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公开(公告)号：KR1020140104124A
公开(公告)日：2014-08-28
申请号：KR1020130017867
申请日：2013-02-20
Applicant: 한국기계연구원
CPC classification number: H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L21/02282 , H01L21/48 , H01L21/56
Abstract: The present invention relates to a wafer level molding apparatus and a wafer level molding method. More particularly, the present invention relates to a wafer level molding apparatus, which easily realizes a thin molding by molding a semiconductor chip attached onto a wafer by a molding compound which is diffused by a spin coating method in the wafer level molding process of a wafer level semiconductor package manufacturing process, and a wafer level molding method.
Abstract translation: 本发明涉及一种晶片级成型装置和晶片级成型方法。 更具体地，本发明涉及一种晶片级成型装置，其通过在晶片的晶片级成型工艺中通过旋涂法扩散的模塑料来模制附着在晶片上的半导体芯片，从而容易地实现薄的成型 级半导体封装制造工艺和晶片级成型方法。
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公开(公告)号：KR101378782B1
公开(公告)日：2014-03-28
申请号：KR1020120090450
申请日：2012-08-20
Applicant: 한국기계연구원
IPC: G01R31/26 , H01L21/677 , B65G47/91 , B25J15/06
Abstract: 본 발명은 반도체 칩들이 복수열의 수납칸들에 각각 수납된 반도체칩 트레이로부터 한 열의 반도체 칩들을 흡착하여 픽업하기 위한 반도체칩 픽킹장치에 관한 것으로서, 반도체 칩의 개수 및 피치에 따라 진공 헤드에 결합되는 흡착 툴만을 교체하여 사용함으로서, 피커의 간격을 조절할 필요가 없고 반도체 칩의 종류에 따른 장치의 타입 교체를 신속하고 용이하게 할 수 있는 반도체칩 픽킹장치에 관한 것이다.
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公开(公告)号：KR101453953B1
公开(公告)日：2014-10-22
申请号：KR1020130015323
申请日：2013-02-13
Applicant: 한국기계연구원
Abstract: 본 발명은 상측에 분말이 저장되는 분말 수용부가 형성되고, 상기 분말 수용부의 하측에 연결되어 분말이 배출되는 배출 관로가 형성되며 다공성 재질로 형성되는 분말공급블록 및 상기 분말공급블록의 외측에 결합되는 하우징을 포함하여 이루어지며, 상기 분말공급블록의 외주면과 상기 하우징의 내주면 사이에 공간부가 형성되고, 상기 공간부에 연결되어 상기 하우징을 관통하도록 압축공기 주입구가 형성되어 분말에 압축공기를 주입하면서 미세진동 또는 작은 충격을 가함으로써, 입자의 크기가 작은 미량의 분말을 정밀하게 조절하여 공급할 수 있는 분말정량 공급제어장치에 관한 것이다.
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公开(公告)号：KR1020140013812A
公开(公告)日：2014-02-05
申请号：KR1020120082385
申请日：2012-07-27
Applicant: 한국기계연구원
CPC classification number: H01L21/67017 , B05B7/14 , H01L33/00
Abstract: The present invention relates to an automated powder feeding apparatus which collects and sprays a predetermined amount of powder and more specifically, to a powder feeding apparatus comprising a rotation unit on the outside of a fixed control unit, a porous filter combined to the inner circumference of the rotation unit, a plurality of powder absorption unit formed on the outer circumference of the rotation unit. The powder is easily collected by the vacuum absorption force of the powder absorption unit on one side, and the powder is easily discharged on the other side by an expulsive power of the compressed air.
Abstract translation: 本发明涉及一种自动送粉装置，其收集和喷射预定量的粉末，更具体地涉及包括在固定控制单元的外侧上的旋转单元的粉末输送装置， 旋转单元，形成在旋转单元的外周上的多个粉末吸收单元。 通过粉末吸收单元的一侧的真空吸附力容易地收集粉末，并且通过压缩空气的排出力容易地在另一侧排出粉末。
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公开(公告)号：KR1020140101994A
公开(公告)日：2014-08-21
申请号：KR1020130015323
申请日：2013-02-13
Applicant: 한국기계연구원
Abstract: The present invention relates to a quantitative powder supplying control device comprising: a powder supply block which is made of a porous material and has a powder container storing power on the upper portion thereof and a discharge pipe conduit arranged to the lower portion of the powder container and discharges powder; and a housing coupled to the outside of the powder supply block. A space is formed between the outer peripheral surface of the powder supply block and the inner peripheral surface of the housing, and a compressed air inlet port is connected to the space and passes through the housing. Thus, a small amount of powder having a small particle size can be precisely adjusted and supplied because the compressed air inlet port injects the compressed air to the powder and applies minute vibration and a small shock.
Abstract translation: 定量粉末供给控制装置技术领域本发明涉及一种定量粉末供给控制装置，其特征在于，包括：粉末供给块，其由多孔材料制成，并且具有在其上部保持动力的粉末容器;以及排出管道，其配置在所述粉末容器的下部 并排出粉末; 以及联接到粉末供应块的外部的壳体。 在粉末供给块的外周面与壳体的内周面之间形成有空间，压缩空气吸入口与该空间连接并通过壳体。 因此，由于压缩空气入口将压缩空气喷射到粉末中并且施加微小的振动和小的冲击，所以可以精确地调节和供应少量的具有小粒径的粉末。
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Patent Agency Ranking
公开(公告)号：KR101422092B1
公开(公告)日：2014-07-23
申请号：KR1020130019178
申请日：2013-02-22
Applicant: 한국기계연구원
CPC classification number: B26F1/16 , B23B39/16 , B26F2210/00 , B60R19/02
Abstract: The present invention relates to a bumper punching machine and a bumper punching method using the same and, more specifically, to a bumper punching machine which is formed to automatically control the location of a spindle equipped with a drill to be matched with the locations of a bumper through holes of different vehicles from each other, to drastically improve the work speed and reduce the production costs thereby, and to a bumper punching method using the same.
Abstract translation: 本发明涉及一种保险杠冲孔机和使用该保险杠冲孔机的保险杠冲孔方法，更具体地说，涉及一种保险杠冲孔机，其形成为自动控制配备有钻头的主轴的位置以与 保险杠穿过不同车辆的孔，从而显着提高作业速度并降低生产成本，并且使用该保险杠冲压方法。
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公开(公告)号：KR101398110B1
公开(公告)日：2014-05-27
申请号：KR1020120082385
申请日：2012-07-27
Applicant: 한국기계연구원
Abstract: 본 발명은 분말을 정량씩 포집하고 분사하는 자동화된 분말공급장치에 관한 것으로, 보다 상세하게는 고정된 제어부의 외측에서 회전부가 회전되도록 구성되며, 상기 회전부의 내주면에 다공질필터가 결합되고 회전부의 외주면에 형성된 다수개의 분말흡착구를 통해 일측에서 진공 흡입력을 이용하여 분말의 사용량을 간편하게 정량씩 포집하고, 타측에서는 압축공기의 배출력을 이용하여 포집된 분말을 간편하게 배출하는 과정을 연속적으로 수행할 수 있는 분말공급장치에 관한 것이다.
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公开(公告)号：KR1020140024515A
公开(公告)日：2014-03-03
申请号：KR1020120090450
申请日：2012-08-20
Applicant: 한국기계연구원
IPC: G01R31/26 , H01L21/677 , B65G47/91 , B25J15/06
CPC classification number: H01L21/67144 , G01R31/2603 , H01L21/67721 , H01L21/67754 , H01L21/6838
Abstract: The present invention relates to a picking device of semiconductor chips for picking up the semiconductor chips by adsorbing a row of the semiconductor chips from semiconductor chip trays in which the semiconductor chips are respectively stored to compartments of a plurality of rows. The picking device of semiconductor chips does not need to adjust the distance between pickers and is able to replace the type of the device that is appropriate for a kind of a semiconductor chip quickly and easily, by replacing only an adsorption tool which is coupled to a vacuum head according to the number of the semiconductor chips and a pitch.
Abstract translation: 本发明涉及一种半导体芯片拾取装置，用于通过从其半导体芯片分别存储到多行隔间的半导体芯片托盘吸附一排半导体芯片来拾取半导体芯片。 半导体芯片的拾取装置不需要调整拾取器之间的距离，并且能够通过仅替换耦合到半导体芯片的吸附工具来快速且容易地代替适合于一种半导体芯片的装置的类型 真空头根据半导体芯片的数量和间距。
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公开(公告)号：KR101332312B1
公开(公告)日：2013-11-22
申请号：KR1020120114569
申请日：2012-10-16
Applicant: 한국기계연구원
IPC: H01L21/56
Abstract: The present invention includes a powder container that accommodates powder and has a gate for discharging the powder and a shutter that is combined with the gate and opens and closes the gate. The width of one side of the gate is wider the width of the other side of the gate or the width of the gate gradually increases from one side to the other side. The width of the gate gradually decreases from the other side to one side according to the movement of the shutter. Therefore, the powder is quickly supplied and a small amount of the powder is accurately controlled to supply.
Abstract translation: 本发明包括容纳粉末并具有用于排出粉末的门的粉末容器和与门组合并且打开和关闭门的快门。 栅极一侧的宽度为栅极另一侧的宽度，门的宽度从一侧逐渐增大到另一侧。 根据活门的移动，门的宽度从另一侧逐渐减小到一侧。 因此，粉末被快速供给，并且少量的粉末被精确地控制供应。
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公开(公告)号：KR101436932B1
公开(公告)日：2014-09-03
申请号：KR1020130165669
申请日：2013-12-27
Applicant: 한국기계연구원
CPC classification number: G03B43/00 , G01M11/02 , G02B7/09 , G03B13/36 , H04N5/23212
Abstract: The present invention relates to a fault diagnosis device and a fault diagnosis method of an automatic focusing module and, more specifically, to a fault diagnosis device and a fault diagnosis method of an automatic focusing module which can test driving performance in accordance with the change in current, determine a failure through the analysis of natural frequency characteristics, and determine failure causes such as contamination failure and poor bonding failure.
Abstract translation: 本发明涉及一种自动聚焦模块的故障诊断装置和故障诊断方法，更具体地说，涉及一种自动对焦模块的故障诊断装置和故障诊断方法，该自动对焦模块可以根据变化来测试驾驶性能 通过分析固有频率特性确定故障，并确定故障原因，如污染故障和不良接合故障。
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