Abstract:
PURPOSE: A photosensitive resin composition, a manufacturing method of cured products, photo solder resist ink, a dry film style photo solder resist, and a photosensitive resin are provided to enhance photosensitivity for an active energy ray. CONSTITUTION: A photosensitive resin composition comprises a photosensitive resin, an epoxy group-containing compound, a deblocking isocyanate group-containing compound, one or more a compound selected from a group consisting of beta-hydroxyalkyl amide group-containing compound and a blocking isocyanate group-containing compound, and a photopolymerization initiator. The photosensitive resin is a hydroxyl group containing photosensitive resin.