公开(公告)号：KR100442413B1

公开(公告)日：2004-07-30

申请号：KR1020010047123

申请日：2001-08-04

Applicant: 학교법인 포항공과대학교

Inventor： 한종훈 ,  박용민 ,  김영찬 ,  심봉주

IPC: B29C65/64

CPC classification number: B81C1/00111 ,  B29C66/74281 ,  B29C66/74285 ,  B81B2201/051 ,  B81C99/009 ,  B82Y30/00 ,  H05K3/20 ,  H05K3/389 ,  H05K2203/016 ,  Y10S428/914 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: 본 발명은 유리 또는 실리카 판 상의 금속 미세 패턴을 안정적이고 재현성있게 플라스틱 판 위로 전이시켜 플라스틱 위에 금속 미세 패턴을 형성하는 방법에 관한 것으로, 유리나 기타 증착이 가능한 기판 위에 통상의 방법을 이용하여 금속의 미세 패턴을 형성시킨 다음 필요에 따라서는 자기조립의 특성을 가지고 있는 물질 또는 코로나 방전 등을 이용하여 금속 패턴 표면 또는 패턴이 전이될 플라스틱 표면을 친수성으로 변화시킨 후 이들 두 표면을 직접 접촉시켜 전이를 일으킴을 특징으로 한다.
본 발명의 방법은 기존의 유리판 위에 금속 미세 패턴을 제작하는 방법에 사용되는 기기 이외의 별도의 기기가 필요하지 않으며, 여러 가지의 마이크로패턴도 플라스틱 판 위로 전이시킬 수 있을 뿐 아니라, 기존의 방법으로는 구현하기 어려웠던 플라스틱 내의 미세 패턴이나 전극의 제작을 가능하게 하여 플라스틱 상에서 안정한 금속 전극을 대량으로 생산할 수 있으며, 이를 랩온어칩에 응용할 경우 휴대용 고성능 전기분석 검출 칩의 제작이 가능하다.

Abstract translation: 一种方法，包括在无机基材的表面上形成金属微图案，对金属微图案的表面和塑料基材的表面进行表面处理以使其具有化学反应性，并使金属微图案 与塑料基板的表面接触以将金属微图案从无机基板的表面转移到塑料基板的表面，可以使用常规设备容易且简单地进行以产生固定在基板上的一个或多个金属图案 一种塑料材料。

公开(公告)号：KR100425536B1

公开(公告)日：2004-03-30

申请号：KR1020010042802

申请日：2001-07-16

Applicant: 학교법인 포항공과대학교

Inventor： 한종훈 ,  심봉주 ,  노경원 ,  박용민

IPC: G01N35/00

CPC classification number: B01L9/527 ,  B01F5/0646 ,  B01F5/0647 ,  B01F13/0059 ,  B01F15/00935 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00828 ,  B01J2219/00831 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00862 ,  B01J2219/00871 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2200/028 ,  B01L2200/10 ,  B01L2300/0816 ,  B01L2400/0406 ,  B01L2400/0415 ,  B01L2400/0487

Abstract: A microfluidic breadboard comprises a plurality of pairs of openings formed on an upper surface of a substrate and arranged at regular intervals, wherein each pair of openings are connected to each other through a microchannel formed in the bulk of the substrate so that the microfluidic breadboard has an array of U-shaped microchannels. An assembly microchip comprises a microfluidic breadboard having an array of U-shaped microchannels and a couple of modules, wherein the modules are reversibly or irreversibly bonded to the upper surface of the breadboard, and some of U-shaped microchannels of the breadboard are interconnected through the microchannels of the modules. Herein, the modules are designed to perform functions, such as injection, mixing, extraction, purification, concentration, dilution, reaction, synthesis, separation, and detection. In this way, we can make a variety of prototypes of microchips cheaper and faster because this does not require the photolithographic process, which facilitates designing of microfluidic chips through rapid optimization. Therefore, the assembly microchip using the microfluidic breadboard of the present invention may be advantageously applied to manufacture in an economical way a multipurpose lab-on-a-chip which can be used in the field of chemistry, biotechnology, chemical/environmental engineering, etc.

Abstract translation: 微流体面包板包括形成在基底的上表面上且以规则间隔布置的多对开口，其中每对开口通过形成在基底主体中的微通道彼此连接，使得微流体面包板具有 一系列U形微通道。 组件微芯片包括具有U形微通道阵列和一对模块的微流体面包板，其中模块可逆地或不可逆地结合到面包板的上表面，并且面包板的一些U形微通道通过 模块的微通道。 此处，模块设计用于执行功能，例如注射，混合，提取，纯化，浓缩，稀释，反应，合成，分离和检测。 通过这种方式，我们可以使各种原型的微芯片更便宜和更快，因为这不需要光刻工艺，这有助于通过快速优化来设计微流体芯片。 因此，使用本发明的微流体面包板的组装微芯片可以有利地应用于以经济的方式制造可用于化学，生物技术，化学/环境工程等领域的多用途芯片实验室（lab-on-a-chip） 。

公开(公告)号：KR1020030012717A

公开(公告)日：2003-02-12

申请号：KR1020010047123

申请日：2001-08-04

Applicant: 학교법인 포항공과대학교

Inventor： 한종훈 ,  박용민 ,  김영찬 ,  심봉주

IPC: B29C65/64

CPC classification number: B81C1/00111 ,  B29C66/74281 ,  B29C66/74285 ,  B81B2201/051 ,  B81C99/009 ,  B82Y30/00 ,  H05K3/20 ,  H05K3/389 ,  H05K2203/016 ,  Y10S428/914 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: PURPOSE: A fine metal pattern is made stably by making an even and thin fine metal pattern on a plastic substrate. CONSTITUTION: A plastic substrate having a fine metal pattern on the surface is manufactured. The fine pattern is made by evaporating metal on the substrate. Then the fine pattern is contacted with a plastic to transfer the fine pattern to the plastic. The substrate evaporating metal is glass, silicon, micar, or quartz. The metal is gold, silver or copper. The substrate is treated with a bonding agent. The bonding agent is chrome, titanium, titanium tungsten or nickel chrome. The surface of the plastic is reinforced by physical or chemical treatment.

Abstract translation: 目的：通过在塑料基板上制作均匀且细的细金属图案，可以稳定地制作细金属图案。 构成：制造表面具有细金属图案的塑料基板。 精细图案是通过在基底上蒸发金属制成的。 然后将精细图案与塑料接触以将精细图案转印到塑料上。 基底蒸发金属是玻璃，硅，云母或石英。 金属是金，银或铜。 用粘合剂处理基材。 粘结剂是铬，钛，钛钨或镍铬。 通过物理或化学处理来增强塑料表面。

公开(公告)号：KR1020030006848A

公开(公告)日：2003-01-23

申请号：KR1020010042802

申请日：2001-07-16

Applicant: 학교법인 포항공과대학교

Inventor： 한종훈 ,  심봉주 ,  노경원 ,  박용민

IPC: G01N35/00

CPC classification number: B01L9/527 ,  B01F5/0646 ,  B01F5/0647 ,  B01F13/0059 ,  B01F15/00935 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00828 ,  B01J2219/00831 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00862 ,  B01J2219/00871 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2200/028 ,  B01L2200/10 ,  B01L2300/0816 ,  B01L2400/0406 ,  B01L2400/0415 ,  B01L2400/0487

Abstract: PURPOSE: A bread board for microfluidic chips is provided which is freely constructed of microchannels of a microsize by connecting each independent channels having the similar concept to bread boards generally used in electronic circuit tests. CONSTITUTION: The bread board for microfluidic chips has a structure in which microchannels are arranged on a substrate in a direction with spaced apart from each other in a certain distance, each of the microchannels are independent and have a constant size, and only the end part of the microchannels is perforated to the upper part of the substrate while all other parts of the microchannels are closed, wherein both end parts of straight type channels are risen up like a pillar, perforated and laid down, or a "U" character shape in which the microchannels are roundly got into the substrate on the basis of the perforated both ends of the channels, and the independent microchannels are arranged regularly or partially irregularly as a whole.

Abstract translation: 目的：提供一种用于微流控芯片的面包板，其通过将具有相似概念的每​​个独立通道连接到通常用于电子电路测试中的面包板，由微型微通道自由地构成。 构成：用于微流控芯片的面包板具有这样的结构，其中微通道在一定距离上彼此间隔开的方向上布置在基板上，每个微通道是独立的并且具有恒定的尺寸，并且只有端部 的微通道穿孔到基板的上部，而微通道的所有其它部分都是封闭的，其中直型通道的两个端部如柱子，穿孔和放下或“U”字形形状升高 基于通道的穿孔两端将微通道圆形地进入基板，并且独立的微通道整体上规则地或部分地不规则地排列。