公开(公告)号：KR100678689B1

公开(公告)日：2007-02-02

申请号：KR1020050136065

申请日：2005-12-30

Applicant: 제일모직주식회사

Inventor： 배경철 ,  유제홍 ,  장대희 ,  이숭욱

IPC: C08L63/00 ,  C08L77/00 ,  C08K3/00

Abstract: Provided is an epoxy resin composition for encapsulating semiconductor devices, which uses a halogen-free flame retardant, emits no substances harmful to the human body and environment, shows excellent flame retardant, humidity resistance and moldability. The epoxy resin composition for encapsulating semiconductor devices comprises an epoxy resin, a curing agent, a flame retardant, a curing accelerator and an inorganic filler. In the epoxy resin composition, a melamine resin and a silica-coated melamine resin as the flame retardant, and the curing accelerant includes an adduct of tertiary phosphine with para-benzoquinone represented by the following formula, wherein R is a C1-C4 alkyl group or alkoxy group, and m is an integer of 0-3.

Abstract translation: 本发明提供一种半导体装置密封用环氧树脂组合物，其使用无卤阻燃剂，不会释放出对人体和环境有害的物质，显示优异的阻燃性，耐湿性和成型性。 用于封装半导体器件的环氧树脂组合物包含环氧树脂，固化剂，阻燃剂，固化促进剂和无机填料。 在环氧树脂组合物中，三聚氰胺树脂和二氧化硅包覆的三聚氰胺树脂作为阻燃剂，并且固化促进剂包括由下式表示的叔膦与对苯醌的加合物，其中R为C1-C4烷基 或烷氧基，并且m是0-3的整数。

公开(公告)号：KR100678686B1

公开(公告)日：2007-02-05

申请号：KR1020050136064

申请日：2005-12-30

Applicant: 제일모직주식회사

Inventor： 장대희 ,  유제홍 ,  배경철

IPC: C08L63/00 ,  C08K3/00 ,  C08K5/00

Abstract: Provided is an epoxy resin composition for encapsulating semiconductor devices, which shows excellent flame resistance without using a halogen-containing flame retardant, and has improved moldability and reliability characteristics. The epoxy resin composition for encapsulating semiconductor devices comprises an epoxy resin, a curing agent, a flame retardant, a curing accelerant and an inorganic filler. In the composition, the flame retardant includes any one of a sodium borate hydrate represented by the formula of H3BO3*Na2[B4O5(OH)4]*8H2O and an ammonium sulfate-ammonium phosphate-potassium carbonate composite represented by the formula of (NH4)2SO4*K2CO3*NH4H2PO4. The curing accelerant includes an adduct of tertiary phosphine with para-benzoquinone represented by the following formula 3, wherein R is a C1-C4 alkyl group or alkoxy group, and m is an integer of 0-3.

Abstract translation: 本发明提供一种半导体装置密封用环氧树脂组合物，其不使用含卤素阻燃剂而显示优异的阻燃性，并且成型性，可靠性特性得到改善。 用于封装半导体器件的环氧树脂组合物包含环氧树脂，固化剂，阻燃剂，固化促进剂和无机填料。 在该组合物中，阻燃剂包括由式H3BO3·Na2 [B4O5（OH）4]·8H2O表示的硼酸钠水合物和由式（NH4）2·4H2O表示的硫酸铵 - 磷酸铵 - 碳酸钾复合物中的任何一种 ）2 SO 4 *碳酸钾*磷酸二氢铵。 固化促进剂包括由下式3表示的叔膦与对苯醌的加合物，其中R为C1-C4烷基或烷氧基，m为0-3的整数。