公开(公告)号：KR1020070006787A

公开(公告)日：2007-01-11

申请号：KR1020067019350

申请日：2005-03-11

Applicant: 파나소닉 주식회사

Inventor： 후쿠사코히로유키 ,  세노가즈노리

IPC: H01L23/36 ,  H01L23/367

CPC classification number: H01L23/50 ,  G02F1/13452 ,  H01L23/3677 ,  H01L23/4985 ,  H01L23/552 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0393 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: Disclosed is a driver module structure comprising a flexible substrate (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible substrate (2), and a conductive heat-dissipating body (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8), and the flexible substrate (2) is provided with a hole (9) through which a part of the ground wiring pattern (8) is exposed. The exposed ground wiring pattern (8) and the heat-dissipating body (4) are electrically connected through a member (11) fitted in the hole (9). ® KIPO & WIPO 2007

Abstract translation: 公开了一种驱动器模块结构，其包括设置有布线图案（7）的柔性基板（2），安装在柔性基板（2）上的半导体器件）和与半导体器件接合的导电散热体（4）。 布线图案（7）包括接地布线图案（8），柔性基板（2）设置有露出接地布线图案（8）的一部分的孔（9）。 暴露的接地布线图案（8）和散热体（4）通过装配在孔（9）中的构件（11）电连接。 ®KIPO＆WIPO 2007

公开(公告)号：KR1020080033549A

公开(公告)日：2008-04-16

申请号：KR1020087007105

申请日：2005-03-11

Applicant: 파나소닉 주식회사

Inventor： 후쿠사코히로유키 ,  세노가즈노리

IPC: G02F1/1345 ,  H01L23/36 ,  H01L23/367

CPC classification number: H01L23/50 ,  G02F1/13452 ,  H01L23/3677 ,  H01L23/4985 ,  H01L23/552 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0393 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: Disclosed is a driver module structure comprising a flexible substrate (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible substrate (2), and a conductive heat-dissipating body (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8), and the flexible substrate (2) is provided with a hole (9) through which a part of the ground wiring pattern (8) is exposed. The exposed ground wiring pattern (8) and the heat-dissipating body (4) are electrically connected through a member (11) fitted in the hole (9).

Abstract translation: 公开了一种驱动器模块结构，其包括设置有布线图案（7）的柔性基板（2），安装在柔性基板（2）上的半导体器件）和与半导体器件接合的导电散热体（4）。 布线图案（7）包括接地布线图案（8），柔性基板（2）设置有露出接地布线图案（8）的一部分的孔（9）。 暴露的接地布线图案（8）和散热体（4）通过装配在孔（9）中的构件（11）电连接。