 ,  황완식 ,  박순섭 ,  조진우 ,  정석원 ,  이인규

IPC: B81C1/00

CPC classification number: B81C1/00031 ,  B29C33/38 ,  B29C33/42 ,  B81C1/00444 ,  B81C2201/034

Abstract: PURPOSE: A micro mold for reproducing micro parts and a method for manufacturing the same are provided to achieve a mechanical characteristic superior to that of a Ni plating mold by performing Ni plating for a master mold and sequentially coating an Ni-W alloy on the Ni plating. CONSTITUTION: A method for manufacturing a micro mold includes a first process of forming an Ni master mold(200) by performing electroplating on developed and etched sections of a substrate, a second process of coating an Ni-W alloy(300a) on an upper surface of the Ni master mold(200), and a third process of removing a photoresist from the substrate. While performing the first process, current is applied through a direct current scheme, a pulse scheme, or a pulse-reverse scheme. The pulse-reverse scheme is carried out by using a plastic injection molding material.

Abstract translation: 目的：提供一种用于再现微型部件的微型模具及其制造方法，以通过对母模进行Ni镀层并在Ni上依次涂覆Ni-W合金来实现优于Ni镀覆模具的机械特性 电镀。 构成：微型模具的制造方法包括：通过在基板的显影和蚀刻部分上进行电镀来形成Ni母模（200）的第一工序，在上部涂覆Ni-W合金（300a）的第二工序 Ni母模（200）的表面，以及从基板去除光致抗蚀剂的第三工序。 在执行第一过程时，通过直流方案，脉冲方案或脉冲反向方案施加电流。 脉冲反向方案通过使用塑料注射成型材料进行。