公开(公告)号：KR1020020032766A

公开(公告)日：2002-05-04

申请号：KR1020000063402

申请日：2000-10-27

Applicant: 한국과학기술연구원

Inventor： 유범재 ,  오상록 ,  권인소 ,  이두현

IPC: G01N21/00

CPC classification number: H04N13/218 ,  H04N13/246 ,  H04N13/254

Abstract: PURPOSE: A three-dimensional visual inspection method and apparatus is provided to reduce cost by permitting three-dimensional visual inspection through the use of a single camera without using a special light source. CONSTITUTION: An apparatus comprises an illumination unit(16) disposed above a package element(18) to be inspected; an optical system(14) disposed above the illumination unit, and which divides the optical path of the package element into two paths when the light emitted from the package element is passed; a camera(12) disposed onto the optical system, and which reads in the stereo image obtained while passing through the optical system; and an image process system(10) for performing a three-dimensional visual inspection by image processing the stereo image signal read through the camera. A method comprises a first step of performing a camera calibration so as to obtain inner parameters for camera and optical system; a second step of reading in the stereo image obtain by the formation at two points onto an image plane; a third step of extracting matched characteristics from left and right images; a fourth step of calculating disparity between two points; a fifth step of extracting the distance between matched points and three-dimensional coordinates ; a sixth step of estimating plane in the space by using the three-dimensional information extracted through first to fifth steps; and a seventh step of performing a planarity test by analyzing relative distribution of each characteristic points.

Abstract translation: 目的：提供三维目视检查方法和装置，通过使用单个相机进行三维目视检查而不使用特殊光源来降低成本。 构成：装置包括设置在要检查的封装元件（18）上方的照明单元（16）; 设置在所述照明单元上方的光学系统（14），并且当从所述封装元件发射的光通过时，将所述封装元件的光路分成两个路径; 设置在光学系统上的相机（12），并且读取通过光学系统时获得的立体图像; 以及图像处理系统（10），用于通过对通过相机读取的立体图像信号进行图像处理来执行三维目视检查。 一种方法包括执行相机校准以获得相机和光学系统的内部参数的第一步骤; 通过在两个点上形成图像平面获得的立体图像中的第二步骤; 从左图像和右图像中提取匹配特征的第三步骤; 计算两点之间的差距的第四步; 提取匹配点和三维坐标之间的距离的第五步骤; 通过使用通过第一至第五步骤提取的三维信息来估计空间中的平面的第六步骤; 以及通过分析每个特征点的相对分布来执行平面度测试的第七步骤。

公开(公告)号：KR100378988B1

公开(公告)日：2003-04-08

申请号：KR1020000063402

申请日：2000-10-27

Applicant: 한국과학기술연구원

Inventor： 유범재 ,  오상록 ,  권인소 ,  이두현

IPC: G01N21/00

CPC classification number: H04N13/218 ,  H04N13/246 ,  H04N13/254

Abstract: The present invention relates to a three-dimensional visual inspection method of semiconductor packages and apparatus using single camera, which is able to carry out a three-dimensional visual inspection of small-size, high-density semiconductor packages having a large-scale of integration by using a single camera. The present invention presents an optical system that can obtain a stereo image to extract distance information by using an LED light and a single camera, and it also presents a three-dimensional measurement/inspection method using the same.

Abstract translation: 本发明涉及使用单个照相机的半导体封装和设备的三维视觉检查方法，其能够对具有大规模集成的小尺寸，高密度半导体封装进行三维视觉检查 通过使用一台照相机。 本发明提出了一种光学系统，其能够获得立体图像以通过使用LED灯和单个照相机来提取距离信息，并且还提出了一种使用该光学系统的三维测量/检查方法。