公开(公告)号：KR1020000002698A

公开(公告)日：2000-01-15

申请号：KR1019980023561

申请日：1998-06-23

Applicant: 한국과학기술연구원

Inventor： 이광렬 ,  이흥재 ,  이춘흥 ,  곽재성

IPC: C23C14/06 ,  C23C14/35

CPC classification number: C23C14/0611 ,  C23C14/35 ,  C23C14/58 ,  H01L21/566

Abstract: PURPOSE: The semiconductor packaging mold is provided which has mold release properties, abrasion resistance and corrosion resistance. CONSTITUTION: The semiconductor packaging mold is dry-washed and formed a mixed layer supplying a hydrocarbon on the board of the mold, followed by formation of diamond type carbon film. A synthetic apparatus(1) comprises a synthetic chamber(2), a vacuum gauge(3), a gas supplying gauge(4), a power supplying gauge(5) and a magnetron sputter gun(6). The mold is dry-washed using argon ion, and the mixed layer is formed between the board and the diamond film.

Abstract translation: 目的：提供具有脱模性，耐磨性和耐腐蚀性的半导体封装模具。 构成：对半导体封装模具进行干洗，形成在模具板上供给碳氢化合物的混合层，然后形成金刚石型碳膜。 合成装置（1）包括合成室（2），真空计（3），气体供给量规（4），供电量规（5）和磁控溅射枪（6）。 使用氩离子对模具进行干洗，并且在板和金刚石膜之间形成混合层。