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公开(公告)号：KR1020100119057A
公开(公告)日：2010-11-09
申请号：KR1020090037974
申请日：2009-04-30
Applicant: 전자부품연구원
IPC: G01N27/12 , H01L21/203
Abstract: PURPOSE: A micro-gas sensor and a manufacturing method thereof, which directly forms various sensing materials on a narrow space for a patterning process, is provided to reduce manufacturing processes by omitting an organic removal process. CONSTITUTION: A micro-gas sensor comprises a semiconductor substrate(100), a micro heater layer, a sensing electrode layer and a sensing material layer. The micro heater layer is formed on the top part of the substrate. The sensing electrode layer is formed on the micro heater. The sensing material layer is formed on the top of the sensing electrode layer. A first insulation layer is formed between the semiconductor substrate and the micro heater layer.
Abstract translation: 目的：提供一种微气体传感器及其制造方法，其在窄空间上直接形成用于图案化工艺的各种感测材料，以通过省略有机去除工艺来减少制造工艺。 构成：微气体传感器包括半导体衬底（100），微加热器层，感测电极层和传感材料层。 微加热器层形成在基板的顶部。 感测电极层形成在微加热器上。 感测材料层形成在感测电极层的顶部。 在半导体衬底和微加热器层之间形成第一绝缘层。
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公开(公告)号：KR1020040094460A
公开(公告)日：2004-11-10
申请号：KR1020030028246
申请日：2003-05-02
Applicant: 전자부품연구원
IPC: B81C1/00
CPC classification number: B81C1/00031 , B29C33/38 , B29C33/42 , B81C1/00444 , B81C2201/034
Abstract: PURPOSE: A micro mold for reproducing micro parts and a method for manufacturing the same are provided to achieve a mechanical characteristic superior to that of a Ni plating mold by performing Ni plating for a master mold and sequentially coating an Ni-W alloy on the Ni plating. CONSTITUTION: A method for manufacturing a micro mold includes a first process of forming an Ni master mold(200) by performing electroplating on developed and etched sections of a substrate, a second process of coating an Ni-W alloy(300a) on an upper surface of the Ni master mold(200), and a third process of removing a photoresist from the substrate. While performing the first process, current is applied through a direct current scheme, a pulse scheme, or a pulse-reverse scheme. The pulse-reverse scheme is carried out by using a plastic injection molding material.
Abstract translation: 目的：提供一种用于再现微型部件的微型模具及其制造方法，以通过对母模进行Ni镀层并在Ni上依次涂覆Ni-W合金来实现优于Ni镀覆模具的机械特性 电镀。 构成：微型模具的制造方法包括：通过在基板的显影和蚀刻部分上进行电镀来形成Ni母模（200）的第一工序，在上部涂覆Ni-W合金（300a）的第二工序 Ni母模（200）的表面，以及从基板去除光致抗蚀剂的第三工序。 在执行第一过程时，通过直流方案，脉冲方案或脉冲反向方案施加电流。 脉冲反向方案通过使用塑料注射成型材料进行。
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公开(公告)号：KR101090739B1
公开(公告)日：2011-12-08
申请号：KR1020090037974
申请日：2009-04-30
Applicant: 전자부품연구원
IPC: G01N27/12 , H01L21/203
Abstract: 반도체기판; 상기반도체기판상에형성되는마이크로히터층; 상기마이크로히터상에형성되는감지전극층; 상기감지전극상부에형성되는감지물질층을포함하고, 상기감지물질층은상기감지전극층상에미리형성된촉매층을이용하여상기감지전극층상에직접성장되어형성되는것을특징으로하는마이크로가스센서및 그제조방법을제공한다.
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公开(公告)号：KR100465531B1
公开(公告)日：2005-01-13
申请号：KR1020030028246
申请日：2003-05-02
Applicant: 전자부품연구원
IPC: B81C1/00
Abstract: PURPOSE: A micro mold for reproducing micro parts and a method for manufacturing the same are provided to achieve a mechanical characteristic superior to that of a Ni plating mold by performing Ni plating for a master mold and sequentially coating an Ni-W alloy on the Ni plating. CONSTITUTION: A method for manufacturing a micro mold includes a first process of forming an Ni master mold(200) by performing electroplating on developed and etched sections of a substrate, a second process of coating an Ni-W alloy(300a) on an upper surface of the Ni master mold(200), and a third process of removing a photoresist from the substrate. While performing the first process, current is applied through a direct current scheme, a pulse scheme, or a pulse-reverse scheme. The pulse-reverse scheme is carried out by using a plastic injection molding material.
Abstract translation: 目的：提供一种用于再现微小部件的微型模具及其制造方法，以通过对母模进行Ni电镀并在Ni上依次涂覆Ni-W合金来实现优于Ni电镀模具的机械特性 电镀。 用于制造微型模具的方法包括：通过在基板的显影区域和蚀刻区域上执行电镀来形成Ni主模具（200）的第一工艺，在基板的上表面上涂覆Ni-W合金（300a）的第二工艺 Ni主模具（200）的表面以及从衬底去除光刻胶的第三工艺。 在执行第一个过程时，通过直流方案，脉冲方案或脉冲反向方案施加电流。 脉冲反转方案通过使用塑料注射成型材料来执行。
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