公开(公告)号：KR100762961B1

公开(公告)日：2007-10-04

申请号：KR1020060050642

申请日：2006-06-07

Applicant: 충남대학교산학협력단

Inventor： 최호석 ,  이창수 ,  허강무 ,  이현준 ,  임정혁 ,  이효수 ,  김창현

IPC: C08F220/34 ,  C08F226/06 ,  C08F220/36

CPC classification number: C08F226/08 ,  C08F220/56 ,  C08F226/02

Abstract: A microelectronic package substrate is provided to secure good quality and be mass-produced by using an organic solderability preservative having more excellent high-temperature stability than the conventional organic solderability preservative. A microelectronic package substrate is manufactured by using a poly(4-vinyl pyridine-co-ally amine) of the following formula 1 or a poly(4-vinyl pyridine-co-acryl amide) of the following formula 2 as an organic solderability preservative. The polymer for organic solderability preservatives has a molecular weight of 300-30,000. The organic solderability preservative is prepared by adding a radical initiator to a mixture of 4-vinyl pyridine and allyl amine or acryl amide to polymerize the admixture.

Abstract translation: 提供微电子封装基板以通过使用具有比常规有机可焊性防腐剂更高的高温稳定性的有机可焊性防腐剂来确保良好的质量并进行批量生产。 通过使用下式1的聚（4-乙烯基吡啶 - 共聚胺）或下式2的聚（4-乙烯基吡啶 - 共 - 丙烯酰胺）作为有机可焊性防腐剂制造微电子封装基板 。 用于有机可焊性防腐剂的聚合物的分子量为300-30,000。 通过向4-乙烯基吡啶和烯丙基胺或丙烯酰胺的混合物中加入自由基引发剂来聚合该混合物来制备有机可焊性防腐剂。